Patents by Inventor Pang Yuan LEE

Pang Yuan LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240249494
    Abstract: An environment managing and monitoring system and a method using same are provided. The environment managing and monitoring system is configured to assist monitors to obtain real-time information of the monitoring field and control device in the monitoring field. The environmental managing and monitoring system includes at least one sub-system and a host system. The host system is configured to output a region of interest condition and a monitoring condition to the sub-system, wherein the sub-system is configured to generate monitoring results according to the monitoring conditions, and selects an image range from the captured wide-angle dynamic real-time images according to the region of interest condition.
    Type: Application
    Filed: September 4, 2023
    Publication date: July 25, 2024
    Inventors: Yung-tai SU, Hsin-lung HSIEH, Yu-hsuan LIAO, Yu-min CHUANG, Pang-tzu LIU, Chun-yueh CHEN, Jia-hao LU, Cheng-ju HSUIEH, Ching-wei LEE, Tsung-hsun TSAI, Po-yuan KUO, Po-yi WU, Chen-wei CHOU
  • Publication number: 20240197176
    Abstract: The present disclosure provides a sensing device. The sensing device includes a flexible element having a first sensing area, an electronic component embedded within the flexible element, and an adjustable conductive element disposed in the flexible element and configured to electrically connect the first sensing area of the flexible element with the electronic component.
    Type: Application
    Filed: December 16, 2022
    Publication date: June 20, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuei-Hao TSENG, Kai Hung WANG, Kai-Di LU, Yu-Chih LEE, Cheng-Tsao PENG, Pang Yuan LEE
  • Patent number: 11817362
    Abstract: The present disclosure provides an electronic apparatus including a first surface, a second surface, a third surface, a plurality of conductive elements, and an encapsulant. The second surface is nonparallel to the first surface. The third surface is distinct from the first surface and the second surface. The plurality of conductive elements are exposed from the second surface. The encapsulant covers the third surface and exposes the first surface and the second surface.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: November 14, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Pang Yuan Lee, Kuei-Hao Tseng, Chih Lung Lin
  • Publication number: 20230017424
    Abstract: The present disclosure provides an electronic apparatus including a first surface, a second surface, a third surface, a plurality of conductive elements, and an encapsulant. The second surface is nonparallel to the first surface. The third surface is distinct from the first surface and the second surface. The plurality of conductive elements are exposed from the second surface. The encapsulant covers the third surface and exposes the first surface and the second surface.
    Type: Application
    Filed: July 13, 2021
    Publication date: January 19, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Pang Yuan LEE, Kuei-Hao TSENG, Chih Lung LIN