Patents by Inventor Pang-Hung Liao
Pang-Hung Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250098118Abstract: An evaporating concave-convex platform structure of a vapor chamber and a manufacturing method thereof, the structure include a lower plate and an upper plate. The lower plate includes a main plate member and a concave-convex member. The main plate member has a chamber portion dented from one surface thereof and a frame edge surrounding a periphery of the chamber portion. The upper plate is stacked on the lower plate facing a dented surface of the chamber portion. The concave-convex member has a concave-convex surface disposed protrusively from the chamber portion of the lower plate or disposed concavely toward the chamber portion. A connecting portion is disposed to surrounds a periphery of the concave-convex surface. The connecting portion is stacked on the main plate member through the concave-convex surface. The connecting portion is welded to the main plate member.Type: ApplicationFiled: December 4, 2024Publication date: March 20, 2025Inventors: Pang-Hung LIAO, Chih-Wei CHEN
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Publication number: 20250081387Abstract: A liquid-cooling heat dissipation device includes a substrate, a fin assembly, a shell and a shunt component. The fin assembly is disposed on the substrate and has a plurality of channels parallelly arranged, and each of the channels has an inlet and an outlet opposite to each other. The shell is disposed on the substrate and has a liquid input port, a chamber is jointly formed by the shell and the substrate, and the chamber is located between the liquid input port and each of the inlets. The shunt component is disposed in the shell and has a plurality of manifold passages, the liquid input port is in communication with the chamber and each of the inlets through each of the manifold passages. Accordingly, the amount of fin member is increased in a fixed space to increase the heat dissipating efficiency.Type: ApplicationFiled: September 5, 2023Publication date: March 6, 2025Inventors: Pang-Hung LIAO, Chih-Wei CHEN, Shih-Ming WANG
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Publication number: 20250075989Abstract: A liquid-cooling heat sink includes a substrate, a fin assembly, and a housing. The substrate has a longitudinal direction. The fin assembly is arranged on the substrate and includes multiple fins arranged at interval to form flow channels along the longitudinal direction. Each flow channel includes an inlet and an outlet opposite to each other. A turbulence structure divides a cross-section of at least one of the flow channels into at least two diverging passages. The housing arranged on the substrate covers the inlets and includes an inlet port and a chamber. Accordingly, the number of fins may be increased in a fixed space, and each flow channel has a smaller cross-sectional area to increase flow velocity of a dielectric liquid. Moreover, this reduces the flow resistance of the dielectric liquid in a turbulent flow area in each flow channel to improve the heat dissipation efficiency.Type: ApplicationFiled: August 30, 2023Publication date: March 6, 2025Inventors: Pang-Hung LIAO, Chih-Wei CHEN, Shih-Ming WANG
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Publication number: 20240151333Abstract: A connecting structure includes a vapor chamber, a heat pipe and a working fluid. The vapor chamber includes a half shell seat, a half shell cover and a first wick structure. The half shell cover is sealed with the half shell seat and a chamber is defined therebetween. The half shell cover has a through hole and an annular wall. The first wick structure is laid on an inner surface of the half shell cover and extended into the annular wall. The heat pipe includes a tube body and a second wick structure. The tube body has an opening and a flange. The heat pipe is upright connected to an outer periphery of the annular wall by the opening. The flange is closely attached to an outer surface of the half shell cover. The second wick structure contacts the first wick structure. The working fluid is disposed in the chamber.Type: ApplicationFiled: November 9, 2022Publication date: May 9, 2024Inventors: Pang-Hung LIAO, Chih-Wei CHEN
