Patents by Inventor Pang-Hung Liao

Pang-Hung Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190301813
    Abstract: A sleeve-type heat conducting structure includes a heat conducting device (1), a sleeve (2), and a heat pipe (3). The heat conducting device (1) has a working portion (10) and a sleeve-connecting portion (11); a fitting hole (110) is disposed in the sleeve-connecting portion (11) such that the sleeve (2) is fastened in the fitting hole (110). The heat pipe (3) has an end disposed movably in the sleeve (2) and the other end exposed out of the sleeve (2) in which the end of the heat pipe (3) sleeved into the sleeve (2) can slide axially in the sleeve (2) and the heat pipe (3) can rotate with respect to the heat conducting device (1) through the sleeve (2).
    Type: Application
    Filed: March 15, 2019
    Publication date: October 3, 2019
    Inventors: Pang-Hung LIAO, Kuo-Feng TSENG, Wen-Hsiung JIANG
  • Patent number: 9726436
    Abstract: A vapor chamber having no gas discharging protrusion includes: a lower shell member, formed with an upper surface divided into an inner zone and an outer zone and an outer peripheral wall formed with a planar surface, the inner zone is formed with capillary channels, the outer zone is formed with a recess, and one thereof is communicated with at least one of the capillary channels and the other end thereof penetrates the planar surface; and an upper shell member, engaged with the upper surface and sealed with the lower shell member, and a gas discharging hole is formed between the recess and the upper shell member. Accordingly, a conventional gas discharging protrusion is not required on the vapor chamber thereby advantages of small and thin in volume and compact in structure being provided.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: August 8, 2017
    Assignee: CHAUN-CHOUNG TECHNOLOGY CORP.
    Inventors: Shih-Ming Wang, Pang-Hung Liao, Cheng-Tu Wang
  • Publication number: 20170023307
    Abstract: A vapor chamber having no gas discharging protrusion includes: a lower shell member, formed with an upper surface divided into an inner zone and an outer zone and an outer peripheral wall formed with a planar surface, the inner zone is formed with capillary channels, the outer zone is formed with a recess, and one thereof is communicated with at least one of the capillary channels and the other end thereof penetrates the planar surface; and an upper shell member, engaged with the upper surface and sealed with the lower shell member, and a gas discharging hole is formed between the recess and the upper shell member. Accordingly, a conventional gas discharging protrusion is not required on the vapor chamber thereby advantages of small and thin in volume and compact in structure being provided.
    Type: Application
    Filed: July 21, 2015
    Publication date: January 26, 2017
    Inventors: SHIH-MING WANG, Pang-Hung LIAO, Cheng-Tu WANG
  • Publication number: 20170010048
    Abstract: A thin vapor chamber includes a heat conducting plate having an upper surface, a metal cover sealed and covering on the heat conducting plate, and a wick structure disposed between the heat conducting plate and the metal cover. A plurality of hollow supports are formed on the metal cover by pressing and face the heat conducting plate. The wick structure is provided with plural throughholes. The hollow supports are individually disposed through the corresponding throughholes and attached to the upper surface. Thus, the heat of the heat conducting plate is transferred to the metal cover through the hollow supports. Besides, the metal cover is pressed to have an uneven shape to increase heat-dissipating area and structural strength, which achieves excellent heat transfer efficiency and heat diffusion of the thin vapor chamber.
    Type: Application
    Filed: July 9, 2015
    Publication date: January 12, 2017
    Inventors: SHIH-MING WANG, Pang-Hung LIAO, Cheng-Tu WANG
  • Patent number: 9488418
    Abstract: A heat plate sealing method and structure thereof includes a) providing a bottom plate and a cover plate engaging with each other; b) providing a welding frame; c) disposing the welding frame between the bottom plate and the cover plate; d) placing solder on the welding frame; e) sandwiching the welding frame having the solder thereon between the bottom plate and the cover plate; and f) conducting thermal melting on the solder to seal the bottom plate and the cover plate. Therefore, a sealing structure is strengthened and the airtightness during a sealing process is enhanced.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: November 8, 2016
    Assignee: CHAUN-CHOUNG TECHNOLOGY CORP.
    Inventors: Shih-Ming Wang, Pang-Hung Liao, Cheng-Tu Wang
  • Patent number: 9481056
    Abstract: A method of making a lightweight heat pipe includes steps of: a) preparing a first hollow pipe and a second hollow pipe making of two different materials; b) disposing the first hollow pipe into the second hollow pipe along an axial direction of the second hollow pipe; c) making an inner wall surface of the second hollow pipe attached on an outer wall surface of the first hollow pipe to combine the first and the second hollow pipes as a pipe body of the heat pipe; and d) vacuuming an inner space of the first hollow pipe, and sealing the pipe body after working fluid is filled in the inner space of the first hollow pipe to finish the heat pipe.
