Abstract: Techniques for providing plant growth lights with improved performance and cost are discussed herein. Some embodiments may provide for a light emitting diode (LED) flip chip chip-on-board (COB) module for optimizing plant growth, including: a circuit board; ultraviolet (UV) LED flip chips connected to the circuit board; a royal-blue phosphor or fluorescent layer covering a first portion of the UV LED flip chips; and a deep-red phosphor or fluorescent layer covering a second portion of the UV LED flip chips. The royal-blue phosphor or fluorescent layer absorbs UV light generated by the first portion of the UV LED flip chips and converts the UV light into broad-band light in royal-blue spectrums. The a deep-red phosphor or fluorescent layer absorbs UV light generated by the second portion of the UV LED flip chips and converts the UV light into broad-band light in deep-red spectrums.

Abstract: A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface. The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.

Abstract: A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface. The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.

Abstract: A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface. The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.

Abstract: A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface, The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.

Abstract: A method of fabricating a light emitting diode device comprises depositing conductive material to cover a portion of surface of a conductive and reflective layer to form a first contact pad, and surfaces between adjacent first trenches to form a second contact pad; and depositing a first passivation layer over uncovered portion of surface of the conductive and reflective layer to form a first planar passivation contact surface between the first contact pad and the second trench and depositing bonding material to cover a portion of surface of the first contact pad, a portion of the second contact pad and a portion of the first planar passivation contact to form a first light emitting diode bonding pad on the first contact pad, a second light emitting diode bonding pad on the second contact pad, and a third light emitting diode bonding pad on the first planar passivation contact.

Abstract: A chip on board light emitting diode (LED) device includes a LED device, a printed circuit board (PCB) and a dissipation unit array. The LED device includes a LED substrate, a first contact pad and a second contact pad above the LED substrate and a thermal layer formed on top surface of the LED device. The thermal layer includes a thermal conductive material. A printed circuit board (PCB) includes a PCB substrate with a thermal projection extending from surface of the PCB substrate, and a first and a second electrode pads above the PCB substrate. The thermal projection and the PCB substrate include the thermal conductive material. The dissipation unit array includes a plurality of dissipation units each disposed between the LED device and the PCB. The thermal layer is thermally coupled to the thermal projection via at least one dissipation unit. Each of the first and second contact pads is electrically coupled to the corresponding electrode pad via at least one dissipation unit.

Abstract: A chip on board light emitting diode (LED) device comprises a LED device, a printed circuit board (PCB) and a dissipation unit array. The LED device comprises a LED substrate, a first contact pad and a second contact pad above the LED substrate and a thermal layer formed on top surface of the LED device. The thermal layer comprises a thermal conductive material. A printed circuit board (PCB) comprises a PCB substrate with a thermal projection extending from surface of the PCB substrate, and a first and a second electrode pads above the PCB substrate. The thermal projection and the PCB substrate comprise the thermal conductive material. The dissipation unit array comprises a plurality of dissipation units each disposed between the LED device and the PCB. The thermal layer is thermally coupled to the thermal projection via at least one dissipation unit. Each of the first and second contact pads is electrically coupled to the corresponding electrode pad via at least one dissipation unit.

Abstract: A method of fabricating a light emitting diode device comprises depositing conductive material to cover a portion of surface of a conductive and reflective layer to form a first contact pad, and surfaces between adjacent first trenches to form a second contact pad; and depositing a first passivation layer over uncovered portion of surface of the conductive and reflective layer to form a first planar passivation contact surface between the first contact pad and the second trench and depositing bonding material to cover a portion of surface of the first contact pad, a portion of the second contact pad and a portion of the first planar passivation contact to form a first light emitting diode bonding pad on the first contact pad, a second light emitting diode bonding pad on the second contact pad, and a third light emitting diode bonding pad on the first planar passivation contact.

Abstract: A motor vehicle has an exterior coating. A fluorescing and/or phosphorescing substance is added to the exterior coating or forms a part of the exterior coating. The fluorescing and/or phosphorescing substance serves to emit light, in particular red, green and/or blue light, in a visible range upon irradiation by light in an invisible range.

