Abstract: A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.

Abstract: In a communications device having a physical layer device and a processing device connected to the physical layer device, the number of input/output (I/O) ports required for communication between the devices in the gigabit range is substantially reduced by utilizing millivolt differential I/O drivers and receivers. In addition, a calibration feedback loop synchronizes the data and clock signals on the processing device, thereby eliminating the need to recover the clock on the processing device.

Abstract: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.

Abstract: A device module may be used to carry a plurality of devices, such as memory devices or other components. The device module may include a board, a first set of contact points, and a second set of contact points. A plurality of signal paths may be provided on the board, where each signal path extends between a contact point in the first set and a contact point in the second set. Each of the plurality of signal paths has substantially an identical length and a same number of turns on the board.

Abstract: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.

Abstract: A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.

Abstract: An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.

Abstract: Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.

Abstract: Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.

Abstract: A cost effective, high performance, IC package assembly of the present invention comprises stair-stepped layers of redistribution circuits from at least one chip to terminals on any of multiple surfaces and levels of the IC package assembly. Critical path circuits of the assembly have no plated vias and are directly routed from interconnection terminals which are used to interconnect the package to the IC chip terminals by flip chip or wire bond methods.

Abstract: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.

Abstract: The generation a search query based on information stored on a storage medium is described. According to one embodiment of the invention, search criteria is entered to perform a search of a storage medium of a client computer. The search of the storage medium determines a web search criteria. The client computer provides search results based on the web search criteria.

Abstract: A connector is described which uses a coupling structure integrally formed from a plurality of discrete elements that are aligned to receive an insertion force. In response to the insertion force affecting some or all of the elements, the affected elements move from an original state into a deflected state. In the deflected state, the overall thickness of the coupling structure is reduced. The relationship between the coupling structure and a dimension of a cavity that is to be occupied by the coupling structure is such that when the thickness of the coupling structure is reduced, the dimension of the cavity is increased.

Abstract: A device module may be used to carry a plurality of devices, such as memory devices or other components. The device module may include a board, a first set of contact points, and a second set of contact points. A plurality of signal paths may be provided on the board, where each signal path extends between a contact point in the first set and a contact point in the second set. Each of the plurality of signal paths has substantially an identical length and a same number of turns on the board.

Abstract: The waveshaping functions provided by a summing resistor network and filter are performed by a waveshaping circuit that can be integrated with transceiving functions within a single integrated circuit. The waveshaping circuit utilizes the edges of an oscillator signal to generate a series of pairs of logic signals which have a defined timing relationship with respect to an input data signal. Each pair of logic signals is then utilized by a corresponding number of current stages to provide both an incremental portion of an output waveform and an incremental portion of a complementary output waveform. The pair of output waveforms can then be produced by summing together all of the incremental portions of the pair of waveforms.

Abstract: A tunable filter (66) having a filter characteristic tracking an input signal in accordance with the invention includes a signal source (18) providing a variable frequency signal to be tracked by the filter characteristic; a frequency detector (62) coupled to the signal source for producing a detector output signal which is a function of the frequency of the variable frequency signal; a switching signal generator (64), responsive to the frequency detector output signal, for generating at least one switching signal having a variable frequency proportional to the detector output signal; a first capacitor (112, 126, 150, 152, 156 and 158) having a first terminal coupled to a reference potential and a second terminal; and a first switching circuit (114, 128, 154 and 160) having an input coupled to the variable frequency signal, responsive to the at least one switching signal, and in response to changes in level of the at least one switching signal alternately connecting the input of the first switching circuit to