Abstract: A SIM module includes a SIM and a plastic support on which the SIM is attached. A discontinuity channel between the plastic support and the SIM is formed all around the SIM, the discontinuity channel being interrupted in at least two points of the plastic support attaching the SIM to the plastic support. The points are on a short side and on a long side of the SIM.

Abstract: A SIM card adapter assembly is to adapt a SIM card to a SIM slot. The adapter assembly includes a SIM card plastic support including a first portion of a predetermined thickness. The SIM card is removably attached and a second portion has an increased thickness wherein at least one adapter is removably attached.

Abstract: A SIM card adapter assembly is to adapt a SIM card to a SIM slot. The adapter assembly includes a SIM card plastic support including a first portion of a predetermined thickness. The SIM card is removably attached and a second portion has an increased thickness wherein at least one adapter is removably attached.

Abstract: A method for realizing a dual interface IC card includes arranging a plastic support having a hole or a recess for housing a micro module, and housing in the IC card an antenna having at least one first and one second terminal or pad for connection to the micro module arranged in the recess. The method also includes distributing a soldering paste on the at least one first and one second pad, so as to form a first and a second contact conductive bump with electric connection contacts of the micro module, and distributing, along the whole perimeter of the micro module or of the recess, a layer of non conductive glue. The method further includes positioning the micro module in the recess with the contacts axially aligned to the terminal of the antenna, and executing a reflow of the soldering paste to form the first and second conductive bump.

Abstract: A method for realizing a dual interface IC card includes arranging a plastic support having a hole or a recess for housing a micro module, and housing in the IC card an antenna having at least one first and one second terminal or pad for connection to the micro module arranged in the recess. The method also includes distributing a soldering paste on the at least one first and one second pad, so as to form a first and a second contact conductive bump with electric connection contacts of the micro module, and distributing, along the whole perimeter of the micro module or of the recess, a layer of non conductive glue. The method further includes positioning the micro module in the recess with the contacts axially aligned to the terminal of the antenna, and executing a reflow of the soldering paste to form the first and second conductive bump.

Abstract: A plated module is for an IC card and includes a printed circuit having a plurality of conductive areas, delimited by a network of insulating channels, for covering an integrated circuit chip intended to be hosted in a recess of a plastic support of the IC card. At least some of the conductive areas are connected to a corresponding contact points of the integrated circuit chip. At least some of the conductive areas are linked to corresponding extended areas by one or more bridges. The conductive areas are separated from the extended areas by an insulating channel crossed by the bridges. The insulating channels surround the conductive areas as a protection frame for the contact points. At least a major side of at least one of the conductive areas may be curved. Several of the advanced extended areas form a rounded border of the plated module.

Abstract: A plated module is for an IC card and includes a printed circuit having a plurality of conductive areas, delimited by a network of insulating channels, for covering an integrated circuit chip intended to be hosted in a recess of a plastic support of the IC card. At least some of the conductive areas are connected to a corresponding contact points of the integrated circuit chip. At least some of the conductive areas are linked to corresponding extended areas by one or more bridges. The conductive areas are separated from the extended areas by an insulating channel crossed by the bridges. The insulating channels surround the conductive areas as a protection frame for the contact points. At least a major side of at least one of the conductive areas may be curved. Several of the advanced extended areas form a rounded border of the plated module.

Abstract: An IC card includes a plated or protective module including a printed circuit having a plurality of conductive areas, delimited by a network of insulating channels, for covering an integrated circuit chip, a plastic support with a recess intended to host the plated module and the integrated circuit chip, with at least some of the conductive areas connected to corresponding contact points on the integrated circuit chip. A plurality of extended areas are linked to a corresponding conductive areas by one or more bridges. A couple of advanced extended areas form a rounded border of the plated module. Advanced extended areas are linked to conductive areas not connected to contact points. Advanced extended areas wrap around the extended areas and form the opposite rounded sides of the plated module.