Patents by Inventor Pang Yongxin

Pang Yongxin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8476528
    Abstract: A method of fabricating a structure comprising the steps of: providing an electrical conductor; providing a layer of a flexible insulating material on the electrical conductor, the material comprising: a first organo-alkoxide 1RxSi(O1R?)4-x and a second organo-alkoxide 2RxSi(O2R?)4-x, where 1R is a non-hydrolysable organic moiety thermally stable to a temperature of at least 150° C., 2R is a non-hydrolysable organic moiety containing a functional group that can react with another like functional group to form an organic polymer, 1R? and 2R? are alkyl radicals and x is an integer from 0 to 3; and an inorganic filler material.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: July 2, 2013
    Assignee: University of Teesside
    Inventors: Simon Hodgson, Pang Yongxin
  • Publication number: 20110147040
    Abstract: A method of fabricating a structure comprising the steps of: providing an electrical conductor; providing a layer of a flexible insulating material on the electrical conductor, the material comprising: a first organo-alkoxide 1RxSi(O1R?)4-x and a second organo-alkoxide 2RxSi(O2R?)4-x, where 1R is a non-hydrolysable organic moiety thermally stable to a temperature of at least 150° C., 2R is a non-hydrolysable organic moiety containing a functional group that can react with another like functional group to form an organic polymer, 1R? and 2R? are alkyl radicals and x is an integer from 0 to 3; and an inorganic filler material.
    Type: Application
    Filed: June 10, 2009
    Publication date: June 23, 2011
    Inventors: Simon Hodgson, Pang Yongxin