Abstract: An apparatus for applying adhesive to the surface of expanded resin panels by means of a gluing roller, comprising a conveyor for feeding a panel, which is arranged upstream of the gluing roller, and a conveyor for receiving the panel, which is arranged downstream of the gluing roller, the conveyors being mutually aligned on a supporting framework so as to have adjacent ends, and means for moving the conveyors between a lowered position and a raised position, the means being controlled by an element for detecting a panel conveyed by the feeding conveyor so as to lift or lower the conveyors to a level at which the surface of the gluing roller is substantially in tangent contact with the panel in order to apply thereon a layer of adhesive.