Abstract: A transparent force sensor for use in touch panel displays (touch screens) and method for fabricating the same are disclosed. The transparent force sensor is capable of detecting touch by measuring local pressure applied by a touch input to a display area of the touch screen.

Abstract: Methods and apparatus are provided for manipulating content displayed on a touch screen utilizing a transparent pressure-sensing touch panel. A method comprises displaying content on the touch screen and obtaining one or more pressure metrics for an input gesture on the transparent pressure-sensing touch panel. Each pressure metric corresponds to pressure (or force) applied to the transparent pressure-sensing touch panel by a respective impression of the input gesture. The method further comprises adjusting the displayed content on the touch screen in response to the input gesture, wherein the displayed content is adjusted based on to the one or more pressure metrics for the input gesture.

Abstract: A transparent force sensor for use in touch panel displays (touch screens) and method for fabricating the same are disclosed. The transparent force sensor is capable of detecting touch by measuring local pressure applied by a touch input to a display area of the touch screen.

Abstract: Methods and apparatus are provided for manipulating content displayed on a touch screen utilizing a transparent pressure-sensing touch panel. A method comprises displaying content on the touch screen and obtaining one or more pressure metrics for an input gesture on the transparent pressure-sensing touch panel. Each pressure metric corresponds to pressure (or force) applied to the transparent pressure-sensing touch panel by a respective impression of the input gesture. The method further comprises adjusting the displayed content on the touch screen in response to the input gesture, wherein the displayed content is adjusted based on to the one or more pressure metrics for the input gesture.

Abstract: A material (100) includes a transparent matrix (102) comprising at least one polymer material, and a plurality of transparent conducting particles (104) dispersed in the transparent matrix (102). The material (100) may be disposed between an array of conductive intersects to form a transparent piezoresistive sensor (300, 602). A controller (606) is coupled to the transparent piezoresistive sensor (300, 602) for sensing (702, 802, 902) a change in resistance when pressure is applied to the transparent matrix. One or more pressure levels and/or one or more locations may be sensed (704, 804, 904) to enable a function.

Abstract: A method of forming III-V epitaxy on a germanium-on-insulator (GOI) substrate having a bonded layer and a handle substrate begins with measuring a lattice parameter of the bonded layer at a first temperature. The lattice parameter of the bonded layer, which is a function of a coefficient of thermal expansion (CTE) of the handle substrate, is then calculated at an epitaxial growth temperature. An epitaxial composition is selected from a class of III-V material for epitaxial growth overlying the bonded layer, wherein the selected epitaxial composition is adjusted to have a lattice parameter that approximates the calculated lattice parameter of the bonded layer at the epitaxial growth temperature. An epitaxial layer can then be grown over the bonded layer with use of the adjusted epitaxial composition, producing a substantially defect-free III-V epitaxial layer. Furthermore, an improved defectivity is claimed when the epitaxial layer's CTE is approximately similar to that of the handle substrate.

Abstract: Methods and apparatus are provided for depositing a layer of pure germanium can on a silicon substrate. This germanium layer is very thin, on the order of about 14 ?, and is less than the critical thickness for pure germanium on silicon. The germanium layer serves as an intermediate layer between the silicon substrate and the high k gate layer, which is deposited on the germanium layer. The germanium layer helps to avoid the development of an oxide interfacial layer during the application of the high k material. Application of the germanium intermediate layer in a semiconductor structure results in a high k gate functionality without the drawbacks of series capacitance due to oxide impurities. The germanium layer further improves mobility.

Abstract: A method for forming an air region or an air bridge overlying a base layer (12). Air regions (20a, 20b, 28a, and 48) are formed overlying the base layer (12) to provide for improved dielectric isolation of adjacent conductive layers, provide air-isolated conductive interconnects, and/or form many other microstructures or microdevices. The air regions (20a, 20b, 28a, and 48) are formed by either selectively removing a sacrificial spacer (16a and 16b) or by selectively removing a sacrificial layer (28, 40). The air regions (20a, 20b, 28a, and 48) are sealed, enclosed, or isolated by either a selective growth process or by a non-conformal deposition technique. The air regions (20a, 20b, 28a, and 48) may be formed under any pressure, gas concentration, or processing condition (i.e. temperature, etc.). The air regions (20a, 20b, 28a, and 48) may be formed at any level within an integrated circuit.

Abstract: A method for forming an air region or an air bridge overlying a base layer (12). Air regions (20a, 20b, 28a, and 48) are formed overlying the base layer (12) to provide for improved dielectric isolation of adjacent conductive layers, provide air-isolated conductive interconnects, and/or form many other microstructures or microdevices. The air regions (20a, 20b, 28a, and 48) are formed by either selectively removing a sacrificial spacer (16a and 16b) or by selectively removing a sacrificial layer (28, 40). The air regions (20a, 20b, 28a, and 48) are sealed, enclosed, or isolated by either a selective growth process or by a non-conformal deposition technique. The air regions (20a, 20b, 28a, and 48) may be formed under any pressure, gas concentration, or processing condition (i.e. temperature, etc.). The air regions (20a, 20b, 28a, and 48) may be formed at any level within an integrated circuit.

Abstract: A method for making a semiconductor device having an anhydrous ferroelectric thin film obtained from an anhydrous sol-gel solution. An anhydrous PZT sol-gel solution is prepared from Lead (II) Acetate Anhydrous which is thermally reacted with Zirconium and Titanium precursors to form a gel condensate. The sol-gel condensate is prepared without hydrolyzing the sol-gel solution to obtain precursor complexes which do not contain water. The formulation of the sol-gel exclusively by thermal condensation and in the absence of hydrolysis yields an anhydrous amorphous sol-gel having a uniform condensate composition. The anhydrous PZT thin film formed by the anhydrous sol-gel exhibits improved durability and substantially complete low-temperature conversion to the perovskite crystalline phase.

Abstract: A method for patterning a conductive metal oxide film on a substrate surface by means of an oxygen plasma etching process. In one embodiment, a substrate (10) is provided having a ruthenium oxide layer (14) overlying a dielectric layer (12). The substrate is placed on an electrode (24) positioned in a vacuum chamber (20) and the vacuum chamber is evacuated to a low pressure. Oxygen gas is introduced to the vacuum chamber and RF power is applied to form an oxygen plasma within the vacuum chamber. The oxygen plasma preferentially etches the ruthenium oxide layer (14) and does not etch the underlying dielectric layer (12). The oxygen plasma etching process can be used to form high resolution ruthenium oxide features during semiconductor device fabrication of ferroelectric capacitors (60) and other electronic components.