Abstract: The present disclosure is applicable to the field of LED packaging technology and provides an LED light-emitting device and a method for manufacturing the same. The LED light-emitting device comprises a support, an LED chip, and an encapsulant layer. The support comprises a substrate and a dam part. The substrate has opposite front and back surfaces, and the dam part has opposite bottom and top surfaces. The LED chip and the bottom surface of the dam part are disposed on the front surface of the substrate. The dam part surrounds the LED chip, forming a chip mounting area for installing the LED chip and carrying the encapsulant layer. The encapsulant layer is encapsulated above the LED chip. The dam part and the encapsulant layer are transparent or translucent, and the top of the encapsulant layer is provided with transparent or translucent hollow particles.

Abstract: This application relates to a light-emitting device and a manufacturing method thereof, comprising a substrate, a plurality of light-emitting chips arranged on the front side of the substrate, and an encapsulation layer disposed on the substrate to cover each light-emitting chip. The encapsulation layer allows light emitted by the LED chips to pass through.