Abstract: Apparatuses, systems, and associated methods of manufacturing are described that provide an optical interposer and associated communication system. An example optical interposer includes a substrate having a first end that receives a first optical fiber welded thereto and a second end that receives a plurality of photonic integrated circuits (PICs) attached thereto. The interposer further includes an optical waveguide network defined by the substrate that provides optical communication between the first welded optical fiber and the plurality of PICs. The optical waveguide network also includes optical redistribution elements supported by the substrate. In an operational configuration, the optical interposer receives a first input optical signal from the first welded optical fiber, and the plurality of optical redistribution elements successively split the first input optical signal such that a plurality of output optical signals is directed to the plurality of PICs.

Abstract: Various embodiments of improved PIN-type photodiodes are provided. In an example embodiment, the PIN-type photodiode includes a p-type contact; an n-type contact; a first absorbing layer disposed between the p-type contact and the n-type contact; and a second absorbing layer disposed between the first absorbing layer and the n-type contact. The first absorbing layer is characterized by a first absorption coefficient and the second absorbing layer is characterized by a second absorption coefficient. The second absorption coefficient is greater than the first absorption coefficient. In another example embodiment, the PIN-type photodiode includes a p-type contact; an n-type contact; a first absorbing layer disposed between the p-type contact and the n-type contact; and a non-absorbing accelerating layer disposed between absorbing layers and non-absorbing drift layer and the n-type contact.

Abstract: An optoelectronic device (20) includes thin film structures (56) disposed on a semiconductor substrate (54) and patterned to define components of an integrated drive circuit, which is configured to generate a drive signal. A back end of line (BEOL) stack (42) of alternating metal layers (44, 46) and dielectric layers (50) is disposed over the thin film structures. The metal layers include a modulator layer (48), which contains a plasmonic waveguide (36, 99, 105) and a plurality of electrodes (30, 32, 34, 96, 98, 106), which apply a modulation to surface plasmons polaritons (SPPs) propagating in the plasmonic waveguide in response to the drive signal. A plurality of interconnect layers are patterned to connect the thin film structures to the electrodes.

Abstract: A multi-chip module (MCM-10) includes a substrate (11), one or more photonic chips (14) disposed on the substrate, and an electronic chip (12) disposed on the substrate. The one or more photonic chips include one or more optical channels (22), which are configured to guide propagating optical signals, and two or more photonic modulator-segments (18) coupled to each of the optical channels, each photonic modulator-segment configured to modulate the propagating optical signals responsively to digitally modulated driving electrical signals provided thereto.

Abstract: An apparatus includes multiple ports, packet communication processing circuitry coupled to the ports, and a processor that is configured to receive, from the packet communication processing circuitry, metadata that is indicative of a temporal pattern of control messages communicated via one or more of the ports, and to identify a network attack by applying anomaly detection to the temporal pattern of the control messages.

Abstract: In one embodiment, a secure computing system comprises a key generation sub-system configured to generate cryptographic keys and corresponding key labels for distribution to computer dusters, each computer cluster including a plurality of respective endpoints, a plurality of quantum key distribution (QKD) devices connected via respective optical fiber connections, and configured to securely distribute the generated cryptographic keys among the computer clusters, and a key orchestration sub-system configured to manage caching of the cryptographic keys in advance of receiving key requests from applications running on ones of the endpoints, and provide respective ones of the cryptographic keys to the applications to enable secure communication among the applications.

Abstract: Embodiments are disclosed for a quantum key distribution (QKD) enabled intra-datacenter network. An example system includes a first QKD device and a second QKD device. The first QKD device includes a first quantum-enabled port and a first network port. The second QKD device includes a second quantum-enabled port and a second network port. The first quantum-enabled port of the first QKD device is communicatively coupled to the second quantum-enabled port of the second QKD device via a QKD link associated with quantum communication. Furthermore, the first network port of the first QKD device is communicatively coupled to a first network switch via a first classical link associated with classical network communication. The second network port of the second QKD device is communicatively coupled to a second network switch via a second classical link associated with classical network communication.

Abstract: In one embodiment, an optical network system including a plurality of optical switches configured to switch beams of light which are modulated to carry information, a plurality of host computers comprising respective optical network interface controllers (NICs), optical fibers connecting the optical NICs and the optical switches forming an optically-switched communication network, over which optical circuit connections are established between pairs of the optical NICs over ones of the optical fibers via ones of the optical switches, the optically-switched communication network which including the optical NICs and the optical switches.

Abstract: A passive dual polarization unit and coherent transceiver and/or receiver including one or more passive dual polarization units are provided. An example passive dual polarization unit includes a polarization splitter configured to split an input signal into a TE mode and TM mode signals; TE/TM splitters each designed to split the TE/TM mode signals into first TE/TM signals and second TE/TM signals; a first TE signal polarization rotation component for receiving the first TE signal and providing a third TM signal having the same magnitude and time dependence as the first TE signal; a first TM signal polarization rotation component for receiving the first TM signal and providing a third TE signal having the same magnitude and time dependence as the first TM signal; and TE/TM couplers that couple the second TE/TM signals and the third TE/TM signals to generate output TE/TM signals.

Abstract: A photonics frequency comb generator includes two integrated dies: an indium phosphide die laser of a first wavelength is grown on from, and a silicon photonics die having a microring resonator connected to the laser and frequency modulators. The microring resonator converts the first wavelength into a number of second wavelengths. One type of the microring resonator is a hybrid non-linear optical wavelength generator, comprising non-silicon materials, such as SiC or SiGe built on silicon to yield a non-linear wavelength generation. The second wavelengths are generated by adjusting the ring's geometric size and a distance between the ring and the traverse waveguide. Another type of microring resonator splits the first wavelength into a plurality of second wavelengths and transmits the multiple second wavelengths to filters and modulators, and each selects and modulates one of the second wavelengths in a one-to-one relationship.

