Abstract: The present application relates to an apparatus (10) for laser processing, comprising at least two laser sources, which are different from one another and are configured for supplying respective laser beams having wavelengths different from one another, a laser head (20), which can be operated as end tool of a laser machine tool (90) that can be configured for carrying out at least one type of laser processing operation that can be selected from a set of types of laser processing operations, and a set of orientable optical components (16) so as to provide a set of selectable optical paths for directing a laser beam supplied by a laser source of said at least two laser sources, and a control unit (30) coupled to the at least two laser sources, to the set of orientable optical components (16), and to the laser head (20) and configured for controlling the at least two laser sources, the set of orientable optical components (16), and the laser head (20) according to the type of laser processing operation selected

Abstract: Laser operating machine for additive manufacturing of objects by laser sintering, comprising a transport structure (11), which is movable in a work space (100), operating according to a first system of movement axes (X, Y, Z) and configured to support one or more nozzles (34) for lid emitting sintering powder jets to be sintered on a work substrate (100, 110) and an optical laser assembly (20) for conveying a laser beam (L) in a laser spot (S) focused on said work substrate (100, 110) to sinter said powders, According to the invention, said optical laser assembly (20) is integrally associated with said transport structure (11) and a movable element (12) is also integrally associated with said transport structure (11) operating according to a second system of movement axes (u, v), said movable element (12) comprising a tool-carrier frame (30), on which one or more nozzles (34) for emitting sintering powder jets are arranged, associated with said second system of movement axes (u,v) and movable with respect to

Abstract: A laser-diode device includes a substrate; at least one first cladding layer placed on the substrate; an active layer placed on the first cladding layer and arranged to emit a radiation; at least one second cladding layer placed on the active layer, said cladding layers being adapted to form a heterojunction; a first terminal facet and a second terminal facet placed transversally relative to the cladding layers and to the active layer; a periodic structure, placed in proximity to the second terminal facet and within the second cladding layer, and belonging to an optical cavity, wherein the first terminal facet represents the output mirror from which the radiation generated by the active layer exits, and the second terminal facet, integrated by the periodic structure, represents a second mirror having high reflectivity, so that the radiation produced by the active layer exits almost totally through the first mirror.

Abstract: A laser-diode device includes a substrate; at least one first cladding layer placed on the substrate; an active layer placed on the first cladding layer and arranged to emit a radiation; at least one second cladding layer placed on the active layer, said cladding layers being adapted to form a heterojunction; a first terminal facet and a second terminal facet placed transversally relative to the cladding layers and to the active layer; a periodic structure, placed in proximity to the second terminal facet and within the second cladding layer, and belonging to an optical cavity, wherein the first terminal facet represents the output mirror from which the radiation generated by the active layer exits, and the second terminal facet, integrated by the periodic structure, represents a second mirror having high reflectivity, so that the radiation produced by the active layer exits almost totally through the first mirror.

Abstract: Laser operating machine for additive manufacturing of objects by laser sintering, comprising a transport structure (11), which is movable in a work space (100), operating according to a first system of movement axes (X, Y, Z) and configured to support one or more nozzles (34) for lid emitting sintering powder jets to be sintered on a work substrate (100, 110) and an optical laser assembly (20) for conveying a laser beam (L) in a laser spot (S) focused on said work substrate (100, 110) to sinter said powders, According to the invention, said optical laser assembly (20) is integrally associated with said transport structure (11) and a movable element (12) is also integrally associated with said transport structure (11) operating according to a second system of movement axes (u, v), said movable element (12) comprising a tool-carrier frame (30), on which one or more nozzles (34) for emitting sintering powder jets are arranged, associated with said second system of movement axes (u,v) and movable with respect to

Abstract: A method for monitoring the quality of laser-machining processes (500), in particular laser-cutting or laser-welding processes, including the operations of: acquiring via sensor means (540), in particular optical sensors, a machining-process signal (Xp) and calculating from said signal representing the process (Xp) parameters (E1, E2, DC) that represent the machining quality during the laser-machining process; and making available (130) corresponding reference parameters (E1r, E2r, DCr) representing a given machining quality, which are calculated from a process reference signal (Xr) acquired via said sensor means (540).

Abstract: A method for monitoring the quality of laser-machining processes (500), in particular laser-cutting or laser-welding processes, including the operations of: acquiring via sensor means (540), in particular optical sensors, a machining-process signal (Xp) and calculating from said signal representing the process (Xp) parameters (E1, E2, DC) that represent the machining quality during the laser-machining process; and making available (130) corresponding reference parameters (E1r, E2r, DCr) representing a given machining quality, which are calculated from a process reference signal (Xr) acquired via said sensor means (540).