Abstract: A light emitting diode (LED) array including an assembly of LED packages is provided. The LED packages are mounted to a face of a substructure including a circuit board and a heat transfer plate. Each LED package includes electrical connection terminals and a thermal connection pad, the electrical connection terminals are electrically connected to respective circuit conductors of the circuit board, the thermal pads are connected to the heat transfer plate by respective thermally conductive connections, and at least one of the LED packages is tilted at an angle relative to an adjacent portion of the face of the substructure.

Abstract: A light emitting diode (LED) lamp includes one or more light emitting diodes (LEDs). The one or more LEDs are mounted directly on a metallic base and a circuit associated with the one or more LEDs is embedded in the metallic base. The metallic base is copper, aluminium, or a thermally conductive material that is plated with a metallic plating. The metallic base is attached directly, by metal-to-metal contact, to a metallic heat sink. The one or more LEDs, the metallic base and the heat sink, are disposed inside a housing.