Patents by Inventor Pao-Ming Tsai
Pao-Ming Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8945821Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.Type: GrantFiled: September 15, 2014Date of Patent: February 3, 2015Assignee: Industrial Technology Research InstituteInventors: Pao-Ming Tsai, Yu-Yang Chang, Liang-You Jiang, Yu-Jen Chen
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Patent number: 8932804Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.Type: GrantFiled: September 15, 2014Date of Patent: January 13, 2015Assignee: Industrial Technology Research InstituteInventors: Pao-Ming Tsai, Yu-Yang Chang, Liang-You Jiang, Yu-Jen Chen
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Publication number: 20150004549Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.Type: ApplicationFiled: September 15, 2014Publication date: January 1, 2015Inventors: Pao-Ming Tsai, Yu-Yang Chang, Liang-You Jiang, Yu-Jen Chen
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Publication number: 20150004548Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.Type: ApplicationFiled: September 15, 2014Publication date: January 1, 2015Inventors: Pao-Ming Tsai, Yu-Yang Chang, Liang-You Jiang, Yu-Jen Chen
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Publication number: 20140374736Abstract: A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.Type: ApplicationFiled: September 10, 2014Publication date: December 25, 2014Inventors: Hsiao-Fen Wei, Liang-You Jiang, Pao-Ming Tsai, Yu-Yang Chang
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Patent number: 8864540Abstract: A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.Type: GrantFiled: May 16, 2013Date of Patent: October 21, 2014Assignee: Industrial Technology Research InstituteInventors: Hsiao-Fen Wei, Liang-You Jiang, Pao-Ming Tsai, Yu-Yang Chang
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Patent number: 8859055Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.Type: GrantFiled: May 9, 2011Date of Patent: October 14, 2014Assignee: Industrial Technology Research InstituteInventors: Pao-Ming Tsai, Yu-Yang Chang, Liang-You Jiang, Yu-Jen Chen
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Publication number: 20140160705Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, gas barrier structures, micro-structures, and a filler layer is provided. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate. The gas barrier structures may be located between the first substrate and the second substrate and surround the environmental sensitive electronic device. The gas barrier structures have a first height. The micro-structures may be located between the first substrate and the second substrate and have a second height. A ratio of the second height to the first height ranges from 1/250 to 1/100. The filler layer may be located between the first substrate and the second substrate and covers the gas barrier structures and the environmental sensitive electronic device.Type: ApplicationFiled: November 7, 2013Publication date: June 12, 2014Applicant: Industrial Technology Research InstituteInventors: Hsiao-Yen Lee, Yu-Yang Chang, Pao-Ming Tsai
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Patent number: 8715802Abstract: The invention provides a transferring apparatus for a flexible electronic device and method for fabricating a flexible electronic device. The transferring apparatus for the flexible electronic device includes a carrier substrate. A release layer is disposed on the carrier substrate. An adhesion layer is disposed on a portion of the carrier substrate, surrounding the release layer and adjacent to a sidewall of the release layer. A flexible electronic device is disposed on the release layer and the adhesion layer, wherein the flexible electronic device includes a flexible substrate.Type: GrantFiled: June 19, 2009Date of Patent: May 6, 2014Assignee: Industrial Technology Research InstituteInventors: Pao-Ming Tsai, Liang-You Jiang, Yu-Yang Chang, Hung-Yuan Li
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Publication number: 20130295814Abstract: A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.Type: ApplicationFiled: May 16, 2013Publication date: November 7, 2013Inventors: Hsiao-Fen Wei, Liang-You Jiang, Pao-Ming Tsai, Yu-Yang Chang
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Publication number: 20120216961Abstract: The disclosure provides a method for de-bonding a flexible device. The method for de-bonding a flexible device includes providing a first carrier to mount a carrier substrate thereon, a release layer thereon and a flexible device covering the release layer and a portion of the carrier substrate. A vacuum suction process is performed to suction the flexible device using a vacuum device. A separation process is performed with air entering into an interface between the flexible device and the release layer to separate a portion of the flexible device from the release layer and the carrier substrate using a separation device. A first release process is performed so that the portion of the flexible device is separated from the vacuum device.Type: ApplicationFiled: May 8, 2012Publication date: August 30, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Pao-Ming Tsai, Liang-You Jiang, Yu-Yang Chang
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Publication number: 20120052214Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.Type: ApplicationFiled: May 9, 2011Publication date: March 1, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Pao-Ming Tsai, Yu-Yang Chang, Liang-You Jiang, Yu-Jen Chen
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Publication number: 20110291544Abstract: A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.Type: ApplicationFiled: September 17, 2010Publication date: December 1, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsiao-Fen Wei, Liang-You Jiang, Pao-Ming Tsai, Yu-Yang Chang
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Publication number: 20100224320Abstract: The invention provides an apparatus for de-bonding a flexible device and method thereof. The apparatus for de-bonding a flexible device includes a carrier to mount a carrier substrate thereon, a release layer thereon and a flexible device covering the release layer. A separation device disposed over the carrier is used to separate the flexible device from the release layer and the carrier substrate with air entering into an interface between the flexible device and the release layer. A vacuum device disposed over the carrier is used to suction the flexible device.Type: ApplicationFiled: June 22, 2009Publication date: September 9, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Pao-Ming Tsai, Liang-You Jiang, Yu-Yang Chang
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Publication number: 20100203296Abstract: The invention provides a transferring apparatus for a flexible electronic device and method for fabricating a flexible electronic device. The transferring apparatus for the flexible electronic device includes a carrier substrate. A release layer is disposed on the carrier substrate. An adhesion layer is disposed on a portion of the carrier substrate, surrounding the release layer and adjacent to a sidewall of the release layer. A flexible electronic device is disposed on the release layer and the adhesion layer, wherein the flexible electronic device includes a flexible substrate.Type: ApplicationFiled: June 19, 2009Publication date: August 12, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Pao-Ming Tsai, Liang-You Jiang, Yu-Yang Chang, Hung-Yuan Li
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Publication number: 20100151209Abstract: The present invention employs the totally printable process to fabricate an organic/inorganic multi-layered laminate gas barrier film. Such totally printable process is simple with lower costs. Moreover, through the pattern design, the adhesion between the organic and inorganic layers is improved.Type: ApplicationFiled: November 16, 2009Publication date: June 17, 2010Applicant: Industrial Technology Research InstituteInventors: Hsiao-Fen Wei, Liang-You Jiang, Pao-Ming Tsai, Jhen-Hao Jiang