Patents by Inventor Paresh Lele

Paresh Lele has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10141127
    Abstract: A secondary disconnect assembly for use with a circuit breaker moveable between a connected position and a disconnected position includes a first secondary disconnect apparatus and a second secondary disconnect apparatus. The first secondary disconnect apparatus includes a first coupling portion having at least one high speed communications connector. The second secondary disconnect apparatus includes a second coupling portion removably coupled to the first coupling portion. The second coupling portion includes at least one opening configured to receive the high speed communications connector when the circuit breaker is moved from the disconnected position to the connected position to enable high speed data transmission through the first coupling portion and the second coupling portion.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: November 27, 2018
    Assignee: ABB Schweiz AG
    Inventors: Joon Won Ha, Craig Benjamin Williams, Paresh Lele
  • Publication number: 20170178828
    Abstract: A secondary disconnect assembly for use with a circuit breaker moveable between a connected position and a disconnected position includes a first secondary disconnect apparatus and a second secondary disconnect apparatus. The first secondary disconnect apparatus includes a first coupling portion having at least one high speed communications connector. The second secondary disconnect apparatus includes a second coupling portion removably coupled to the first coupling portion. The second coupling portion includes at least one opening configured to receive the high speed communications connector when the circuit breaker is moved from the disconnected position to the connected position to enable high speed data transmission through the first coupling portion and the second coupling portion.
    Type: Application
    Filed: December 16, 2015
    Publication date: June 22, 2017
    Inventors: Joon Won Ha, Craig Benjamin Williams, Paresh Lele