Patents by Inventor Pardeep Shahi

Pardeep Shahi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12648114
    Abstract: Systems and methods for a datacenter cooling system are disclosed. In at least one embodiment, a secondary cooling loop interfaces with a primary cooling loop and includes at least one processor that is adapted with a first proportional-integral-derivative (PID) controller to control a first flow controller, which can cause a flow rate for a secondary coolant from a coolant distribution unit (CDU) to a plurality of second flow controllers, and where the plurality of second flow controllers are associated with a plurality of second PID controllers and the flow rate is based in part of on feedback from the plurality of second PID controllers.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: June 2, 2026
    Assignee: Nvidia Corporation
    Inventors: Ali Heydari, Pardeep Shahi
  • Patent number: 12581623
    Abstract: A system includes one or more two-phase cooling loops including one or more coolant pumps and one or more cooling condensers integrated within one or more servers to cause one or more first server components to be cooled using a single-phase coolant and to cause one or more second server components consuming more power than the one or more first server components to be cooled using a two-phase coolant. The one or more cooling condensers are to condense and cool the two-phase coolant using the single-phase coolant.
    Type: Grant
    Filed: August 16, 2023
    Date of Patent: March 17, 2026
    Assignee: NVIDIA Corporation
    Inventors: Pardeep Shahi, Ali Heydari, Yaman Manaserh
  • Patent number: 12575061
    Abstract: Systems and methods include pressure sensors that measure a pressure differential of coolant between a first coolant line and a second coolant line. Coolant flow control valves control respective valve flow rates. A processor selects a valve from the flow control valves to provide coolant to a coolant output, responsive to the measured pressure differential.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: March 10, 2026
    Assignee: NVIDIA Corporation
    Inventors: Ali Heydari, Pardeep Shahi
  • Patent number: 12550292
    Abstract: Systems, methods, and technique for improved data center cooling. In at least one embodiment, a data center cooling system may include a heat exchange device that exchanges heat between a first coolant in a first cooling loop, which may absorb heat from one or more first components of a computing system, and a second liquid coolant in a second cooling loop, which may absorb heat from one or more second components of the computing system.
    Type: Grant
    Filed: February 10, 2023
    Date of Patent: February 10, 2026
    Assignee: NVIDIA Corporation
    Inventors: Pardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard
  • Publication number: 20250354769
    Abstract: Embodiments described herein provide a coolant distribution unit having one or more swappable components. In at least one embodiment, one or more coolant distribution units may contain one or more swappable filters coupled to one or more isolation valves that control one or more coolant flows through the one or more swappable filters.
    Type: Application
    Filed: May 15, 2024
    Publication date: November 20, 2025
    Inventors: Ali Heydari, Bahareh Eslami, Mohammad Tradat, Pardeep Shahi, Yaman Manaserh, Himanshu Modi, Qusai Soud
  • Patent number: 12477699
    Abstract: A system includes one or more first cooling loops to cool one or more first components within one or more servers having a first power density, and one or more second cooling loops to cool one or more second components within the one or more servers having a second power density. The system can flow first coolant to cold plates to cool high-power server components and flow second coolant to cool low-power server components by immersion cooling.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: November 18, 2025
    Assignee: NVIDIA Corporation
    Inventors: Pardeep Shahi, Ali Heydari
  • Patent number: 12069840
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first interfacing flow controller includes a sensor and is associated with a first server tray of a rack, so that a first interfacing flow controller can receive sensor inputs and can communicate with a second interfacing flow controller by a communication line there between, where a second interfacing flow controller can be associated with a coolant distribution unit (CDU) to cause a balance of coolant flow to be provided from a CDU to one or more second server trays based in part on a change in a coolant flow to a first server tray as indicated by such sensor inputs.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: August 20, 2024
    Assignee: Nvidia Corporation
    Inventors: Ali Heydari, Pardeep Shahi
  • Publication number: 20240215205
    Abstract: A system includes one or more first cooling loops to cool one or more first components within one or more servers having a first power density, and one or more second cooling loops to cool one or more second components within the one or more servers having a second power density. The system can flow first coolant to cold plates to cool high-power server components and flow second coolant to cool low-power server components by immersion cooling.
    Type: Application
    Filed: December 20, 2022
    Publication date: June 27, 2024
    Inventors: Pardeep Shahi, Ali Heydari
  • Publication number: 20240098934
    Abstract: Systems and methods include pressure sensors that measure a pressure differential of coolant between a first coolant line and a second coolant line. Coolant flow control valves control respective valve flow rates. A processor selects a valve from the flow control valves to provide coolant to a coolant output, responsive to the measured pressure differential.
    Type: Application
    Filed: July 14, 2022
    Publication date: March 21, 2024
    Inventors: Ali Heydari, Pardeep Shahi
  • Publication number: 20230371212
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a primary cooling loop includes at least one primary flow controller to control flow of a primary coolant to a coolant distribution unit (CDU) at a primary flow rate that is determined based in part on heat generated from one or more computing devices that is to be addressed by a secondary coolant, which is to be cooled in a CDU by a primary coolant at a primary flow rate enabled by at least one primary flow controller.
    Type: Application
    Filed: May 10, 2022
    Publication date: November 16, 2023
    Inventors: Ali Heydari, Pardeep Shahi
  • Publication number: 20230284423
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first interfacing flow controller includes a sensor and is associated with a first server tray of a rack, so that a first interfacing flow controller can receive sensor inputs and can communicate with a second interfacing flow controller by a communication line there between, where a second interfacing flow controller can be associated with a coolant distribution unit (CDU) to cause a balance of coolant flow to be provided from a CDU to one or more second server trays based in part on a change in a coolant flow to a first server tray as indicated by such sensor inputs.
    Type: Application
    Filed: March 7, 2022
    Publication date: September 7, 2023
    Inventors: Ali Heydari, Pardeep Shahi