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Publication number: 20240155810Abstract: An evaporating concave-convex platform structure of a vapor chamber and a manufacturing method thereof, the structure include a lower plate and an upper plate. The lower plate includes a main plate member and a concave-convex member. The main plate member has a chamber portion dented from one surface thereof and a frame edge surrounding a periphery of the chamber portion. The upper plate is stacked on the lower plate facing a dented surface of the chamber portion. The concave-convex member has a concave-convex surface disposed protrusively from the chamber portion of the lower plate or disposed concavely toward the chamber portion. A connecting portion is disposed to surrounds a periphery of the concave-convex surface. The connecting portion is stacked on the main plate member through the concave-convex surface. The connecting portion is welded to the main plate member.Type: ApplicationFiled: November 9, 2022Publication date: May 9, 2024Inventors: Pang-Hung LIAO, Chih-Wei CHEN
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Publication number: 20190301813Abstract: A sleeve-type heat conducting structure includes a heat conducting device (1), a sleeve (2), and a heat pipe (3). The heat conducting device (1) has a working portion (10) and a sleeve-connecting portion (11); a fitting hole (110) is disposed in the sleeve-connecting portion (11) such that the sleeve (2) is fastened in the fitting hole (110). The heat pipe (3) has an end disposed movably in the sleeve (2) and the other end exposed out of the sleeve (2) in which the end of the heat pipe (3) sleeved into the sleeve (2) can slide axially in the sleeve (2) and the heat pipe (3) can rotate with respect to the heat conducting device (1) through the sleeve (2).Type: ApplicationFiled: March 15, 2019Publication date: October 3, 2019Inventors: Pang-Hung LIAO, Kuo-Feng TSENG, Wen-Hsiung JIANG
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Patent number: 9726436Abstract: A vapor chamber having no gas discharging protrusion includes: a lower shell member, formed with an upper surface divided into an inner zone and an outer zone and an outer peripheral wall formed with a planar surface, the inner zone is formed with capillary channels, the outer zone is formed with a recess, and one thereof is communicated with at least one of the capillary channels and the other end thereof penetrates the planar surface; and an upper shell member, engaged with the upper surface and sealed with the lower shell member, and a gas discharging hole is formed between the recess and the upper shell member. Accordingly, a conventional gas discharging protrusion is not required on the vapor chamber thereby advantages of small and thin in volume and compact in structure being provided.Type: GrantFiled: July 21, 2015Date of Patent: August 8, 2017Assignee: CHAUN-CHOUNG TECHNOLOGY CORP.Inventors: Shih-Ming Wang, Pang-Hung Liao, Cheng-Tu Wang
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Publication number: 20170023307Abstract: A vapor chamber having no gas discharging protrusion includes: a lower shell member, formed with an upper surface divided into an inner zone and an outer zone and an outer peripheral wall formed with a planar surface, the inner zone is formed with capillary channels, the outer zone is formed with a recess, and one thereof is communicated with at least one of the capillary channels and the other end thereof penetrates the planar surface; and an upper shell member, engaged with the upper surface and sealed with the lower shell member, and a gas discharging hole is formed between the recess and the upper shell member. Accordingly, a conventional gas discharging protrusion is not required on the vapor chamber thereby advantages of small and thin in volume and compact in structure being provided.Type: ApplicationFiled: July 21, 2015Publication date: January 26, 2017Inventors: SHIH-MING WANG, Pang-Hung LIAO, Cheng-Tu WANG
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Publication number: 20170010048Abstract: A thin vapor chamber includes a heat conducting plate having an upper surface, a metal cover sealed and covering on the heat conducting plate, and a wick structure disposed between the heat conducting plate and the metal cover. A plurality of hollow supports are formed on the metal cover by pressing and face the heat conducting plate. The wick structure is provided with plural throughholes. The hollow supports are individually disposed through the corresponding throughholes and attached to the upper surface. Thus, the heat of the heat conducting plate is transferred to the metal cover through the hollow supports. Besides, the metal cover is pressed to have an uneven shape to increase heat-dissipating area and structural strength, which achieves excellent heat transfer efficiency and heat diffusion of the thin vapor chamber.Type: ApplicationFiled: July 9, 2015Publication date: January 12, 2017Inventors: SHIH-MING WANG, Pang-Hung LIAO, Cheng-Tu WANG
