Abstract: The invention provides a device for wire bonding with a copper-containing bonding wire for connecting a component to a support, wherein provision is made on the component as well as on the support for at least one bond pad, encompassing a guide for the bonding wire and a device for melting a part of a bonding wire, which is provided for a connection to one of the bond pads, wherein the guide for the bonding wire is embodied in such a manner that the melted part of the bonding wire is brought into contact in each case with at least one bond pad in a bonding chamber, characterized in that provision is made for at least one plasma nozzle, with part of the bonding wire provided for the connection to the bond pad can be acted upon by a plasma and/or the bond pad can be acted upon by a plasma and/or the bonding chamber can be acted upon by a plasma. The invention also relates to a method for wire bonding.