    Type: Grant
    Filed: April 14, 2014
    Date of Patent: November 1, 2016
    Assignee: CHAUN-CHOUNG TECHNOLOGY CORP.
    Inventors: Cheng-Tu Wang, Pang-Hung Liao
  • Publication number: 20160209122
    Abstract: A slim-type vapor chamber and a capillary structure thereof are provided, including an upper board and a lower board. The upper and lower boards respectively include a metal plate. Trenches are formed on one side surface of the metal plate. The upper board and the lower board overlap each other to make the corresponding side surfaces of the two metal plates contact each other. The trenches of the two metal plates are correspondingly disposed to form passages. The trenches of one of the metal plates are staggered from the trenches of the other metal plate by an offset distance to form staggered passages. Therefore, the capillary force during reverse flow of a working fluid is enhanced, the contact area between the vapor and the passage is increased, and the heat transfer efficiency of the vapor chamber is improved.
    Type: Application
    Filed: January 20, 2015
    Publication date: July 21, 2016
    Inventors: Cheng-Tu WANG, Pang-Hung LIAO
  • Publication number: 20160010926
    Abstract: A heat plate sealing method and structure thereof includes a) providing a bottom plate and a cover plate engaging with each other; b) providing a welding frame; c) disposing the welding frame between the bottom plate and the cover plate; d) placing solder on the welding frame; e) sandwiching the welding frame having the solder thereon between the bottom plate and the cover plate; and f) conducting thermal melting on the solder to seal the bottom plate and the cover plate. Therefore, a sealing structure is strengthened and the airtightness during a sealing process is enhanced.
    Type: Application
    Filed: July 8, 2014
    Publication date: January 14, 2016
    Inventors: SHIH-MING WANG, Pang-Hung LIAO, Cheng-Tu WANG
  • Patent number: 8919427
    Abstract: A heat pipe includes a metal tube, a heat-absorption part, a capillary and working fluid. The metal tube has a chamber formed therein. A vapor channel and a liquid channel communicating with the vapor channel are formed in the chamber. The heat-absorption part corresponds to a portion of the vapor channel and the liquid channel. The capillary is arranged in the vapor channel and in the liquid channel of the heat-absorption part. The working fluid fills the chamber.
    Type: Grant
    Filed: April 21, 2008
    Date of Patent: December 30, 2014
    Assignee: Chaun-Choung Technology Corp.
    Inventors: Cheng-Tu Wang, Pang-Hung Liao, Kuo-Feng Tseng, Wen-Tsai Chang
  • Publication number: 20140230248
    Abstract: A method of making a lightweight heat pipe includes steps of: a) preparing a first hollow pipe and a second hollow pipe making of two different materials; b) disposing the first hollow pipe into the second hollow pipe along an axial direction of the second hollow pipe; c) making an inner wall surface of the second hollow pipe attached on an outer wall surface of the first hollow pipe to combine the first and the second hollow pipes as a pipe body of the heat pipe; and d) vacuuming an inner space of the first hollow pipe, and sealing the pipe body after working fluid is filled in the inner space of the first hollow pipe to finish the heat pipe.
    Type: Application
    Filed: April 14, 2014
    Publication date: August 21, 2014
    Applicant: CHAUN-CHOUNG TECHNOLOGY CORP.
    Inventors: Cheng-Tu WANG, Pang-Hung LIAO
  • Publication number: 20140190358
    Abstract: A flatware item for thermally melting a food product includes a metal body (10), a low-temperature-evaporable circulation fluid (20), and a reflux medium (30). The metal body (10) has a vacuum chamber (100), a hand holding portion (11), and a food contacting portion (12). The circulation fluid (20) is filled in the vacuum chamber (100), whereby the circulation fluid (20) absorbs external energy through the hand holding portion (11) and vaporizes, and the vaporized circulation fluid (20) flows to the food contacting portion (12). The reflux medium (30) is spread on the inner wall of the vacuum chamber (100).
    Type: Application
    Filed: January 10, 2013
    Publication date: July 10, 2014
    Applicant: CHAUN-CHOUNG TECHNOLOGY CORP.
    Inventors: Cheng-Tu WANG, Pang-Hung LIAO
  • Publication number: 20130043004
    Abstract: In a lightweight heat pipe and a method for making the lightweight heat pipe, a first hollow pipe and a second hollow pipe making of two different materials are provided. The first hollow pipe is disposed into the second hollow pipe along an axial direction of the second hollow pipe. An inner wall surface of the second hollow pipe is attached on an outer wall surface of the first hollow pipe to combine the first and the second hollow pipes as a pipe body of the heat pipe. An inner space of the first hollow pipe is then vacuumed, and the pipe body is sealed after the working fluid is filled in the inner space of the first hollow pipe to finish the heat pipe.