Abstract: The invention is a datacenter network comprising a plurality of switches. The switches comprise edge switches and aggregation switches associated with sliceable bandwidth variable transceivers (S-BVT). An intermediate passive optical layer is communicatively coupled to the edge switches and the aggregation switches via fiber optic links associated with the S-BVTs. Furthermore, the intermediate passive optical layer is inserted between the edge and aggregation layers in order to combine the signals from each tier. The intermediate passive optical layer comprises a passive fiber coupler that combines the links between switches and each S-BVT receiver receives the signals sent from all S-BVT transmitters connected to the intermediate passive optical layer. The datacenter network is adapted to adjust the local oscillator wavelength of each S-BVT receiver and the wavelength and slice allocation of each S-BVT transmitter, thereby permitting dynamically allocating different resources to each link.

Abstract: A system includes a pair of network devices, a universal multi-core fiber (UMCF) interconnect, and a pair of wavelength-division multiplexing (WDM) devices. Each network device includes (i) first optical communication devices configured to communicate first optical signals having a first carrier wavelength and (ii) second optical communication devices configured to communicate second optical signals having a second carrier wavelength. The universal multi-core fiber (UMCF) interconnect includes multiple cores that are configured to convey the first optical signals and the second optical signals between the network devices, using single-mode propagation for the first optical signals and multi-mode propagation for the second optical signals. Each WDM device is connected between a respective network device and the UMCF interconnect and configured to couple the first and second optical communication devices of the respective network device to the cores in accordance with a defined channel assignment.

Abstract: An optical switching device (20) includes a substrate (39) and first and second optical waveguides (23, 25) having respective first and second tapered ends (62, 64), which are fixed on the substrate in mutual proximity one to another. A pair of electrodes (36, 38) is disposed on the substrate with a gap therebetween. A cantilever beam (32) is disposed on the substrate within the gap and configured to deflect transversely between first and second positions within the gap in response to a potential applied between the electrodes. A third optical waveguide (21) is mounted on the cantilever beam and has a third tapered end (60) disposed between the first and second tapered ends of the first and second waveguides, so that the third tapered end is in proximity with the first tapered end when the cantilever beam is in the first position and is in proximity with the second tapered end when the cantilever beam is in the second position.

Abstract: Embodiments are disclosed for a quantum key distribution enabled intra-datacenter network. An example system includes a first vertical cavity surface emitting laser (VCSEL), a second VCSEL and a network interface controller. The first VCSEL is configured to emit a first optical signal associated with data. The second VCSEL is configured to emit a second optical signal associated with quantum key distribution (QKD). Furthermore, the network interface controller is configured to manage transmission of the first optical signal associated with the first VCSEL and the second optical signal associated with the second VCSEL via an optical communication channel coupled to a network interface module.

Abstract: A fast optical switch and networks comprising fast optical switches are disclosed herein. In an example embodiment, a fast optical switch includes two or more fabric switches; a first selector switch; and a second selector switch. The first selector switch may selectively pass a signal to one of the two or more fabric switches. The one of the two or more fabric switches may act on the received signal to provide a switched signal and the second selector switch may selectively receive the switched signal provided by the one of the two or more fabric switches. A slot of the fast optical switch comprises a transmission window of one of the two or more fabric switches that occurs in parallel with at least a portion of a reconfiguration window of the other of the two or more fabric switches.

Abstract: The invention is a datacenter network comprising a plurality of switches. The switches comprise edge switches and aggregation switches associated with sliceable bandwidth variable transceivers (S-BVT). An intermediate passive optical layer is communicatively coupled to the edge switches and the aggregation switches via fiber optic links associated with the S-BVTs. Furthermore, the intermediate passive optical layer is inserted between the edge and aggregation layers in order to combine the signals from each tier. The intermediate passive optical layer comprises a passive fiber coupler that combines the links between switches and each S-BVT receiver receives the signals sent from all S-BVT transmitters connected to the intermediate passive optical layer. The datacenter network is adapted to adjust the local oscillator wavelength of each S-BVT receiver and the wavelength and slice allocation of each S-BVT transmitter, thereby permitting dynamically allocating different resources to each link.

Abstract: A network element (36) includes circuitry and at least one port (72). The at least one port is coupled to an optical fabric (32) including one or more optical switches (40) that provide optical paths between the at least one port and multiple destination nodes, at predefined time slots. The circuitry is configured to hold a schedule plan (84) that specifies which of the destination nodes are accessible via the optical fabric at which of the time slots, to queue packets that are destined to the destination nodes, and to transmit the queued packets via the at least one port in accordance with the schedule plan.

Abstract: An optoelectronic device includes a substrate and first thin film layers disposed on the substrate and patterned to define a vertical-cavity surface-emitting laser (VCSEL), which is configured to emit optical radiation along an optical axis perpendicular to the substrate. Second thin film layers are disposed over the first thin film layers and are patterned to define an optical modulator in which the optical radiation propagates in a direction parallel to the substrate, and an optical coupler configured to couple the optical radiation from the VCSEL into the optical modulator.

Abstract: A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect has a first end coupled to the MCM and a second end connected to the optical-to-optical connector on the panel, for routing the plurality of optical communication signals between the MCM and the panel.

Abstract: A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect includes multiple fiber cores for routing the plurality of optical communication signals between the MCF and the panel. The MCF has a first end at which the multiple fiber cores are coupled to the MCM, and a second end at which the multiple fiber cores are connected to the optical-to-optical connector on the panel.