Patents by Inventor Parijat Bhatnagar

Parijat Bhatnagar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220143093
    Abstract: An example genetically engineered effector cell comprises an exogenous polynucleotide sequence that includes a receptor element, an actuator element, and an effector element. The receptor element encodes a chimeric antigen receptor (CAR) comprising an extracellular antigen binding domain operably linked to a transmembrane domain, and an intracellular signaling domain, wherein the extracellular antigen binding domain recognizes an antigen on a surface of a Severe Acute Respiratory Syndrome Coronavirus 2 (SARS-CoV-2)-infected cell. The actuator element encodes a transcription factor binding site that upregulates synthesis of an antiviral protein. The effector element encodes the antiviral protein operably linked to a signal peptide, wherein, in response to the antigen binding domain of the CAR binding to the antigen of SARS-CoV-2-infected cell, the engineered effector cell is configured to activate and, to synthesize and secrete the antiviral protein.
    Type: Application
    Filed: January 27, 2022
    Publication date: May 12, 2022
    Applicant: SRI International
    Inventors: Parijat BHATNAGAR, Marvin A. SSEMADAALI
  • Patent number: 9289786
    Abstract: Multiplexed electrospray deposition apparatus capable of delivering picoliter volumes of one or more substances is disclosed. The apparatus may include a unitary planar dispenser etched from a silicon wafer through microfabrication or micromachining technology. The apparatus may be used as a deposition tool for making protein microarrays in a noncontact mode. Upon application of potential difference in the range of 7-9 kV, the substances may be dispensed directly, not through a collimating mask, onto a substrate with microhydrogel features functionalized with an anchoring agent.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: March 22, 2016
    Assignee: Cornell University
    Inventors: Parijat Bhatnagar, Harold G. Craighead
  • Publication number: 20130045335
    Abstract: Multiplexed electrospray deposition apparatus capable of delivering picoliter volumes of one or more substances is disclosed. The apparatus may include a unitary planar dispenser etched from a silicon wafer through microfabrication or micromachining technology. The apparatus may be used as a deposition tool for making protein microarrays in a noncontact mode. Upon application of potential difference in the range of 7-9 kV, the substances may be dispensed directly, not through a collimating mask, onto a substrate with microhydrogel features functionalized with an anchoring agent.
    Type: Application
    Filed: October 22, 2012
    Publication date: February 21, 2013
    Applicant: Cornell Univeristy
    Inventors: Parijat Bhatnagar, Harold G. Craighead
  • Patent number: 8293337
    Abstract: Multiplexed electrospray deposition apparatus capable of delivering picoliter volumes of one or more substances is disclosed. The apparatus may include a unitary planar dispenser etched from a silicon wafer through microfabrication or micromachining technology. The apparatus may be used as a deposition tool for making protein microarrays in a noncontact mode. Upon application of potential difference in the range of 7-9 kV, the substances may be dispensed directly, not through a collimating mask, onto a substrate with microhydrogel features functionalized with an anchoring agent.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: October 23, 2012
    Assignee: Cornell University
    Inventors: Parijat Bhatnagar, Harold G. Craighead
  • Publication number: 20090317558
    Abstract: Multiplexed electrospray deposition apparatus capable of delivering picoliter volumes of one or more substances is disclosed. The apparatus may include a unitary planar dispenser etched from a silicon wafer through microfabrication or micromachining technology. The apparatus may be used as a deposition tool for making protein microarrays in a noncontact mode. Upon application of potential difference in the range of 7-9 kV, the substances may be dispensed directly, not through a collimating mask, onto a substrate with microhydrogel features functionalized with an anchoring agent.
    Type: Application
    Filed: June 23, 2009
    Publication date: December 24, 2009
    Applicant: Cornell University
    Inventors: Parijat Bhatnagar, Harold G. Craighead
  • Publication number: 20040175934
    Abstract: A method for forming an interconnect structure in a semiconductor device includes defining a first insulator layer on a substrate and defining a via in the first insulator layer, thereby exposing a portion of the substrate. A sacrificial material is deposited over the first insulator layer and within the via, the sacrificial material being deposited at a thickness so as to also form a second insulator layer. A metallization line trench is defined in the second insulator layer, the trench being aligned over the via. Then, the sacrificial material is removed from the via opening, thereby allowing the via and the trench to be filled with a conductive material by dual damascene processing, wherein the formation of the trench and the removal of the sacrificial material from the via is implemented through a single etching operation.
    Type: Application
    Filed: March 4, 2003
    Publication date: September 9, 2004
    Applicant: International Business Machines Corporation
    Inventors: William G. America, Parijat Bhatnagar, Eugene J. O'Sullivan, Richard S. Wise
  • Patent number: 6482298
    Abstract: An electroplating bath includes two electrolytes that are separated by a low ionic mobility barrier substance. Electroplating substrates can be transferred between the two electrolytes, through the barrier substance. Successive layers can be deposited by alternately electroplating in the two electrolytes. The substrate need not be brought through an air-liquid interface in transferring it between the two electrolytes. More than one anode can be provided in each electrolyte for depositing alloy film layers. A dummy electrode can be provided in each electrolyte to be used in lieu of the substrate in order to change concentrations of compounds in each electrolyte so that sharp compositional transitions between successive layers deposited on the substrate can be obtained.
    Type: Grant
    Filed: September 27, 2000
    Date of Patent: November 19, 2002
    Assignee: International Business Machines Corporation
    Inventor: Parijat Bhatnagar
  • Patent number: 6344123
    Abstract: A compositionally modulated material electroplated film is deposited by using at least two source metal anodes in an electroplating apparatus, and changing at least one power setting of an electroplating power supply. In order to obtain sharp boundaries between successive layers of the film, voltage can be switched from an electroplating substrate to a dummy electrode immediately before the power setting is changed, in order to allow the electrolyte to equilibrate at a new set of solute concentrations, before electroplating on the substrate is recommenced.
    Type: Grant
    Filed: September 27, 2000
    Date of Patent: February 5, 2002
    Assignee: International Business Machines Corporation
    Inventor: Parijat Bhatnagar
  • Patent number: 6344124
    Abstract: A compositionally modulated material electroplated film is deposited by using at least two source metal anodes in an electroplating apparatus, and changing at least one contact area between an anode an electrolyte. In order to obtain sharp boundaries between successive layers of the film, voltage can be switched from an electroplating substrate to a dummy electrode immediately before the contact area is changed, in order to allow the electrolyte to equilibrate at a new set of solute concentrations, before electroplating on the substrate is recommenced.
    Type: Grant
    Filed: September 27, 2000
    Date of Patent: February 5, 2002
    Assignee: International Business Machines Corporation
    Inventor: Parijat Bhatnagar