Patents by Inventor PangToh Tien

PangToh Tien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper ring solder mask defined ball grid array pad
    Patent number: 7230339
    Abstract: A ball grid array device includes a substrate, further including a first major surface and a second major surface. An array of pads is positioned on one of the first major surface or the second major surface. At least some of the pads include a raised ring. The raised ring circumscribes the pad or surrounds an interior pad or land on the substrate.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: June 12, 2007
    Assignee: Intel Corporation
    Inventors: Chung C. Key, Leong Kum Foo, PangToh Tien