Abstract: A method for low temperature liquid-phase deposition and a method for cleaning a liquid-phase deposition apparatus are disclosed. The method for low temperature liquid-phase deposition is employed so as to form a low-temperature grown film or a film with excellent step-coverage on the surface of a semiconductor device having independent circuit functions. The method for cleaning liquid-phase deposition apparatus is characterized in that a loop used exclusively for cleaning is employed so as to prevent SiO2 powders from remaining in the loop.

Abstract: A method for low temperature liquid-phase deposition and a method for cleaning a liquid-phase deposition apparatus are disclosed. The method for low temperature liquid-phase deposition is employed so as to form a low-temperature grown film or a film with excellent step-coverage on the surface of a semiconductor device having independent circuit functions. The method for cleaning liquid-phase deposition apparatus is characterized in that a loop used exclusively for cleaning is employed so as to prevent SiO2 powders from remaining in the loop.

Abstract: A wafer electroplating apparatus and method, comprising a wafer turning assembly, a vertical movement assembly, a wafer tilting assembly, and a frame. The wafer turning assembly has a turning shaft and a clasp for holding a wafer. The wafer tilting assembly has a tilting table being driven by a driving system, e.g. a cylinder, carrying an electroplating unit and wafer turning assembly. Thus the clasp holding a wafer and the electroplating unit are simultaneously inclined at preset angle against the horizontal plane, allowing for a large inclination angle. Therefore, gas bubbles generated during electroplating readily escape, and quality of electroplating is improved.

Abstract: The present invention provides an apparatus for liquid phase deposition, comprising: a saturation reaction system, including a mixture trough, at least two supply devices for raw materials, a stirrer device, a filter device, and valve control devices; a steady-flow over-saturation loop reaction system, including an over-saturation reaction trough, at least one liquid level control trough, at least two supply devices for raw materials, a stirrer device, a filter device, and valve control devices; an automatic solution concentration monitoring system, for controlling the reactant concentrations; and a waste liquid recycling system, comprising at least two storage troughs, a recycled waste liquid level sensor, a recycled waste liquid sensor, and valve control devices.

Abstract: A method for liquid phase deposition, including the steps of providing at least two raw materials from at least two supply devices of a saturation reaction system into a mixture trough and stirring until saturation occurs, filtering out unnecessary solid-state particles, and providing saturated and filtered liquid into an over-saturation reaction trough of a steady-flow over-saturation loop reaction system and stopping the saturated and filtered liquid when the over-saturation reaction trough is filled and the saturated and filtered liquid over-flows into a liquid level control trough to a pre-determined level. The method also includes the steps of providing a substrate in the over-saturation reaction trough, providing reactants from at least two supply devices into the over-saturation reaction trough, and depositing a thin film onto the substrate when the saturated liquid becomes over-saturated.

Abstract: The present invention provides a fabricating process for forming multi-layered metal bumps by electroless plating, comprising the steps of: providing an IC chip or a semiconductor substrate on which there are provided a plurality of pads; dispensing a first dielectric layer, exposing the pads, roughing the surface to be redistributed by chemical or physical approaches, activating the surface in order to follow-up electroless plating deposition advantageously, and dispensing a second dielectric layer so as to define a redistribution path; depositing a conductive film on the redistribution path by electroless plating, in which the conductive film allows the positions of the pads to be changed so as to be connected to the external circuit; forming a photoresist pattern, exposing a plurality of pre-determined positions on the conductive film so as to redistribute the positions for the metal bumps formed later; performing activation on the pre-determined positions so as to generate an activator; forming initial me

Abstract: A Tray input-output module, comprising a power unit, a clamp unit and a support unit, is capable of automatically retrieving a tray from a transport device and automatically delivering a tray to a transport device for facilitating automation in chip sorter operation, reducing manual work and raising productivity.

Abstract: A Tray input-output module, comprising a power unit, a clamp unit and a support unit, is capable of automatically retrieving a tray from a transport device and automatically delivering a tray to a transport device for facilitating automation in chip sorter operation, reducing manual work and raising productivity.

Abstract: The present invention provides a fabricating process for forming multi-layered metal bumps by electroless plating, comprising the steps of: providing an IC chip or a semiconductor substrate on which there are provided a plurality of pads; dispensing a first dielectric layer, exposing the pads, roughing the surface to be redistributed by chemical or physical approaches, activating the surface in order to follow-up electroless plating deposition advantageously, and dispensing a second dielectric layer so as to define a redistribution path; depositing a conductive film on the redistribution path by electroless plating, in which the conductive film allows the positions of the pads to be changed so as to be connected to the external circuit; forming a photoresist pattern, exposing a plurality of pre-determined positions on the conductive film so as to redistribute the positions for the metal bumps formed later; performing activation on the pre-determined positions so as to generate an activator; forming initial me

Abstract: The present invention provides an apparatus for liquid phase deposition, comprising: a saturation reaction system, including a mixture trough, at least two supply devices for raw materials, a stirrer device, a filter device, and valve control devices; a steady-flow over-saturation loop reaction system, including an over-saturation reaction trough, at least one liquid level control trough, at least two supply devices for raw materials, a stirrer device, a filter device, and valve control devices; an automatic solution concentration monitoring system, for controlling the reactant concentrations; and a waste liquid recycling system, comprising at least two storage troughs, a recycled waste liquid level sensor, a recycled waste liquid sensor, and valve control devices.