Abstract: Semiconductor devices are arranged in a chain extending in a longitudinal direction have mutually facing end sides transverse the longitudinal direction and are coupled via tie bars located at the mutually facing end sides. The tie bars are provided with anchoring tips penetrating into an insulating package at mutually facing end sides of the devices. The tie bars can be deformed to extract the anchoring tips from the insulating package at the mutually facing end sides of the devices. Individual singulated devices are thus produced in response to the anchoring tips being extracted from the mutually facing end sides of the devices.

Abstract: Semiconductor devices comprising at least one electrically conductive metal element in a non-conductive package material are manufactured by: providing a first metal layer having a smooth morphology for covering the aforesaid metal element; and providing a second metal layer for covering partially the first layer, leaving at least one portion of the surface of the first layer exposed, the second layer having a rough morphology. There may moreover be provided a die pad for mounting a semiconductor die by providing the aforesaid first layer for covering the die pad and attaching a semiconductor die on the die pad in contact with said first layer.

Abstract: An assembly structure for an electronic integrated power circuit, which circuit is fabricated on a semiconductor die having a plurality of contact pads associated with said integrated circuit and connected electrically to respective leads of said structure, wherein a shield element is coupled thermally to said die by a layer of an adhesive material.

Abstract: The optical communication module can be coupled to at least one optical fiber and includes at least one optoelectronic device, a base portion, and a cover portion which can be connected to the base portion to define an internal chamber to house the optoelectronic device. The cover portion includes at least one window to couple at least one optical signal between the at least one device and the optical fiber. The module further includes a plate, substantially transparent to the optical signal, having a first side facing the cover portion and a second side facing the internal chamber, the first plate substantially enabling sealing of the window. A shielding plate can be connected to the second side and provided with at least one opening substantially aligned with the window to enable passage of the optical signal.

Abstract: The optical communication module can be coupled to at least one optical fiber and includes at least one optoelectronic device, a base portion, and a cover portion which can be connected to the base portion to define an internal chamber to house the optoelectronic device. The cover portion includes at least one window to couple at least one optical signal between the at least one device and the optical fiber. The module further includes a plate, substantially transparent to the optical signal, having a first side facing the cover portion and a second side facing the internal chamber, the first plate substantially enabling sealing of the window. A shielding plate can be connected to the second side and provided with at least one opening substantially aligned with the window to enable passage of the optical signal.

Abstract: A lead-frame for electronic devices is proposed; the lead-frame is produced from a metal plate and includes a bearing structure arranged in a first plane, and for each electronic device a support element spaced apart from the first plane having a first surface facing the bearing structure for mounting at least one chip and an opposed second surface for being exposed from the electronic device, the second surface being arranged in a second plane, and a plurality of interconnection elements connecting the support element to the bearing structure. For each electronic device the lead-frame further includes an intermediate area between the support element and the interconnection elements, the intermediate area being arranged in a third plane between the first and the second planes.

Abstract: An assembly structure for an electronic integrated power circuit, which circuit is fabricated on a semiconductor die having a plurality of contact pads associated with said integrated circuit and connected electrically to respective leads of said structure, wherein a shield element is coupled thermally to said die by a layer of an adhesive material.

Abstract: The invention includes a multichip integrated circuit package having at least two chips electrically isolated from one another. Within the multichip integrated circuit package is a slug that is directly coupled to at least two chips, without any intervening insulating layers. The slug is physically separated at an appropriate place between the two chips, so that electrical interference between the two chips is effectively eliminated. Making the integrated circuit package begins with directly attaching the two chips to a heat dissipating slug. The heat dissipating slug can have a pre-cut groove running between the chips. Once the chips are attached to the slug, the slug is molded into the multichip integrated circuit package. Then, the slug is physically separated into two pieces from the underside, the separation running along the pre-cut groove. Usually the slug would be separated by being cut by a saw.

Abstract: A structure is disclosed which comprises a metal plate, a chip of a semiconductor material attached to the plate, terminal leads, interconnection wires between the leads and the metallized regions of the chip, and a polymer body encapsulating all this with the exception of a surface of the plate and part of the leads. To achieve improved bond between the polymer and the metal, predetermined areas of the plate and the leads have a higher roughness than 1 (R.sub.a .gtoreq.1 .mu.m).

Abstract: A process for making an electronic device structure which comprises a metal plate, a semiconductor material chip attached to the plate, terminal leads, interconnection wires between the leads and metallized regions of the chip, and a plastic body which encapsulates the whole with the exception of a surface of the plate and part of the leads. This structure has means of electrical connection between at least one metallized region and the metal plate which comprise at least one metal beam resting onto the plate and being attached thereto by studs integral with the plate, and at least one wire welded between a metallized region of the chip and the metal beam between the studs. At least a portion of the beam and its connection wire are encapsulated within the plastics body.

Abstract: A leadframe for electronic semiconductor devices incorporates one or two metal bars fastened to a heat dissipator by electroconductive means.Each bar has a metallized area for the electric connection, by means of a bonding wire, with a semiconductor chip placed on the dissipator.According to the present invention, the metallized areas are lowered in relation to the upper surface of the metal bar, so that lead frames can be stacked, during packing and transportation, directly on each other without danger of damaging the metallized areas.

