Abstract: A pivoting-connection device connecting at least two components and comprising a clevis having first and second branches, an arm positioned between the first and second branches of the clevis, a cylindrical pin connecting the clevis and the arm, at least one guide ring which has a flange configured to bear against an interior face of the first branch, an immobilizing system configured to occupy a free state and a blocked state in which the cylindrical pin and the guide ring are immobilized with respect to one another in the longitudinal direction, in both senses of that direction, and a blocking system configured to occupy an unfitted state and a blocked state in which the blocking system is in contact with the exterior face of the first branch.

Abstract: A product image evaluation system. In embodiments, the system comprises or interacts with a product database comprising a product information record that comprises a product identifier and a product category for a product, and an image database comprising a plurality of candidate images for the product. In embodiments the image database can comprise images received from a plurality of different sources. The system can comprise a parameterized grouping engine configured to separate images into groups of similar images, an image selector configured to select one or more images from each group, and an image sorter configured to determine an order of the selected images. Embodiments can distill the superset of all available images to provide a set of images that are “sufficiently different” from each other and satisfy quality requirements. As a result, no images containing unique information are left behind, and images containing duplicate or irrelevant information are discarded.

Abstract: Using a convolutional neural network, a method for digitizing and extracting meaning from graphic objects such as bar and pie charts, decomposes a chart into its sub-parts (pie and slices or bars, axes and legends) with significant tolerance to the wide range of variations in shape and relative position of pies, bars, axes and legends. A linear regression calibration allows properly reading values even when there are many OCR failures.

Abstract: A method for dimensioning of panels stiffened by triangular pockets that make it possible to take into account aeronautical specifics and more particularly the stresses that are admissible for the different types of buckling and the calculations of adapted reserve factors is presented. The method relates to dimensioning of a substantially plane panel of homogeneous and isotropic material by an analytical procedure, wherein the panel is composed of a skin reinforced by an assembly of three parallel bundles of stiffeners integrated with the panel, and triangular pockets defined on the skin, the stiffeners are strip-shaped and the panel must satisfy a specification of mechanical resistance to predetermined external loads, including steps organized in such a way that they can be repeated iteratively for different values of input data until reserve factors are obtained to determine the dimensions and arrangement of the panel elements necessary to obtain the imposed mechanical resistance.

Abstract: The invention relates to a method for dimensioning, by an analytical method, of an essentially plane panel consisting of a homogenous and isotropic material, said panel consisting of a skin reinforced by a set of three parallel bundles of stiffeners built into the panel. The pockets determined on the skin by said groups of stiffeners are triangular, the stiffeners are blade shaped and the stiffened panel must comply with specifications for mechanical resistance to predetermined external loads, the angles between bundles of stiffeners being such that the triangular pockets have any kind of isosceles form.

Abstract: A method for the computerized simulation of mechanical deformation is provided. The method makes it possible to define a strain gauge in a model of a mechanical structure in order to calculate the deformation at said gauge. The method makes it possible to simulate at will the measurement result of a strain gauge in a mechanical structure model.

Abstract: A stiffened structure includes stiffeners (14.1, 14.2, 14.3) and nodes (12) at which three stiffeners (14.1, 14.2, 14.3) of different directions intersect, with the surfaces of the stiffeners (14.1, 14.2, 14.3) being arranged in planes that are perpendicular to the same plane, whereby the stiffened structure includes at least one opening (26) and is characterized in that the opening (26) is surrounded by a hexagonal belt, formed by peripheral stiffeners (40).

Abstract: The invention relates to a method for dimensioning, by an analytical method, of an essentially plane panel consisting of a homogenous and isotropic material, said panel consisting of a skin reinforced by a set of three parallel bundles of stiffeners built into the panel. The pockets determined on the skin by said groups of stiffeners are triangular, the stiffeners are blade shaped and the stiffened panel must comply with specifications for mechanical resistance to predetermined external loads, the angles between bundles of stiffeners being such that the triangular pockets have any kind of isosceles form.

Abstract: A stiffened structure includes stiffeners (14.1, 14.2, 14.3) and nodes (12) at which three stiffeners (14.1, 14.2, 14.3) of different directions intersect, with the surfaces of the stiffeners (14.1, 14.2, 14.3) being arranged in planes that are perpendicular to the same plane, whereby the stiffened structure includes at least one opening (26) and is characterized in that the opening (26) is surrounded by a hexagonal belt, formed by peripheral stiffeners (40).

