Patents by Inventor Pankaj Kumar UTTWANI

Pankaj Kumar UTTWANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enhanced intermetal dielectric adhesion
    Patent number: 11282744
    Abstract: Device and method of forming the device are disclosed. A semiconductor device includes a back-end-of-line dielectric (BEOL) with a plurality of IMD levels over a substrate processed with front-end-of-line components. The BEOL includes an upper IMD level and upper metal lines, with a buffer layer over the upper metal lines. The buffer layer improves adhesion of the upper IMD layer which covers the upper metal lines. Improving the adhesion of the upper IMD layer improves the reliability of the device.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: March 22, 2022
    Assignee: Systems On Silicon Manufacturing Co. Pte. Ltd.
    Inventors: Pankaj Kumar Uttwani, Shankaran Chelliah, Yee Ming Chan
  • ENHANCED INTERMETAL DIELECTRIC ADHESION
    Publication number: 20210098289
    Abstract: Device and method of forming the device are disclosed. A semiconductor device includes a back-end-of-line dielectric (BEOL) with a plurality of IMD levels over a substrate processed with front-end-of-line components. The BEOL includes an upper IMD level and upper metal lines, with a buffer layer over the upper metal lines. The buffer layer improves adhesion of the upper IMD layer which covers the upper metal lines. Improving the adhesion of the upper IMD layer improves the reliability of the device.
    Type: Application
    Filed: September 30, 2019
    Publication date: April 1, 2021
    Inventors: Pankaj Kumar UTTWANI, Shankaran CHELLIAH, Yee Ming CHAN