Patents by Inventor Pao-Kun Liao

Pao-Kun Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling device for wafer machine
    Patent number: 6732446
    Abstract: A device for rapidly cooling a semiconductor wafer test/transfer machine and which includes a body which is provided with an interior gas passage one end of which is connected to a source of clean, dry air or other gas by a tubing. In typical application, the body is rested on the cover of a semiconductor wafer test or transfer machine, typically above or adjacent to the chuck or other wafer holder of the machine, with the other end of the gas passage in contact with the cover. The air or gas flowing through the gas passage impinges against the machine cover and rapidly cools the chuck or other wafer holder.
    Type: Grant
    Filed: April 25, 2002
    Date of Patent: May 11, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co. Ltd
    Inventors: Pao-Kun Liao, Wen-Tsai Su
  • Cooling device for wafer machine
    Publication number: 20030200673
    Abstract: A device for rapidly cooling a semiconductor wafer test/transfer machine. The device includes a body which is provided with an interior gas passage one end of which is connected to a source of clean, dry air or other gas by a tubing. In typical application, the body is rested on the cover of a semiconductor wafer test or transfer machine, typically above or adjacent to the chuck or other wafer holder of the machine, with the other end of the gas passage in contact with the cover. The air or gas flowing through the gas passage impinges against the machine cover and rapidly cools the chuck or other wafer holder.
    Type: Application
    Filed: April 25, 2002
    Publication date: October 30, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co, Ltd.
    Inventors: Pao-Kun Liao, Wen-Tsai Su