Abstract: Various embodiments of an electronic package and implantable medical device are disclosed. The electronic package includes a nonconductive substrate having a first major surface, a second major surface, and an opening disposed through the substrate between the first major surface and the second major surface. The package also includes a conductive layer hermetically sealed to the first major surface of the substrate and over the opening; a conductor block disposed in the opening and extending beyond the second major surface of the substrate, where the conductor block is electrically connected to the conductive layer; and an electronic device disposed adjacent to the first major surface of the substrate and electrically connected to the conductive layer. The package also includes a nonconductive cover disposed over the electronic device and the nonconductive substrate and hermetically sealed to the substrate, where the electronic device is disposed within a cavity of the cover.

Abstract: Various embodiments of an electronic package and implantable medical device are disclosed. The electronic package includes a nonconductive substrate having a first major surface, a second major surface, and an opening disposed through the substrate between the first major surface and the second major surface. The package also includes a conductive layer hermetically sealed to the first major surface of the substrate and over the opening; a conductor block disposed in the opening and extending beyond the second major surface of the substrate, where the conductor block is electrically connected to the conductive layer; and an electronic device disposed adjacent to the first major surface of the substrate and electrically connected to the conductive layer. The package also includes a nonconductive cover disposed over the electronic device and the nonconductive substrate and hermetically sealed to the substrate, where the electronic device is disposed within a cavity of the cover.

Abstract: The present disclosure provides a transcutaneous energy transfer system (TETS), having an implantable receiving coil in communication with an implantable controller and a hermetically sealed package encased by the implantable receiving coil. The hermetically sealed package including a plurality of tuning capacitors, at least one temperature sensor, scavenging circuitry configured to scavenge power from the plurality of tuning capacitors, and a temperature measuring circuit in communication with the at least one temperature sensor and the scavenging circuitry. The at least one temperature sensor being configured to measure a temperature of the hermetically sealed package and the temperature measuring circuit being configured to transmit the measured temperature to the implantable controller.

Abstract: An attachment device for securing a medical device to a patient, comprising at least one layer including a flexible portion and a rigid portion. The rigid portion being connected to the flexible portion and defining at least one loop. The at least one loop including an elongate body and an anchoring element. The elongate body having a first end and a second end opposite the first end. The anchoring element being disposed circumferentially around, and connected to, the elongate body.

Abstract: A connector block for an implanted coil of a transcutaneous energy transfer system (TETS) includes a plurality of closed slots sized and configured to receive corresponding conductors of a powerline of the implanted coil. A plurality of open slots is included. The connector block being sized and configured to be coupled to the implanted coil.