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Patent number: 9488418Abstract: A heat plate sealing method and structure thereof includes a) providing a bottom plate and a cover plate engaging with each other; b) providing a welding frame; c) disposing the welding frame between the bottom plate and the cover plate; d) placing solder on the welding frame; e) sandwiching the welding frame having the solder thereon between the bottom plate and the cover plate; and f) conducting thermal melting on the solder to seal the bottom plate and the cover plate. Therefore, a sealing structure is strengthened and the airtightness during a sealing process is enhanced.Type: GrantFiled: July 8, 2014Date of Patent: November 8, 2016Assignee: CHAUN-CHOUNG TECHNOLOGY CORP.Inventors: Shih-Ming Wang, Pang-Hung Liao, Cheng-Tu Wang
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Patent number: 9481056Abstract: A method of making a lightweight heat pipe includes steps of: a) preparing a first hollow pipe and a second hollow pipe making of two different materials; b) disposing the first hollow pipe into the second hollow pipe along an axial direction of the second hollow pipe; c) making an inner wall surface of the second hollow pipe attached on an outer wall surface of the first hollow pipe to combine the first and the second hollow pipes as a pipe body of the heat pipe; and d) vacuuming an inner space of the first hollow pipe, and sealing the pipe body after working fluid is filled in the inner space of the first hollow pipe to finish the heat pipe.Type: GrantFiled: April 14, 2014Date of Patent: November 1, 2016Assignee: CHAUN-CHOUNG TECHNOLOGY CORP.Inventors: Cheng-Tu Wang, Pang-Hung Liao
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Publication number: 20160209122Abstract: A slim-type vapor chamber and a capillary structure thereof are provided, including an upper board and a lower board. The upper and lower boards respectively include a metal plate. Trenches are formed on one side surface of the metal plate. The upper board and the lower board overlap each other to make the corresponding side surfaces of the two metal plates contact each other. The trenches of the two metal plates are correspondingly disposed to form passages. The trenches of one of the metal plates are staggered from the trenches of the other metal plate by an offset distance to form staggered passages. Therefore, the capillary force during reverse flow of a working fluid is enhanced, the contact area between the vapor and the passage is increased, and the heat transfer efficiency of the vapor chamber is improved.Type: ApplicationFiled: January 20, 2015Publication date: July 21, 2016Inventors: Cheng-Tu WANG, Pang-Hung LIAO
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Publication number: 20160010926Abstract: A heat plate sealing method and structure thereof includes a) providing a bottom plate and a cover plate engaging with each other; b) providing a welding frame; c) disposing the welding frame between the bottom plate and the cover plate; d) placing solder on the welding frame; e) sandwiching the welding frame having the solder thereon between the bottom plate and the cover plate; and f) conducting thermal melting on the solder to seal the bottom plate and the cover plate. Therefore, a sealing structure is strengthened and the airtightness during a sealing process is enhanced.Type: ApplicationFiled: July 8, 2014Publication date: January 14, 2016Inventors: SHIH-MING WANG, Pang-Hung LIAO, Cheng-Tu WANG
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Patent number: 8919427Abstract: A heat pipe includes a metal tube, a heat-absorption part, a capillary and working fluid. The metal tube has a chamber formed therein. A vapor channel and a liquid channel communicating with the vapor channel are formed in the chamber. The heat-absorption part corresponds to a portion of the vapor channel and the liquid channel. The capillary is arranged in the vapor channel and in the liquid channel of the heat-absorption part. The working fluid fills the chamber.Type: GrantFiled: April 21, 2008Date of Patent: December 30, 2014Assignee: Chaun-Choung Technology Corp.Inventors: Cheng-Tu Wang, Pang-Hung Liao, Kuo-Feng Tseng, Wen-Tsai Chang
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Publication number: 20140230248Abstract: A method of making a lightweight heat pipe includes steps of: a) preparing a first hollow pipe and a second hollow pipe making of two different materials; b) disposing the first hollow pipe into the second hollow pipe along an axial direction of the second hollow pipe; c) making an inner wall surface of the second hollow pipe attached on an outer wall surface of the first hollow pipe to combine the first and the second hollow pipes as a pipe body of the heat pipe; and d) vacuuming an inner space of the first hollow pipe, and sealing the pipe body after working fluid is filled in the inner space of the first hollow pipe to finish the heat pipe.Type: ApplicationFiled: April 14, 2014Publication date: August 21, 2014Applicant: CHAUN-CHOUNG TECHNOLOGY CORP.Inventors: Cheng-Tu WANG, Pang-Hung LIAO
