Abstract: A slurry spraying mask includes a holding portion and a mask portion. The holding portion includes a holding portion opening. The mask portion includes a first layer and a second layer. The first layer includes a first tapered structure, the second layer includes a second tapered structure. The first tapered structure and the second tapered structure are arranged coaxially. A gap exists between the first layer and the second layer. The apex of the first tapered structure includes a first aperture, the apex of the second tapered structure includes a second aperture, and the second aperture is overlapped with the first aperture. The apex of the second tapered structure passes through the holding portion opening such that the mask portion is localized to the holding portion.

Abstract: A slurry spraying mask includes a holding portion and a mask portion. The holding portion includes a holding portion opening. The mask portion includes a first layer and a second layer. The first layer includes a first tapered structure, the second layer includes a second tapered structure. The first tapered structure and the second tapered structure are arranged coaxially. A gap exists between the first layer and the second layer. The apex of the first tapered structure includes a first aperture, the apex of the second tapered structure includes a second aperture, and the second aperture is overlapped with the first aperture. The apex of the second tapered structure passes through the holding portion opening such that the mask portion is localized to the holding portion.

Abstract: A light emitting diode (LED) chip package is provided. The LED chip package comprises a carrier, a first LED chip, a second LED chip and an encapsulant. The first LED chip is disposed on and electrically connected to the carrier, wherein the first LED chip is adapted for emitting a first light. The second LED chip is disposed on and electrically connected to the carrier, wherein the second LED chip is adapted for emitting a second light. The encapsulant has a doped phosphor, and encapsulates the first LED chip and the second LED chip, wherein the first light is adapted for exciting the doped phosphor to emit a third light.

Abstract: A multi-chip light emitting diode (LED) package having a plurality of LED chips, a substrate, and a plurality of conductive paste layers is provided. The substrate has at least two hollow areas with conductive patterns formed on a bottom surface thereon. The conductive paste layers are pasted on the bottom surfaces of the hollow areas respectively for fixing the LED chips and having the LED chips electrically connected to the conductive patterns. The LED chips in the different hollow areas are electrically connected in serial.

Abstract: An LED package structure includes a lower substrate, an upper substrate disposed on the lower substrate and having a though hole exposing a portion of the upper surface of the lower substrate; an individual LED unit disposed within the through hole in the upper substrate, a conductive pattern layer disposed on the upper substrate, a conducting wire interconnecting electrically the LED unit and the conductive pattern layer, and an encapsulating body disposed on the conductive pattern layer in such a manner that the encapsulating body hermetically encloses the LED unit, the through hole in the upper substrate and an inner peripheral portion of the conductive pattern layer surrounding the through hole. The lower and upper substrates are separately formed.

Abstract: A light emitting diode package structure includes a light emitting diode, a substrate structure and at least one gel. A surface of the substrate structure has a concave and at least one groove. The concave is used for containing the light emitting diode. A predetermined distance (D) is between the groove and the light emitting diode. The groove is formed around the light emitting diode. The gel covers the light emitting diode and a portion of the surface of the substrate structure. The gel is limited to surface tension in the groove and is positioned in a predetermined region surrounded by the groove.

Abstract: An LED package structure includes a lower substrate, an upper substrate disposed on the lower substrate and having a though hole exposing a portion of the upper surface of the lower substrate; an individual LED unit disposed within the through hole in the upper substrate, a conductive pattern layer disposed on the upper substrate, a conducting wire interconnecting electrically the LED unit and the conductive pattern layer, and an encapsulating body disposed on the conductive pattern layer in such a manner that the encapsulating body hermetically encloses the LED unit, the through hole in the upper substrate and an inner peripheral portion of the conductive pattern layer surrounding the through hole. The lower and upper substrates are separately formed.

Abstract: A piezoelectric ink jet print head and a fabrication method for a vibrating layer thereof. An adhesion layer is formed between the bottom of a first silicon wafer and the top of a second silicon wafer for bonding thereof. The first silicon wafer serves as a vibrating layer, the second silicon wafer has a plurality of ink chambers spaced apart from each other, and the adhesion layer serves as an etching stop layer for the ink chambers. A piezoelectric material layer is formed on the top of the first silicon wafer, and a hard mask layer is formed on the bottom of the second silicon wafer for defining the pattern of the ink chambers.