Patents by Inventor Paramasiyan Kamatchi Subramanian

Paramasiyan Kamatchi Subramanian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patterning embedded control lines for vertically stacked semiconductor elements
    Patent number: 8896070
    Abstract: The present invention is generally directed to an apparatus with embedded (bottom side) control lines for vertically stacked semiconductor elements. In accordance with various embodiments, a first semiconductor wafer is provided with a first facing surface on which a first conductive layer is formed. The first semiconductor wafer is attached to a second semiconductor wafer to form a multi-wafer structure, the second semiconductor wafer having a second facing surface on which a second conductive wafer is formed. The first conductive layer is contactingly bonded to the second conductive layer to form an embedded combined conductive layer within said structure. Portions of the combined conductive layer are removed to form a plurality of spaced apart control lines that extend in a selected length or width dimension through said structure.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: November 25, 2014
    Assignee: Seagate Technology LLC
    Inventors: Hyung-Kyu Lee, YoungPil Kim, Peter Nicholas Manos, Maroun Khoury, Dadi Setiadi, Chulmin Jung, Hsing-Kuen Liou, Paramasiyan Kamatchi Subramanian, Yongchul Ahn, Jinyoung Kim, Antoine Khoueir
  • Patterning Embedded Control Lines for Vertically Stacked Semiconductor Elements
    Publication number: 20120199915
    Abstract: The present invention is generally directed to an apparatus with embedded (bottom side) control lines for vertically stacked semiconductor elements. In accordance with various embodiments, a first semiconductor wafer is provided with a first facing surface on which a first conductive layer is formed. The first semiconductor wafer is attached to a second semiconductor wafer to form a multi-wafer structure, the second semiconductor wafer having a second facing surface on which a second conductive wafer is formed. The first conductive layer is contactingly bonded to the second conductive layer to form an embedded combined conductive layer within said structure. Portions of the combined conductive layer are removed to form a plurality of spaced apart control lines that extend in a selected length or width dimension through said structure.
    Type: Application
    Filed: April 13, 2012
    Publication date: August 9, 2012
    Applicant: Seagate Technology LLC
    Inventors: Hyung-Kyu Lee, YoungPil Kim, Peter Nicholas Manos, Maroun Khoury, Dadi Setiadi, Chulmin Jung, Hsing-Kuen Liou, Paramasiyan Kamatchi Subramanian, Yongchul Ahn, Jinyoung Kim, Antoine Khoueir
  • Patterning embedded control lines for vertically stacked semiconductor elements
    Patent number: 8183126
    Abstract: Various embodiments of the present invention are generally directed to an apparatus with embedded (bottom side) control lines for vertically stacked semiconductor elements, and a method for forming the same. In accordance with various embodiments, a first semiconductor wafer is provided with a first facing surface on which a first conductive layer is formed. The first semiconductor wafer is attached to a second semiconductor wafer to form a multi-wafer structure, the second semiconductor wafer having a second facing surface on which a second conductive wafer is formed. The first conductive layer is contactingly bonded to the second conductive layer to form an embedded combined conductive layer within said structure. Portions of the combined conductive layer are removed to form a plurality of spaced apart control lines that extend in a selected length or width dimension through said structure.
    Type: Grant
    Filed: July 13, 2009
    Date of Patent: May 22, 2012
    Assignee: Seagate Technology LLC
    Inventors: Hyung-Kyu Lee, YoungPil Kim, Peter Nicholas Manos, Maroun Khoury, Dadi Setiadi, Chulmin Jung, Hsing-Kuen Liou, Paramasiyan Kamatchi Subramanian, Yongchul Ahn, Jinyoung Kim, Antoine Khoueir
  • Patterning Embedded Control Lines for Vertically Stacked Semiconductor Elements
    Publication number: 20110006377
    Abstract: Various embodiments of the present invention are generally directed to an apparatus with embedded (bottom side) control lines for vertically stacked semiconductor elements, and a method for forming the same. In accordance with various embodiments, a first semiconductor wafer is provided with a first facing surface on which a first conductive layer is formed. The first semiconductor wafer is attached to a second semiconductor wafer to form a multi-wafer structure, the second semiconductor wafer having a second facing surface on which a second conductive wafer is formed. The first conductive layer is contactingly bonded to the second conductive layer to form an embedded combined conductive layer within said structure. Portions of the combined conductive layer are removed to form a plurality of spaced apart control lines that extend in a selected length or width dimension through said structure.
    Type: Application
    Filed: July 13, 2009
    Publication date: January 13, 2011
    Applicant: SEAGATE TECHNOLOGY LLC
    Inventors: Hyung-Kyu Lee, YoungPil Kim, Peter Nicholas Manos, Maroun Khoury, Dadi Setiadi, Chulmin Jung, Hsing-Kuen Liou, Paramasiyan Kamatchi Subramanian, Yongchul Ahn, Jinyoung Kim, Antoine Khoueir