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Publication number: 20140190358Abstract: A flatware item for thermally melting a food product includes a metal body (10), a low-temperature-evaporable circulation fluid (20), and a reflux medium (30). The metal body (10) has a vacuum chamber (100), a hand holding portion (11), and a food contacting portion (12). The circulation fluid (20) is filled in the vacuum chamber (100), whereby the circulation fluid (20) absorbs external energy through the hand holding portion (11) and vaporizes, and the vaporized circulation fluid (20) flows to the food contacting portion (12). The reflux medium (30) is spread on the inner wall of the vacuum chamber (100).Type: ApplicationFiled: January 10, 2013Publication date: July 10, 2014Applicant: CHAUN-CHOUNG TECHNOLOGY CORP.Inventors: Cheng-Tu WANG, Pang-Hung LIAO
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Publication number: 20130043004Abstract: In a lightweight heat pipe and a method for making the lightweight heat pipe, a first hollow pipe and a second hollow pipe making of two different materials are provided. The first hollow pipe is disposed into the second hollow pipe along an axial direction of the second hollow pipe. An inner wall surface of the second hollow pipe is attached on an outer wall surface of the first hollow pipe to combine the first and the second hollow pipes as a pipe body of the heat pipe. An inner space of the first hollow pipe is then vacuumed, and the pipe body is sealed after the working fluid is filled in the inner space of the first hollow pipe to finish the heat pipe.Type: ApplicationFiled: October 19, 2011Publication date: February 21, 2013Inventors: Cheng-Tu WANG, Pang-Hung Liao
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Publication number: 20090308576Abstract: A heat pipe with a dual capillary structure includes a metal tube, a first capillary, a second capillary and a working fluid. The metal tube forms a chamber and a heat-absorption part. The first capillary is formed by sintering a metal powder, and its corresponding heat-absorption part is disposed in the chamber and the second capillary is contained in the chamber and connected to an end of the first capillary. The second capillary includes an internal tube, a capillary tissue installed between inner walls of the internal tube and the metal tube, and a working fluid filled into the chamber. The invention further provides a method of manufacturing the heat pipe with a dual capillary structure.Type: ApplicationFiled: June 17, 2008Publication date: December 17, 2009Inventors: Cheng-Tu WANG, Pang-Hung Liao, Kuo-Feng Tseng, Chuan-Yu Lee
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Publication number: 20090260793Abstract: A heat pipe includes a metal tube, a heat-absorption part, a capillary and working fluid. The metal tube has a chamber formed therein. A vapor channel and a liquid channel communicated with the vapor channel are formed in the chamber. The heat-absorption part is formed on the metal tube and corresponds to a portion of the vapor channel and the liquid channel. The capillary is arranged in the vapor channel and the liquid channel of the heat-absorption part. The working fluid is filled in the chamber.Type: ApplicationFiled: April 21, 2008Publication date: October 22, 2009Inventors: Cheng-Tu WANG, Pang-Hung LIAO, Kuo-Feng TSENG, Wen-Tsai CHANG
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Publication number: 20090260785Abstract: In a heat plate having a hollow plate and capillary supporting structures, the plate body includes a capillary tissue attached on an internal wall of the plate body, and each of the capillary supporting structures is erected, supported and distributed in the plate body. Each capillary supporting structure is in a cylindrical shape and has a capillary object made of sintered powder and disposed on the circumferential surface of the cylindrical capillary supporting structure and contacted with the capillary tissue to form a continuous capillary channel and provide a capillary action to the capillary supporting structures in the heat plate.Type: ApplicationFiled: April 17, 2008Publication date: October 22, 2009Inventors: Cheng-Tu Wang, Pang-Hung Liao