Patents by Inventor Pang Yuan LEE

Pang Yuan LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic apparatus
    Patent number: 11817362
    Abstract: The present disclosure provides an electronic apparatus including a first surface, a second surface, a third surface, a plurality of conductive elements, and an encapsulant. The second surface is nonparallel to the first surface. The third surface is distinct from the first surface and the second surface. The plurality of conductive elements are exposed from the second surface. The encapsulant covers the third surface and exposes the first surface and the second surface.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: November 14, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Pang Yuan Lee, Kuei-Hao Tseng, Chih Lung Lin
  • ELECTRONIC APPARATUS
    Publication number: 20230017424
    Abstract: The present disclosure provides an electronic apparatus including a first surface, a second surface, a third surface, a plurality of conductive elements, and an encapsulant. The second surface is nonparallel to the first surface. The third surface is distinct from the first surface and the second surface. The plurality of conductive elements are exposed from the second surface. The encapsulant covers the third surface and exposes the first surface and the second surface.
    Type: Application
    Filed: July 13, 2021
    Publication date: January 19, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Pang Yuan LEE, Kuei-Hao TSENG, Chih Lung LIN