    Type: Application
    Filed: October 19, 2011
    Publication date: February 21, 2013
    Inventors: Cheng-Tu WANG, Pang-Hung Liao
  • Publication number: 20090308576
    Abstract: A heat pipe with a dual capillary structure includes a metal tube, a first capillary, a second capillary and a working fluid. The metal tube forms a chamber and a heat-absorption part. The first capillary is formed by sintering a metal powder, and its corresponding heat-absorption part is disposed in the chamber and the second capillary is contained in the chamber and connected to an end of the first capillary. The second capillary includes an internal tube, a capillary tissue installed between inner walls of the internal tube and the metal tube, and a working fluid filled into the chamber. The invention further provides a method of manufacturing the heat pipe with a dual capillary structure.
    Type: Application
    Filed: June 17, 2008
    Publication date: December 17, 2009
    Inventors: Cheng-Tu WANG, Pang-Hung Liao, Kuo-Feng Tseng, Chuan-Yu Lee
  • Publication number: 20090260793
    Abstract: A heat pipe includes a metal tube, a heat-absorption part, a capillary and working fluid. The metal tube has a chamber formed therein. A vapor channel and a liquid channel communicated with the vapor channel are formed in the chamber. The heat-absorption part is formed on the metal tube and corresponds to a portion of the vapor channel and the liquid channel. The capillary is arranged in the vapor channel and the liquid channel of the heat-absorption part. The working fluid is filled in the chamber.
    Type: Application
    Filed: April 21, 2008
    Publication date: October 22, 2009
    Inventors: Cheng-Tu WANG, Pang-Hung LIAO, Kuo-Feng TSENG, Wen-Tsai CHANG
  • Publication number: 20090260785
    Abstract: In a heat plate having a hollow plate and capillary supporting structures, the plate body includes a capillary tissue attached on an internal wall of the plate body, and each of the capillary supporting structures is erected, supported and distributed in the plate body. Each capillary supporting structure is in a cylindrical shape and has a capillary object made of sintered powder and disposed on the circumferential surface of the cylindrical capillary supporting structure and contacted with the capillary tissue to form a continuous capillary channel and provide a capillary action to the capillary supporting structures in the heat plate.
    Type: Application
    Filed: April 17, 2008
    Publication date: October 22, 2009
    Inventors: Cheng-Tu Wang, Pang-Hung Liao
  • Publication number: 20090260790
    Abstract: In metal tubes for heat pipes and a method of manufacturing the metal tubes, a metal tube includes a tube defining an inner space, and at least one dividing portion extruding from an inner sidewall of the metal tube. The at least one dividing portion divides the inner space into a vapor channel and a liquid channel connected to the vapor channel. The metal tubes can prevent heat pipe form being dried out and improve heat dissipation efficiency of heat pipes.
    Type: Application
    Filed: April 21, 2008
    Publication date: October 22, 2009
    Inventors: Cheng-Tu WANG, Pang-Hung LIAO, Kuo-Feng TSENG
  • Publication number: 20090109620
    Abstract: A heat-dissipating device of a portable electronic apparatus includes a heat-conducting plate disposed on a heat-generating element. One end of a heat-conducting pipe is disposed on the heat-conducting plate, and the other end of the heat-conducting pipe is disposed on a surface of a power generator to form a high-temperature source. The opposite surface of the power generator is fixedly disposed on a heat-dissipating body to form a low-temperature source. A heat-dissipating fan is provided on one side of the heat-dissipating body. The positive and negative lines of the heat-dissipating fan are electrically connected to the positive and negative lines of the power generator.
    Type: Application
    Filed: October 31, 2007
    Publication date: April 30, 2009
    Inventors: Cheng-Tu WANG, Pang-Hung Liao, Kuan-Ming Lai
  • Publication number: 20090095460
    Abstract: A capillary structure includes a bare core shown as a long rod shape; and a capillary layer wound around the bare core and covered a surrounding thereof. The capillary layer is constructed by strands that are woven in a plurality of directions (i.e. curly interwoven) and continuously wound around an outer surrounding of the bare core. In the meantime, each woven strands is a strand bundled from a weaving material.
    Type: Application
    Filed: October 11, 2007
    Publication date: April 16, 2009
    Inventors: Cheng-Tu WANG, Pang-Hung Liao, Kuo-Feng Tseng