Patents by Inventor Pang Lin

Pang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8077860
    Abstract: An accessory structure for portable electronic device includes a primary member and a resisting member. The primary member includes a seat and a supporting plate. The seat defines a recessed portion. The supporting plate includes a flexible portion allowing the seat to be bent relative to the supporting plate. The resisting member is received in the recessed portion. The resisting member is rotatably attached to the recessed portion.
    Type: Grant
    Filed: October 15, 2009
    Date of Patent: December 13, 2011
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Yi-Pang Lin
  • Publication number: 20110235950
    Abstract: A foldable bag, made of a flexible sheet or board like material having a plurality of fold lines, includes a bottom wall, two side walls respectively connected to two opposite sides of the bottom wall, and two connecting walls respectively connected with the side walls and the bottom wall to define a containing space therein. The side wall has a first fold line parallel to the bottom wall and is capable of being folded towards the center of the foldable bag. The connecting wall has two second fold lines respectively extended along the diagonal lines and intersected with each other, and a third fold line parallel to the bottom wall and extended through the intersection point of the two second lines, wherein the ends of the third fold line are connected to the respective ends of the first fold lines, wherein the second fold lines and the third fold lines are capable of being folded toward the center of the foldable bag.
    Type: Application
    Filed: March 28, 2011
    Publication date: September 29, 2011
    Inventor: CHIEN-PANG LIN
  • Patent number: 8000041
    Abstract: According to an embodiment of the present invention, a lens module is provided, which includes a first lens assembly including a first patterned substrate, a first recess formed from a first surface of the first patterned substrate, a first lens element disposed in the first recess, and a second lens element disposed on the first patterned substrate, wherein the second lens element aligns along an optical axis through the first lens element.
    Type: Grant
    Filed: September 20, 2010
    Date of Patent: August 16, 2011
    Assignees: VisEra Technologies Company Limited, OmniVision Technologies, Inc.
    Inventors: Chien-Pang Lin, San-Yuan Chung, Weng-Chu Chu
  • Publication number: 20110001221
    Abstract: A dielectric layer is provided. The dielectric layer includes a photo-sensitive polymer or a non-photo-sensitive polymer and an amorphous metal oxide disposed in the photo-sensitive polymer or a non-photo-sensitive polymer.
    Type: Application
    Filed: September 16, 2010
    Publication date: January 6, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wei-Ling Lin, Pang LIN, Tarng-Shiang Hu, Liang-Xiang Chen
  • Patent number: 7860357
    Abstract: An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
    Type: Grant
    Filed: August 9, 2008
    Date of Patent: December 28, 2010
    Assignee: VisEra Technologies Company, Ltd.
    Inventors: Hsiao-Wen Lee, Peter Zung, Tzu-Han Lin, Tzy-Ying Lin, Chia-Yang Chang, Chien-Pang Lin
  • Publication number: 20100322462
    Abstract: A liquid level detection method includes capturing an image of a liquid surface, a structural surface, and graduation markings provided on the structural surface using an image-capturing device to thereby obtain an initial image. Subsequently, the initial image is processed so as to generate a processed image, and a level reference value of the liquid surface is obtained from the processed image. The level reference value represents a height of the liquid surface in terms of inherent characteristics of the processed image. Lastly, a liquid level of the liquid surface is calculated based on a relative proportional relation among the level reference value, an overall height of the processed image interms of the inherent characteristics of the processed image, and dimensions of any one of the initial and processed images relative to the graduation markings.
    Type: Application
    Filed: June 17, 2009
    Publication date: December 23, 2010
    Applicant: NATIONAL APPLIED RESEARCH LABORATORIES
    Inventors: Jyh-Hong Wu, Fang-Pang Lin, Yi-Hao Hsiao, Te-Lin Chung
  • Publication number: 20100297940
    Abstract: A Bluetooth peripheral includes a sleeve, a Bluetooth earphone received in the sleeve, and a stylus latched to the sleeve. The invention also discloses a portable electronic device using the Bluetooth peripheral.
    Type: Application
    Filed: November 13, 2009
    Publication date: November 25, 2010
    Applicant: CHI MEI COMMUNICATION SYSTEMS, INC.
