Abstract: A method for wafer dicing and removing separated integrated circuit (IC) dies from a carrier substrate includes mounting a wafer on a substrate using an adhesive layer, laser scribing the adhesive layer to create defect regions in the adhesive layer, and performing a breaking step to separate the laser-scribed adhesive layer into separated adhesive portions corresponding to the IC dies. For a stealth-dicing (SD) technique, defect regions also are created in the wafer using a laser and the breaking step is an expansion step that simultaneously separates the dies and corresponding portions of adhesive. For a dice-before-grind (DBG) technique, the dies are separated by backside grinding before the breaking step. Efficient adhesive-layer separation is achieved with reduced backside chipping associated with conventional blade dicing.

Abstract: A method for wafer dicing and removing separated integrated circuit (IC) dies from a carrier substrate includes mounting a wafer on a substrate using an adhesive layer, laser scribing the adhesive layer to create defect regions in the adhesive layer, and performing a breaking step to separate the laser-scribed adhesive layer into separated adhesive portions corresponding to the IC dies. For a stealth-dicing (SD) technique, defect regions also are created in the wafer using a laser and the breaking step is an expansion step that simultaneously separates the dies and corresponding portions of adhesive. For a dice-before-grind (DBG) technique, the dies are separated by backside grinding before the breaking step. Efficient adhesive-layer separation is achieved with reduced backside chipping associated with conventional blade dicing.

Abstract: A method of packaging a semiconductor die includes the steps of mounting the semiconductor die on a carrier, electrically connecting electrical contact pads of the semiconductor die to external electrical contacts, and encapsulating the die with a mold compound to form a packaged die. The packaged die is then thinned by using a dicing saw blade to trim the mold compound off of the top, non-active side of the package using a series of vertical cuts. This thinning step can be performed at the same time as a normal dicing step so no additional equipment or process steps are needed. Further, packages of varying thicknesses can be assembled simultaneously.

Abstract: An apparatus for storing semiconductor devices includes a reel having a hub and at least two flanges along an axis of the reel. The flanges are spaced and face each other. The semiconductor devices, which typically are attached to a tape, are wound around the hub and between the flanges. At least one holding member is disposed between the flanges at the rim of the apparatus, which is the perimeter of the flanges, and abuts the inner surfaces of the flanges. The holding member prevents the flanges from being deformed during vacuum packing.