Abstract: A polishing pad surface property measuring method which can measure surface properties of a polishing pad that reflect CMP performance by applying a laser beam to the polishing pad at a plurality of incident angles is disclosed. The method includes applying a laser beam to a surface of the polishing pad, and receiving light reflected by the surface of the polishing pad and performing Fourier transform on the received light to determine surface properties of the polishing pad. The laser beam is applied to the polishing pad at a plurality of incident angles.

Abstract: The present invention relates to an apparatus for measuring surface properties of a polishing pad which measures surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer. The apparatus for measuring surface properties of a polishing pad includes a laser beam source configured to emit a laser beam, and a photodetector configured to detect scattered light that is reflected and scattered by the polishing pad, an optical Fourier transform being performed on the detected scattered light to produce an intensity distribution corresponding to a spatial wavelength spectrum based on surface topography of the polishing pad. The laser beam is applied to the polishing pad at such an incident angle that the laser beam does not reach a bottom portion of a pore formed in the surface of the polishing pad.

Abstract: A polishing pad surface property measuring method which can measure surface properties of a polishing pad that reflect CMP performance by applying a laser beam to the polishing pad at a plurality of incident angles is disclosed. The method includes applying a laser beam to a surface of the polishing pad, and receiving light reflected by the surface of the polishing pad and performing Fourier transform on the received light to determine surface properties of the polishing pad. The laser beam is applied to the polishing pad at a plurality of incident angles.

Abstract: The present invention relates to a method of measuring surface properties of a polishing pad which measures surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer. The method of measuring surface properties of a polishing pad includes applying a laser beam to the polishing pad, detecting scattered light that is reflected and scattered by the polishing pad with a photodetector and performing an optical Fourier transform on the detected scattered light to produce an intensity distribution corresponding to a spatial wavelength spectrum based on surface topography of the polishing pad, and calculating a numerical value representing surface properties of the polishing pad based on the intensity distribution corresponding to two different prescribed spatial wavelength ranges.

Abstract: The present invention relates to an apparatus for measuring surface properties of a polishing pad which measures surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer. The apparatus for measuring surface properties of a polishing pad includes a laser beam source configured to emit a laser beam, and a photodetector configured to detect scattered light that is reflected and scattered by the polishing pad, an optical Fourier transform being performed on the detected scattered light to produce an intensity distribution corresponding to a spatial wavelength spectrum based on surface topography of the polishing pad. The laser beam is applied to the polishing pad at such an incident angle that the laser beam does not reach a bottom portion of a pore formed in the surface of the polishing pad.

Abstract: The present invention relates to a method of measuring surface properties of a polishing pad which measures surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer. The method of measuring surface properties of a polishing pad includes applying a laser beam to the polishing pad, detecting scattered light that is reflected and scattered by the polishing pad with a photodetector and performing an optical Fourier transform on the detected scattered light to produce an intensity distribution corresponding to a spatial wavelength spectrum based on surface topography of the polishing pad, and calculating a numerical value representing surface properties of the polishing pad based on the intensity distribution corresponding to two different prescribed spatial wavelength ranges.

Abstract: The present invention is to generate a pulsed laser beam having a width greater than the gap between a rotating tool and a workpiece opposed thereto, and then irradiate the gap with the generated laser beam while the optical axis thereof is tilted relative to a workpiece plane. The pulsed laser beam has one lased-pulse period per one revolution or an integer number of revolutions of the rotating tool and is directed in the same angle range relative to the rotating tool within the ON durations of the lased pulse. The light which has irradiated the gap and has not been interrupted but diffracted by the gap is detected on a light-receiving sensor to measure the length of the gap.

Abstract: A method of manufacturing a polishing pad mold for a polishing pad including a micro pattern ? having micro protrusions arranged therein includes steps of manufacturing a mother mold where a mother mold including a substrate, on one side of which a micro pattern ? having an inverted protrusion-depression shape with respect to the micro pattern ? is formed, is manufactured, manufacturing a positive daughter mold where a positive daughter mold having a micro pattern ? formed on a surface is manufactured by the mold, and manufacturing a negative daughter mold where a negative daughter mold having a micro pattern ? formed on a surface is manufactured by the mold, and an assembly step where the mold is configured by arranging and fixing the molds on a basis with the surfaces having the micro pattern ? faced up. Thereby, highly precise and efficient planarization is provided.

Abstract: The present invention is to generate a pulsed laser beam having a width greater than the gap between a rotating tool and a workpiece opposed thereto, and then irradiate the gap with the generated laser beam while the optical axis thereof is tilted relative to a workpiece plane. The pulsed laser beam has one lased-pulse period per one revolution or an integer number of revolutions of the rotating tool and is directed in the same angle range relative to the rotating tool within the ON durations of the lased pulse. The light which has irradiated the gap and has not been interrupted but diffracted by the gap is detected on a light-receiving sensor to measure the length of the gap.