Abstract: Embodiments have two approaches as follows: (1) Embedded PCB-based fabrication and (2) PCB assembly-based fabrication. An embedded printed circuit board (PCB) type approach involves the creation of a space of coolant direct interconnection, using immersion cooling to link on any type of power semiconductor device hot spots to convectively and evaporatively cool directly. This means fabricating PCB embedded channels, to utilize the microgap between die and PCB as the cooling channel. A printed circuit board (PCB) assembly embodiment includes a PCB having at least one heat generating component. A lid is mounted to the PCB, wherein the lid defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path.

Abstract: An electric machine includes a rotor located at and rotatable about a central axis and a stator positioned proximate to the rotor and defining a radial machine gap between the rotor and the stator. A cold plate is positioned proximate to the rotor. The cold plate is rotationally stationary relative to the central axis and is spaced apart from the rotor to define a cold plate gap between the cold plate and the rotor. The cold plate includes one or more coolant pathways therein such that thermal energy from the rotor is transferred to a flow of coolant circulated through the one or more coolant pathways.

Abstract: A powerplant is provided for an aircraft. This powerplant includes an engine housing, an engine assembly, an electric generator, an electric motor and a propulsor rotor. The engine assembly is arranged in the engine housing. The engine assembly includes a core flowpath, a core compressor section, a core combustor section, a core turbine section and a power turbine section. The power turbine section includes a power turbine rotor. The electric generator is arranged in the engine housing. The electric generator includes a generator rotor. The power turbine rotor is configured to drive rotation of the generator rotor. The electric motor is arranged in the engine housing. The electric motor includes a motor rotor. The electric generator is configured to power operation of the electric motor. The motor rotor is configured to drive rotation of the propulsor rotor.

Abstract: Direct pin-fin cooling assemblies are disclosed for a high-power printed circuit boards (PCBs). The disclosure can solve the classical coldplate problem associated with liquid cooling of high-power PCBs namely: (1) Inhomogeneous cooling due to the calorimetric heating up of the coolant, (2) thermal interface material (TIM) related quality issues such as dry-out effects, (3) high cost due to complicated metal coldplate structure, and (4) low thermal conductivity due to multi-layer structure. This includes incorporating pin-fin direct cooling into high-power PCB structures without additional coldplate structure or TIM. In this approach, a TIM and a top plate of coldplate can be removed. Thus, the cooling performance can be improved because the thermal conductivity between a liquid coolant and a power device is increased.

Abstract: The present disclosure provides for cooling systems, assemblies and methods (e.g., for semiconductor devices; for refrigerant cooling; for cryogenic cooling). More particularly, the present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods for semiconductor devices (e.g., wide-bandgap (WBG) power semiconductor devices), with the cooling assemblies, systems and methods utilizing three-dimensional adaptive flow-paths using bi-metal fins. The present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods that may improve cooling performance and/or enable local cooling control. The present disclosure provides for bi-metal strips that operate as both the surface-temperature sensors and actuators without input energy. The bi-metal strips guide the coolant flow to a low-drag channel when the surface temperature is low, and guide the coolant flow to the near-surface channel when the surface temperature is high.

Abstract: A cooling system for a superconducting electric machine may comprise a fluid reservoir and a first fluid comprising a first mixture of hydrogen and helium configured to be stored in the fluid reservoir. A plurality of conduits may be fluidly coupled to the fluid reservoir and may form a closed loop between the fluid reservoir and the superconducting electric machine.

Abstract: Systems and methods of operating for a smart power router for boosting and protection are provided. Aspects include a power router comprising a plurality of terminals, a first DC power supply coupled to the first terminal, a second DC power supply coupled to the second terminal, a first power converter, an interface bi-directional switch coupled between the first terminal and the second terminal, a first bi-directional switch coupled between the first terminal and the third terminal, the first bi-directional switch comprising a first transistor and a second transistor, a first RL circuit, a controller configured to operate the power router in a plurality of modes comprising a first voltage boosting mode, wherein operating the power router in the first voltage boosting mode comprises operating the interface bi-directional switch in an on state, operating the first transistor in an off state, and operating the second transistor in a switching state.

Abstract: A cryocooler device including a cryocooler including an input and an output, the input forming a cooling path, and a first stage that cools a working fluid in the cooling path. At least one thermal energy storage device selectively connectable to the cooling path and the cooling loop, wherein in a first operational mode of the cryocooler device where the at least one thermal energy storage device is connected to the cooling loop where the heat to be removed at the input exceeds a cooling capacity of the cryocooler device, and a second operational mode where the at least one thermal energy storage device is connected to the cooling path where the heat to be removed is less than the cooling capacity of the cryocooler and the heat is removed from the at least one thermal energy storage device.

Abstract: Direct pin-fin cooling assemblies are disclosed for a high-power printed circuit boards (PCBs). The disclosure can solve the classical coldplate problem associated with liquid cooling of high-power PCBs namely: (1) Inhomogeneous cooling due to the calorimetric heating up of the coolant, (2) thermal interface material (TIM) related quality issues such as dry-out effects, (3) high cost due to complicated metal coldplate structure, and (4) low thermal conductivity due to multi-layer structure. This includes incorporating pin-fin direct cooling into high-power PCB structures without additional coldplate structure or TIM. In this approach, a TIM and a top plate of coldplate can be removed. Thus, the cooling performance can be improved because the thermal conductivity between a liquid coolant and a power device is increased.