Abstract: A combination of an electronic semiconductor device comprising a metal plate and a plastics body which encapsulates the metal plate leaving at least a major surface thereof exposed, a heat sink, and means of fastening the heat sink to the device. To enable securement of the heat sink on the device without any external fastening arrangement having to be used, and without unduly straining the solder spot of the device pins to a printed circuit, the device is provided with undercut regions on opposite sides adjacent to the exposed surface of the plate for releasable engagement by the fastening means.

Abstract: A mold is disclosed for semiconductor devices intended for surface mounting, being of a type which comprises a metal plate and a body of solidified plastic resin. It consists of two plates which delimit at least one hollow adapted to receive the plate and to contain resin for forming the device body. Two elements of the mold push the plate from opposed sides against the bottom of the hollow. The hollow has two side extensions which are delimited by the side surfaces of the plate edges, thereby solidified projections are formed thereon which separate readily after the molding process. Thus, a structure is obtained wherein the plate has its bottom surface and two side edge portions fully exposed to allow optimum and controllable soldering to a printed circuit board.

Abstract: A die-stamped frame is fastened to a heat sink metal baseplate by wedging flexible tabs into receiving indentations of the baseplate while keeping the frame substantially in contact with the surface of the baseplate. The wire welding operations may then take place on the end of the fingers of the patterned metal frame while the same are solidly resting on the surface of the baseplate thus facilitating the welding. The backing-off of the metal frame from the surface of the heat sink baseplate takes place upon the closing of the mold used for encapsulating in resin the device. The injection of the resin and its solidification "freezes" the pins in the backed-off position imposed by the mold upon closing, thus ensuring the electrical isolation between the pins and the integral heat sink baseplate.

Abstract: A modular construction power circuit arrangement is disclosed which comprises a thin metal plate performing holder and heat sink functions, a multiplicity of electronic devices in the form of semiconductor material chips having metalized pads as their terminals, a printed circuit board attached to the thin metal plate, electric conductors between the metalized pads and the printed circuit on the board, terminating connectors which form a part of the printed circuit board for connecting the circuit arrangement to external circuits, and a plastics material body which conglomerates a portion of the thin metal plate, the semiconductor material chips, and the printed circuit board. At least one of the semiconductor material chips is attached directly to the thin metal plate and extends therefrom through an opening in the printed circuit board.

Abstract: An electronic device structure which comprises a metal plate, a semiconductor material chip attached to the plate, terminal leads, interconnection wires between the leads and metallized regions of the chip, and a plastic body which encapsulates the whole with the exception of a surface of the plate and part of the leads. This structure has highly reliable means of electrical connection between at least one metallized region and the metal plate which comprise at least one metal beam resting onto the plate and being attached thereto by studs integral with the plate, and at least one wire welded between a metallized region of the chip and the metal beam between the studs. At least a portion of the beam and its connection wire are encapsulated within the plastics body.

Abstract: A die-stamped frame is fastened to a heat sink metal baseplate by wedging flexible tabs into receiving indentations of the baseplate while keeping the frame substantially in contact with the surface of the baseplate. The wire welding operations may then take place on the end of the fingers of the patterned metal frame while the same are solidly resting on the surface of the baseplate thus facilitating the welding. The backing-off of the metal frame from the surface of the heat sink baseplate takes place upon the closing of the mold used for encapsulating in resin the device. The injection of the resin and its solidification "freezes" the pins in the backed-off position imposed by the mold upon closing, thus ensuring the electrical isolation between the pins and the integral heat sink baseplate.

Abstract: A process for the depolymerization and supersulfation of heparin and the so obtained supersulfated heparins are disclosed. The process comprises treating heparin with oleum containing from 2 to 6% free sulfuric anhydride at a temperature from -10.degree. to +20.degree. C. The obtained heparins have molecular weights from 2000 to 5000 and a sulfation degree from 3.4 to 4.3. All of them are endowed with a remarkable antithrombotic activity.

Abstract: A process for preparing L-carnitine (I) wherein(a) diketene (II) is reacted with chlorine, and the chlorination product thus obtained is submitted to amidation by the methylester of an optically-active aminoacid, having formula: ##STR1## wherein R=CH.sub.2 A.sub.r or A.sub.

Abstract: A process for preparing .alpha.-L-aspartyl-L-phenylalanine methyl ester: ##STR1## in which: (a) the compound methyl N(.alpha.-L-aspartyl).alpha.-aminocinnamate, protected at the nitrogen, of formula: ##STR2## where R is a protector group at the nitrogen, is subjected to hydrogenation at the olefin bond by means of gaseous hydrogen in the presence of a hydrogenation catalyst, to give the compound of formula: ##STR3## where R has the aforesaid meaning, in the form of a mixture of .alpha.-L-aspartyl-L-phenylalanine methyl ester protected at the nitrogen, and .alpha.-L-aspartyl-D-phenylalanine methyl ester protected at the nitrogen;(b) the protector group is removed from the .alpha.-L-aspartyl-L-phenylalanine and .alpha.-L-aspartyl-D-phenylalanine methyl esters protected at the nitrogen;(c) the .alpha.-L-aspartyl-L-phenylalanine methyl ester is separated and recovered from the deprotection reaction product.