Patents by Inventor Panu Sukitpaneenit

Panu Sukitpaneenit has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10987846
    Abstract: Disclosed is a thin film composite hollow fiber that includes an outer support layer having a thickness of 10 to 1000 ?m and a polyamide thin film layer having a thickness of 1 to 10000 nm; and has a transmembrane pressure resistance rate of higher than 15 bar and a pure water permeability rate of higher than 0.8 Lm?2h?1bar?1. Also disclosed are methods of preparing the above-described support and composite hollow fiber.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: April 27, 2021
    Assignee: National University of Singapore
    Inventors: Sui Zhang, Panu Sukitpaneenit, Tai-Shung Chung, Chunfeng Wan
  • Publication number: 20190202103
    Abstract: Disclosed is a thin film composite hollow fiber that includes an outer support layer having a thickness of 10 to 1000 ?m and a polyamide thin film layer having a thickness of 1 to 10000 nm; and has a transmembrane pressure resistance rate of higher than 15 bar and a pure water permeability rate of higher than 0.8 Lm?2h?1bar?1. Also disclosed are methods of preparing the above-described support and composite hollow fiber.
    Type: Application
    Filed: March 11, 2019
    Publication date: July 4, 2019
    Inventors: Sui Zhang, Panu Sukitpaneenit, Tai-Shung Chung, Chunfeng Wan
  • Publication number: 20160121533
    Abstract: Disclosed is a thin film composite hollow fiber that includes an outer support layer having a thickness of 10 to 10000 ?m and a polyamide thin film layer having a thickness of 1 to 10000 nm; and has a transmembrane pressure resistance rate of higher than 15 bar and a pure water permeability rate of higher than 0.8 Lm?2 h?1 bar?1. Also disclosed are methods of preparing the above-described support and composite hollow fiber.
    Type: Application
    Filed: June 17, 2014
    Publication date: May 5, 2016
    Inventors: Sui Zhang, Panu Sukitpaneenit, Tai-Shung Chung, Chunfeng Wan