Patents by Inventor Pankaj HAZARIKA

Pankaj HAZARIKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240308926
    Abstract: A method for treating a ceramic component for use in a semiconductor processing chamber, wherein the ceramic component comprises a ceramic laminate comprising a base zone comprising a first dielectric ceramic material, a protective, wherein the protective zone comprises a second dielectric ceramic material, and a transition zone between the protective zone and base zone, wherein the transition zone comprises the first dielectric ceramic material and the second dielectric ceramic material, wherein exposure of the ceramic component to UV light changes an optical property of at least a first part of the ceramic component is provided. A heat treatment of the ceramic component is provided by heating the ceramic component in a furnace to a temperature of between 400° C. to 1000° C. for a period between 2 hours to 20 hours, wherein the heat treatment changes the optical property of the first part of the ceramic component.
    Type: Application
    Filed: August 4, 2022
    Publication date: September 19, 2024
    Inventors: Amir A. YASSERI, Hong SHIH, Satish SRINIVASAN, Jeremiah Michael DEDERICK, Pankaj HAZARIKA, Lin XU, Douglas DETERT
  • Publication number: 20240023204
    Abstract: Various embodiments herein relate to techniques for fabricating a platen for use in a semiconductor processing apparatus, as well as the platens and intermediate structures produced by such techniques. For example, such techniques may include depositing a coating on a heater to form a coated heater, where the heater includes a metal wire on which the coating is formed; placing the coated heater in powder; consolidating the powder into a cohesive mass to form a powder-based composite; and sintering the powder-based composite to form the platen, where the platen includes the heater embedded in sintered ceramic material. The coating on the heater may act to protect the heater from chemical attack from carbon- and/or oxygen-containing compounds that may be present during sintering. The platen may be part of a pedestal that, once fabricated, may be installed in a semiconductor processing apparatus.
    Type: Application
    Filed: September 28, 2021
    Publication date: January 18, 2024
    Inventors: Joel Hollingsworth, Ramkishan Rao Lingampalli, Pankaj Hazarika
  • Publication number: 20230411124
    Abstract: A method for forming a component for a plasma processing chamber is provided. An internal mold is provided. An external mold is provided around the internal mold. The external mold is filled with a ceramic powder, wherein the ceramic powder surrounds the internal mold. The ceramic powder is sintered to form a solid part. The solid part is removed from the external mold.
    Type: Application
    Filed: November 1, 2021
    Publication date: December 21, 2023
    Inventors: John Michael KERNS, David Joseph WETZEL, Lin XU, Pankaj HAZARIKA, Douglas DETERT, Lei LIU, Eric A. PAPE
  • Publication number: 20230331633
    Abstract: A method for making a component for use in a plasma processing chamber is provided. A non-oxide silicon containing powder composition is placed in a mold, wherein the non-oxide silicon containing powder composition consists essentially of a non-oxide silicon containing powder and at least one of a B or B4C dopant. The non-oxide silicon containing powder composition is subjected to spark plasma sintering (SPS) to form a spark plasma sintered component. The spark plasma sintered component is machined into a plasma processing chamber component.
    Type: Application
    Filed: November 3, 2021
    Publication date: October 19, 2023
    Inventors: Lin XU, Harmeet SINGH, Pankaj HAZARIKA, Satish SRINIVASAN, Robin KOSHY
  • Publication number: 20230317423
    Abstract: A component for use in a plasma processing chamber system is START provided. The component for use in a processing chamber system comprises a bulk component body comprising magnesium aluminum oxynitride and sintering aids. The sintering aids comprise at least one of yttria, yttrium aluminate, rare earth metal oxide, and rare earth metal aluminate.
    Type: Application
    Filed: October 27, 2021
    Publication date: October 5, 2023
    Inventors: Pankaj HAZARIKA, Joel HOLLINGSWORTH, Matthew Brian SCHICK, Pratima G.N. RAO
  • Publication number: 20230282450
    Abstract: A component of a processing chamber in a substrate processing system includes a base material comprising aluminum, the base material having one or more surfaces, a diffusion barrier layer formed on the surfaces of the base material, wherein the diffusion barrier layer includes magnesium and fluorine (F), and a coating formed on the surfaces. The diffusion barrier layer is arranged between the surfaces and the coating and the coating includes fluorine.
    Type: Application
    Filed: June 24, 2021
    Publication date: September 7, 2023
    Inventors: Eric A. PAPE, Shih-Chung KON, Pankaj HAZARIKA, Lin XU
  • Publication number: 20230081544
    Abstract: A component for use inside a semiconductor chamber with a laser textured surface facing a vacuum region inside the semiconductor chamber is provided.
    Type: Application
    Filed: January 26, 2021
    Publication date: March 16, 2023
    Inventors: Pylin SAROBOL, Eric SAMULON, Pankaj HAZARIKA, Dennis SMITH, Kurt KERN, Debanjan DAS, Darrell EHRLICH, Eric A. PAPE, Matthew Brian SCHICK
  • Publication number: 20220392753
    Abstract: A component of a plasma processing chamber having at least one plasma facing surface of the component comprises single crystal metal oxide material. The component can be machined from a single crystal metal oxide ingot. Suitable single crystal metal oxides include spinel, yttrium oxide, and yttrium aluminum garnet (YAG). A single crystal metal oxide can be machined to form a gas injector of a plasma processing chamber.
    Type: Application
    Filed: October 21, 2020
    Publication date: December 8, 2022
    Inventors: Lin XU, Douglas DETERT, John DAUGHERTY, Pankaj HAZARIKA, Satish SRINIVASAN, Nash W. ANDERSON, John Michael KERNS, Robin KOSHY, David Joseph WETZEL, Lei LIU, Eric A. PAPE