Abstract: A display device for a vehicle includes a transparent window with a light emission layer intended to separate the interior of the vehicle for emitting visible light when light is beamed onto the light emission layer, a light source for beaming light onto the window, a reflector mounted in a light path between the light source and the window to reflect the light generated by the light source and an adjustable image generator located between the light source and the reflector.

Abstract: A display arrangement for a vehicle has, in particular, a multipurpose instrument or is configured as a multipurpose instrument. The display arrangement includes a first display device to display information concerning operation of the vehicle, a glass with adjustable transparency arranged in front of the first display device, with reference to the viewing direction of the display arrangement, and a second display device to display information concerning operation of the vehicle or additional information concerning operation of the vehicle.

Abstract: A rear-view mirror (3) for a motor vehicle is provided with a reflector layer (40) which is used to reflect light which impinges on the rear-view mirror (3) from a first viewing direction, a display layer (36) which is arranged behind the reflector layer (40) in relation to the viewing direction (41) and which is used to emit light, a quarter wave plate (74) which is arranged between the display layer (36) and the reflector layer (40) and a reflecting linear-polarisation layer (73) which is arranged between the display layer and the quarter wave plate (74).

Abstract: A motor vehicle has an exterior coating. A fluorescing and/or phosphorescing substance is added to the exterior coating or forms a part of the exterior coating. The fluorescing and/or phosphorescing substance serves to emit light, in particular red, green and/or blue light, in a visible range upon irradiation by light in an invisible range.

Abstract: A motor vehicle has a passenger compartment with an interior covering formed with a display region. The display regions is configured to emit visible light upon irradiation thereof with light in an invisible range or an at least virtually invisible range. There is also provided a projection assembly for displaying information or images in the display region by irradiating the display region with such light in the invisible range or the at least virtually invisible range.

Abstract: A motor vehicle has a passenger compartment with an interior covering formed with a display region. The display regions is configured to emit visible light upon irradiation thereof with light in an invisible range or an at least virtually invisible range. There is also provided a projection assembly for displaying information or images in the display region by irradiating the display region with such light in the invisible range or the at least virtually invisible range.

Abstract: The invention relates to a moonroof for a motor vehicle, the moonroof comprising a transparent wedge-shaped essentially solid body having a surface that is to be turned toward an interior space of a motor vehicle, and having a surface opposite the surface that is to be turned toward the interior space of the motor vehicle, the surface that is to be turned toward the interior space of the motor vehicle being inclined to the surface opposite the surface to be turned toward the interior space of the motor vehicle and the moonroof comprising a light source for introducing light into the transparent wedge-shaped essentially solid body.

Abstract: A motor vehicle has a sensor for detecting an obstacle in the surroundings of the motor vehicle and a control system for assigning the symbol for identifying the detected obstacle to the image of said surroundings of the motor vehicle, wherein the position of the symbol in relation to the image corresponds substantially to the position of the obstacle in the image, and wherein a display arrangement is provided for representing the image of said surroundings of the motor vehicle together with the symbol.

Abstract: A rearview mirror for a motor vehicle, in particular for a convertible, has a display that displays information by emitting light. A reflective-type linear polarization layer is disposed in front of the display layer, with reference to a defined viewing direction. There is no absorption-type polarization layer disposed in front of the reflective-type linear polarization layer, with reference to a defined viewing direction.

Abstract: The invention relates to a moonroof for a motor vehicle, the moonroof comprising a transparent wedge-shaped essentially solid body having a surface that is to be turned toward an interior space of a motor vehicle, and having a surface opposite the surface that is to be turned toward the interior space of the motor vehicle, the surface that is to be turned toward the interior space of the motor vehicle being inclined to the surface opposite the surface to be turned toward the interior space of the motor vehicle and the moonroof comprising a light source for introducing light into the transparent wedge-shaped essentially solid body.