    Inventor: YI-PANG LIN
  • Patent number: 7829137
    Abstract: A composition for forming a dielectric layer includes a liquid organometallic compound serving as a precursor with high dielectric constant, a photo-sensitive polymer or a non-photo-sensitive polymer and a solvent, wherein the liquid organometallic compound includes metal alkoxide, and the metal of the metal alkoxide includes Al Ti, Zr, Ta, Si, Ba, Ge and Hf. The dielectric layer formed by the composition includes the photo-sensitive polymer or the non-photo-sensitive polymer and an amorphous metal oxide formed therein.
    Type: Grant
    Filed: March 21, 2006
    Date of Patent: November 9, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Wei-Ling Lin, Pang Lin, Tarng-Shiang Hu, Liang-Xiang Chen
  • Patent number: 7826148
    Abstract: Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: November 2, 2010
    Assignee: VisEra Technologies Company Limited
    Inventors: Pai-Chun Peter Zung, Shin-Chang Shiung, Wei-Ko Wang, Chia-Yang Chang, Chien-Pang Lin
  • Publication number: 20100237222
    Abstract: An accessory structure for portable electronic device includes a primary member and a resisting member. The primary member includes a seat and a supporting plate. The seat defines a recessed portion. The supporting plate includes a flexible portion allowing the seat to be bent relative to the supporting plate. The resisting member is received in the recessed portion. The resisting member is rotatably attached to the recessed portion.
    Type: Application
    Filed: October 15, 2009
    Publication date: September 23, 2010
    Applicant: Chi Mei Communication Systems, Inc.
    Inventor: YI-PANG LIN
  • Publication number: 20100123688
    Abstract: A portable electronic device includes a touch pen comprising a main body, a first pen head, a first elastic member, and a first sleeve. The first elastic member interconnects the main body and the first pen head. The first sleeve is slidably sleeved on the main body or the first elastic member so as to expose at least a part of the first elastic member. The first elastic member is bendable.
    Type: Application
    Filed: June 18, 2009
    Publication date: May 20, 2010
    Applicant: CHI MEI COMMUNICATION SYSTEMS, INC.
    Inventor: YI-PANG LIN
  • Patent number: 7704114
    Abstract: This invention relates to a process for fabricating ZnO nanowires with high aspect ratio at low temperature, which is associated with semiconductor manufacturing process and a gate controlled field emission triode is obtained. The process comprises providing a semiconductor substrate, depositing a dielectric layer and a conducting layer, respectively, on the semiconductor substrate, defining the positions of emitter arrays on the dielectric layer and conducting layer, depositing an ultra thin ZnO film as a seeding layer on the substrate, growing the ZnO nanowires as the emitter arrays by using hydrothermal process, and etching the areas excluding the emitter arrays, then obtaining the gate controlled field emission triode.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: April 27, 2010
    Assignee: National Chiao-Tung University
    Inventors: Tseung-Yuen Tseng, Chia-Ying Lee, Seu-Yi Li, Pang Lin
  • Patent number: 7703997
    Abstract: An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.
    Type: Grant
    Filed: January 16, 2007
    Date of Patent: April 27, 2010
    Assignee: Visera Technologies, Co., Ltd.
    Inventors: Hsiao-Wen Lee, Tzu-Han Lin, Pai-Chun Peter Zung, Chien-Pang Lin
  • Publication number: 20100033746
    Abstract: The present invention provides a document management device including a file receiving device for receiving a document; an optical identification device for performing optical identification on a non-textural content in the received document; a feature mark identifier for setting up a feature mark for the document; and a database for storing the document, which can be output from the database directly or through the file receiving device. The present invention also discloses a document management method. The device and method of the present invention have functions of identification, classification, search, and save.
