Abstract: A technique of manufacturing an elastomeric container closure or plunger with embedded functional components to avoid thermal damage to the components is described. The technique includes molding a drug-contacting part from a first material at a first temperature and for a first length of time defining a first thermal exposure; after molding the drug-contacting part, inserting ancillary components into the drug-contacting part, where the ancillary components have an operational thermal budget less than the first thermal exposure; and overmolding the drug-contracting part and the ancillary components with a second material at a second temperature for a second length of time to form a non-drug-contacting part that mechanically connects the non-drug-contacting part and the drug-contacting part to form the elastomeric container closure and seals the ancillary components inside the elastomeric container closure.

Abstract: The present disclosure relates to a method of determining or estimating a burst pressure resistance of a batch of medicament containers, wherein each medicament container of the batch of medicament containers includes a vitreous barrel filled with a liquid substance and is sealed by a stopper slidably disposed inside of the vitreous barrel. The method includes applying a mechanical impact of a predefined magnitude onto the stopper of each medicament container of a subset of the batch of medicament containers, determining a breakage rate of vitreous barrel of the subset of the batch of medicament containers that are mechanically damaged by the mechanical impact, and deriving the burst pressure resistance of the batch of medicament containers based on the breakage rate of the vitreous barrels mechanically damaged by the mechanical impact.

Abstract: A technique of manufacturing an elastomeric container closure or plunger with embedded functional components to avoid thermal damage to the components is described. The technique includes molding a drug-contacting part from a first material at a first temperature and for a first length of time defining a first thermal exposure; after molding the drug-contacting part, inserting ancillary components into the drug-contacting part, where the ancillary components have an operational thermal budget less than the first thermal exposure; and overmolding the drug-contracting part and the ancillary components with a second material at a second temperature for a second length of time to form a non-drug-contacting part that mechanically connects the non-drug-contacting part and the drug-contacting part to form the elastomeric container closure and seals the ancillary components inside the elastomeric container closure.

Abstract: A container containing a therapeutic protein, characterized in that chaperones molecules are bound by a molecular linker to an inner surface of the container. The linker being interposed between the surface and the chaperone.

Abstract: This invention relates to components useful for medical articles, such as a syringe assemblies, having sliding contact surface (s) coated with at least one coating layer, wherein the contact surface has an average surface roughness (Ra) ranging from about 10 nm to about 1700 nm and/or the coating layer has crystalline domains, the mass of the crystalline domains being at least about 20% of the total mass of the coating layer, and methods of making the same.

Abstract: A container containing a therapeutic protein, characterized in that chaperones molecules are bound by a molecular linker to an inner surface of the container. The linker being interposed between the surface and the chaperone.

Abstract: The present invention concerns a methods and compositions for preparing a multi layer composite device, such as a semiconductor device. Said method comprises (A) forming a dielectric layer on the surface of a composite material by bringing said surface into contact: a) either with a solution, comprising the diazonium salt of aniline, a diazonium salt bearing at least one functional group or an amine compound of formula H2N-A-X—Z as defined in claim 1: b) or with a first solution containing an aryl diazonium salt and successively a second solution containing a compound bearing at least one functional group and bearing at least one functional group capable of reacting with the aryl radical grafted on the surface of the composite material thanks to the aryl diazonium salt; (B) forming an overlayer on said surface of said composite material obtained in step (A), said overlayer consisting of a Si-containing dielectric Cu-Etch Stop Layer and/or copper diffusion barrier.

Abstract: The present invention concerns a methods and compositions for preparing a multi layer composite device, such as a semiconductor device. Said method comprises (A) forming a dielectric layer on the surface of a composite material by bringing said surface into contact: a) either with a solution, comprising the diazonium salt of aniline, a diazonium salt bearing at least one functional group or an amine compound of formula H2N-A-X-Z as defined in claim 1: b) or with a first solution containing an aryl diazonium salt and successively a second solution containing a compound bearing at least one functional group and bearing at least one functional group capable of reacting with the aryl radical grafted on the surface of the composite material thanks to the aryl diazonium salt; (B) forming an overlayer on said surface of said composite material obtained in step (A), said overlayer consisting of a Si-containing dielectric Cu-Etch Stop Layer and/or copper diffusion barrier.