Abstract: Embodiments have two approaches as follows: (1) Embedded PCB-based fabrication and (2) PCB assembly-based fabrication. An embedded printed circuit board (PCB) type approach involves the creation of a space of coolant direct interconnection, using immersion cooling to link on any type of power semiconductor device hot spots to convectively and evaporatively cool directly. This means fabricating PCB embedded channels, to utilize the microgap between die and PCB as the cooling channel. A printed circuit board (PCB) assembly embodiment includes a PCB having at least one heat generating component. A lid is mounted to the PCB, wherein the lid defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path.

Abstract: Systems for a current limiting circuit are provided. Aspects include a first set of batteries coupled to a battery terminal, a power converter coupled to a power converter terminal, wherein the battery terminal is coupled to the power converter terminal, a first current limiting circuit in series with the first set of batteries, wherein the current limiting circuit comprises a first circuit comprising a first transistor in series with a first diode, a second circuit comprising a second transistor in series with a second diode, a first RL circuit, wherein the first RL circuit, the first circuit, and the second circuit are arranged in parallel, a controller configured to operate the first current limiter in a plurality of modes including a battery discharge mode including the controller operating the first transistor in an off state, and operating the second transistor in a switching state.

Abstract: An electric machine includes a rotor located at and rotatable about a central axis and a stator positioned proximate to the rotor and defining a radial machine gap between the rotor and the stator. A cold plate is positioned proximate to the rotor. The cold plate is rotationally stationary relative to the central axis and is spaced apart from the rotor to define a cold plate gap between the cold plate and the rotor. The cold plate includes one or more coolant pathways therein such that thermal energy from the rotor is transferred to a flow of coolant circulated through the one or more coolant pathways.

Abstract: A printed circuit board (PCB) assembly includes a first PCB including at least one heat generating component. A second PCB is mounted to the first PCB. The second PCB defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path. A plurality of power pillars extend from the first PCB and across the cooling path.

Abstract: The present disclosure provides for cooling systems, assemblies and methods (e.g., for semiconductor devices; for refrigerant cooling; for cryogenic cooling). More particularly, the present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods for semiconductor devices (e.g., wide-bandgap (WBG) power semiconductor devices), with the cooling assemblies, systems and methods utilizing three-dimensional adaptive flow-paths using bi-metal fins. The present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods that may improve cooling performance and/or enable local cooling control. The present disclosure provides for bi-metal strips that operate as both the surface-temperature sensors and actuators without input energy. The bi-metal strips guide the coolant flow to a low-drag channel when the surface temperature is low, and guide the coolant flow to the near-surface channel when the surface temperature is high.

Abstract: A system for use in generating a power signal includes a first stage circuit having: a first input line coupled to a first stage first parallel line having a first stage first switch positioned thereon, a second input line coupled to a first stage second parallel line having a first stage second switch positioned thereon, and a first stage third parallel line oriented in parallel with the first stage first parallel line and the first stage second parallel line between a positive rail and a negative rail, the first stage third parallel line having a first capacitor positioned thereon. The system further includes a second stage circuit having a resonant inverter coupled between the positive rail and the negative rail and configured to output the power signal.

Abstract: Provided are embodiments for a method and a hybrid axial/radial motor. Embodiments can include a central rotor that includes an axial segment, a first radial segment, and a second radial segment, wherein the first radial segment extends axially from a first side of the axial segment and the second radial segment extends axially from a second side of the axial segment, wherein the first side is opposite the second side. Embodiments can also include a stator adapted to receive the first radial segment or the second radial segment of the central rotor.

Abstract: A system for controlling a power signal for zero voltage switching (ZVS) includes a voltage zero crossing detection module to detect a zero voltage condition in response to an inverter voltage from a resonant inverter crossing zero volts, and a current zero crossing detection module to detect a zero current condition in response to an inverter current from the resonant inverter crossing zero amps. The system further includes a phase detect module to detect actual phase data corresponding to an actual phase angle between the inverter voltage and the inverter current based on the zero voltage and zero current condition. The system further includes a comparator to determine a phase difference between a desired phase between the inverter voltage and the inverter current and the actual phase angle. The system further includes a controller to adjust a property of a resonant inverter to reduce the phase difference.

Abstract: A cooling system for a superconducting electric machine may comprise a fluid reservoir and a first fluid comprising a first mixture of hydrogen and helium configured to be stored in the fluid reservoir. A plurality of conduits may be fluidly coupled to the fluid reservoir and may form a closed loop between the fluid reservoir and the superconducting electric machine.

Abstract: A device can include a first circuit configured to be exposed to a first environment, the first circuit comprising one or more first transfer inductors, and a second circuit isolated from the first circuit and configured to be exposed to a second environment, the second circuit comprising one or more second transfer inductors. The second environment can be a harsh environment. The first circuit and the second circuit can be wirelessly coupled via the one or more first transfer inductors and the one or more second transfer inductors to allow transfer of power and/or signals between the first circuit and the second circuit.

Abstract: A electronic component including a first protective layer covering the substrate and the conductive tract, a second protective layer covering at least a portion of the first protective layer, wherein the second protective layer includes Parylene, and a third protective layer covering at least a portion of the second protective layer.