Abstract: The present invention discloses a light source package structure, a fabricating method thereof and a liquid crystal display. The light source package structure includes two overlapped substrates, a frame-shaped resin body, a filling material layer and a photoluminescence object. The frame-shaped resin body is positioned between the two substrates and encloses a vacuum space together with the two substrates. The photoluminescence object is positioned in the vacuum space. The filling material layer with light transmittance is fully filled in the vacuum space and wraps the photoluminescence object. In various embodiments of the present invention, the photoluminescence object is a phosphor powder layer, a light emitting diode module or a combination thereof.

Abstract: A light device with multiple LED light sources includes a metal conductive plate and a plurality of LED elements. The metal conductive plate consists of plural plate members, and a slot is defined between every two adjacent plate members for physically separating the two adjacent plate members. Each LED element is electrically connected to the plate members disposed at two sides of the slot. The LED elements are electrically connected in series or in parallel through the plate members disposed at the two sides of the slot.

Abstract: A light emitting diode (LED) module package structure is described. The LED module package structure includes a metal heat dissipating board, a plurality of light emitting diode chips fixed on the metal heat dissipating board, at least one chip-scale connector fixed on the metal heat dissipating board to electrically connect to the light emitting diode chip via a bonding wire. The chip-scale connector includes a sapphire substrate, a conductive metal layer and an insulation protruding member. The insulation protruding member divides the conductive metal layer into a plurality of conductive areas. In addition, the LED module package structure can further includes a chip-scale power connector fixed in the metal heat dissipating board to connect the chip-scale connector or the light emitting diode chip via the bonding wire.

Abstract: An illustrator with light emitting diodes provided in the invention includes a rear housing having a cavity. A front housing is disposed in the cavity, wherein the front housing includes through holes. An illuminating module is sandwiched between the rear housing and the front housing, wherein the illuminating module includes a substrate and light emitting diodes. Two opposite surfaces of the substrate are in contact with the rear housing and the front housing respectively and directly. The light emitting diodes are arranged on a surface of the substrate in an array arrangement and extending outward the through holes in a one-to-one relationship.

Abstract: A light device with multiple LED light sources includes a metal conductive plate and a plurality of LED elements. The metal conductive plate consists of plural plate members, and a slot is defined between every two adjacent plate members for physically separating the two adjacent plate members. Each LED element is electrically connected to the plate members disposed at two sides of the slot. The LED elements are electrically connected in series or in parallel through the plate members disposed at the two sides of the slot.