Abstract: Non invasive method used to detect a “sonic imprint” of three-dimensional objects, particularly suitable for the identification and monitoring of artworks, consisting in acquiring the vibrations caused by a source of elastic waves and using a set of detectors fixed in various predetermined points of the external surface of the object. An apparatus, cheap and simple to utilize, suitable to execute this method, is also described.

Abstract: Non invasive method used to detect a “sonic imprint” of three-dimensional objects, particularly suitable for the identification and monitoring of artworks, consisting in acquiring the vibrations caused by a source of elastic waves and using a set of detectors fixed in various predetermined points of the external surface of the object. An apparatus, cheap and simple to utilize, suitable to execute this method, is also described.

Abstract: The present invention relates generally to a panel lifting device. More particularly, the invention encompasses a method and an apparatus for quickly and securely lifting panels. The invention further includes the option of the apparatus being foldable and/or modular for easy transportation from one location to another location.

Abstract: A process wherein thermal material such as a paste or gel is confined within a paste gap between a surface of a flat cooling plate and an opposing surface of a chip mounted on a surface of a chip carrier or substrate by forming a partition, preferably in the form of a grid, at the periphery of one or more chips. The partition is located laterally in sufficient proximity to the chip and in communication with the paste gap to form a capillary and thus confine motion of a viscous thermal material to repetitive bidirectional flow out of and into the paste gap with relative motion of the chip and the surface of the flat cooling plate. The grid is preferably fitted closely within grooves formed in the surface of the flat cooling plate and preferably supported by leaf springs so that thermal material is confined within cells of the grid while providing support and/or damping of relative motion between the flat cooling plate and the substrate or carrier.

Abstract: An electronic module is provided comprising integrated circuit chips mounted on a substrate and having a specially designed cooling plate overlying the chip producing a gap above about 1 mil and a thermal paste or thermal adhesive between the cooling plate and the chip to facilitate heat transfer from the chip to the cooling plate. The cooling plate has a roughened area made by grit blasting and the like and having a roughness of about 0.4 to 6.4 microns or comprising a plurality of channels and corresponding protrusions overlying the chip area which roughened area penetrates the thermal paste and thermal adhesive and improves the adhesion and inhibits the flow of thermal paste from between the lower surface of the cooling plate and the upper surface of the chip during operation of the electronic module.

Abstract: The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by varying the depth of thermal compound filled gap or the blind hole that is above each chip.

Abstract: An electronic module is provided comprising integrated circuit chips mounted on a substrate and having a specially designed cooling plate overlying the chip producing a gap above about 1 mil and a thermal paste or thermal adhesive between the cooling plate and the chip to facilitate heat transfer from the chip to the cooling plate. The cooling plate has a roughened area made by grit blasting and the like and having a roughness of about 0.4 to 6.4 microns or comprising a plurality of channels and corresponding protrusions overlying the chip area which roughened area penetrates the thermal paste and thermal adhesive and improves the adhesion and inhibits the flow of thermal paste from between the lower surface of the cooling plate and the upper surface of the chip during operation of the electronic module.

Abstract: The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by varying the depth of thermal compound filled gap or the blind hole that is above each chip.

Abstract: The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.

Abstract: A thermal conduction module comprises a base plate for holding a chip substrate, an integrated circuit chip substrate mounted in the base plate and a cover plate having a surface facing the chip substrate. A movable spacer is secured adjacent to the periphery of the cover plate or the base plate, and is adjustable to a predetermined distance away from the cover plate or base plate. A gap for insertion of a thermally conductive paste may be created between chips mounted on the substrate and the cover plate surface facing the chip substrate by adjustment of the spacer to a desired distance from the cover plate or base plate.

Abstract: Thermal material such as a paste or gel is confined within a paste gap between a surface of a flat cooling plate and an opposing surface of a chip mounted on a surface of a chip carrier or substrate by forming a partition, preferably in the form of a grid, at the periphery of one or more chips. The partition is located laterally in sufficient proximity to the chip and in communication with the paste gap to form a capillary and thus confine motion of a viscous thermal material to repetitive bidirectional flow out of and into the paste gap with relative motion of the chip and the surface of the flat cooling plate. The grid is preferably fitted closely within grooves formed in the surface of the flat cooling plate and preferably supported by leaf springs so that thermal material is confined within cells of the grid while providing support and/or damping of relative motion between the flat cooling plate and the substrate or carrier.