Patents by Inventor Pao-Yi Huang

Pao-Yi Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked die package with curved spacer
    Patent number: 11094673
    Abstract: Apparatuses and techniques include a substrate, a controller die mounted on the substrate, fingers electrically connecting the controller die to the substrate, a spacer mounted on the substrate adjacent to the controller die, and a first memory die mounted on the spacer. The first memory die is attached to a top surface of the spacer. The spacer has a curved edge facing the controller. The curved edge may have a first curve including a first curve apex extending away from the controller, a first curve peak on one side of the first curve apex, and a second curve peak on an opposite side of the first curve apex than the first curve peak. Additional fingers connect the controller and the first memory die at a point that is aligned with the space between the first curve and a line extending from the first curve peak and the second curve peak.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: August 17, 2021
    Assignee: Western Digital Technologies, Inc.
    Inventors: Kuan-Cheng Chen, Pao-Yi Huang, Jing-Wei Hsu
  • STACKED DIE PACKAGE WITH CURVED SPACER
    Publication number: 20210159214
    Abstract: Apparatuses and techniques include a substrate, a controller die mounted on the substrate, fingers electrically connecting the controller die to the substrate, a spacer mounted on the substrate adjacent to the controller die, and a first memory die mounted on the spacer. The first memory die is attached to a top surface of the spacer. The spacer has a curved edge facing the controller. The curved edge may have a first curve including a first curve apex extending away from the controller, a first curve peak on one side of the first curve apex, and a second curve peak on an opposite side of the first curve apex than the first curve peak. Additional fingers connect the controller and the first memory die at a point that is aligned with the space between the first curve and a line extending from the first curve peak and the second curve peak.
    Type: Application
    Filed: November 22, 2019
    Publication date: May 27, 2021
    Applicant: Western Digital Technologies, Inc.
    Inventors: Kuan-Cheng Chen, Pao-Yi Huang, Jing-Wei Hsu