Abstract: An apparatus having a die, a carrier, and a plurality of shielding wires. The die has a top surface through which EMI is received. The carrier has a first surface on which the die is mounted by attaching the die to the first surface using a surface of the die other than the top surface. The carrier also includes a plurality of electrical traces, the die being connected to two of the traces. The shielding wires cross the top surface of the die and are connected to a shielding trace in the carrier. The shielding trace is held at a constant potential. The shielding wires are positioned such that the EMI received by the die is reduced below the level that would be received without the shielding wires. The die could include a light detector.