    Type: Application
    Filed: July 24, 2009
    Publication date: February 11, 2010
    Applicant: Otiga Technologies Limited
    Inventors: Lee-En Liu, I-Pang Lin, Yen-Chang Chen, Shengfu Lin
  • Publication number: 20100034460
    Abstract: The present invention provides a document management system including a webpage server, a file receiving server for receiving a document through the webpage server; an optical identification device for performing optical identification on a non-textural content in the received document; a feature mark identifier for setting up a feature mark for the document; and a database for storing the document, which can be output from the database directly or through the file receiving device. The present invention also discloses a remote document management method. The device and method of the present invention have functions of identification, classification, search, and save.
    Type: Application
    Filed: July 24, 2009
    Publication date: February 11, 2010
    Applicant: Otiga Technologies Limited
    Inventors: Lee-En Liu, I-Pang Lin, Yen-Chang Chen
  • Patent number: 7576551
    Abstract: A test board for wafer level semiconductor testing is disclosed. The test board comprises a plurality of wires and microelectronic devices; and a plurality of test sockets on an upper surface of the test board. Each test socket comprises: a base member configured for attachment to the test board with a first set of screws, wherein the base member has a central opening exposing a portion of the underlying test board; an anisotropic conductive film disposed within the central opening of the base member; a chip to be tested, disposed on the anisotropic conductive film within the central opening of the base member; and a cover member overlying the chip, attached to the base member with a second set of screws.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: August 18, 2009
    Assignee: VisEra Technologies Company Limited
    Inventors: Sheng-Feng Lu, Shih-Ming Chen, Chien-Pang Lin, Ming-Hsun Sung
  • Publication number: 20090203282
    Abstract: This invention relates to a process for fabricating ZnO nanowires with high aspect ratio at low temperature, which is associated with semiconductor manufacturing process and a gate controlled field emission triode is obtained. The process comprises providing a semiconductor substrate, depositing a dielectric layer and a conducting layer, respectively, on the semiconductor substrate, defining the positions of emitter arrays on the dielectric layer and conducting layer, depositing an ultra thin ZnO film as a seeding layer on the substrate, growing the ZnO nanowires as the emitter arrays by using hydrothermal process, and etching the areas excluding the emitter arrays, then obtaining the gate controlled field emission triode.
    Type: Application
    Filed: April 14, 2009
    Publication date: August 13, 2009
    Inventors: Tseung-Yuan Tseng, Chia-Ying Lee, Seu-Yi Li, Pang Lin, Tseung-Yuen Tseng
  • Publication number: 20090189055
    Abstract: Embodiments disclose an image sensor device, comprising a substrate comprising a plurality of photosensor cells located therein or thereon, a plurality of optical guide structures corresponding to the photosensor cells respectively, and a stacked layer surrounding the optical guide structures, comprising a plurality of top portions with sharp corners adjacent to the top edges of the optical guide structures.
    Type: Application
    Filed: January 25, 2008
    Publication date: July 30, 2009
    Inventors: Chien-Pang Lin, Chung-Jung Hsu, Shiu-Fang Yen, Wu-Chieh Liu
  • Publication number: 20090101947
    Abstract: An image sensor device is disclosed. The image sensor device comprises a substrate having a pixel array therein. A first transparent layer with a curved surface is disposed on the substrate. A micro lens array is conformally disposed on the curved surface of the first transparent layer and corresponds to the pixel array in the substrate. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.
    Type: Application
    Filed: October 17, 2007
    Publication date: April 23, 2009
    Inventors: Chien-Pang Lin, Chin-Poh Pang, Wu-Chieh Liu, Shiu-Fang Yen
  • Publication number: 20090079461
    Abstract: A test board for wafer level semiconductor testing is disclosed. The test board comprises a plurality of wires and microelectronic devices; and a plurality of test sockets on an upper surface of the test board. Each test socket comprises: a base member configured for attachment to the test board with a first set of screws, wherein the base member has a central opening exposing a portion of the underlying test board; an anisotropic conductive film disposed within the central opening of the base member; a chip to be tested, disposed on the anisotropic conductive film within the central opening of the base member; and a cover member overlying the chip, attached to the base member with a second set of screws.
    Type: Application
    Filed: September 20, 2007
    Publication date: March 26, 2009
    Inventors: Sheng-Feng Lu, Shih-Ming Chen, Chien-Pang Lin, Ming-Hsun Sung