Abstract: Disclosed herein is a housing panel of an exhaust gas recirculation cooler which is used to manufacture a housing that houses therein a cooling module for cooling recirculation exhaust gas of a vehicle. The housing panel includes a pair of pre-side surface parts which forms respective side surface parts of the housing, and a pre-upper surface part which forms an upper surface part of the housing and is integrally formed between the pair of pre-side surface parts. Two bending parts each having an obtuse angle are formed in the pre-upper surface part at positions spaced apart from each other by a predetermined distance. The torsion caused by stress can be reduced, and the flatness and strength can be enhanced.

Abstract: There is provided an oral appliance including: a body having a shape corresponding to a teeth arrangement; an upper teeth recess formed in an upper portion of the body to allow teeth included in the teeth arrangement of an upper jaw to be inserted therein; and a lower teeth recess formed in a lower portion of the body to allow teeth included in the teeth arrangement of a lower jaw to be inserted therein and allowing the lower jaw to move forward by a predetermined distance.

Abstract: A semiconductor light emitting package is discussed, which includes a base having a top surface with a flat portion; a semiconductor light emitting device on the base; an electrical circuit layer electrically connected to the semiconductor light emitting device; a screen member having an opening and disposed on the base around the semiconductor light emitting device, the screen member shaped into a substantially circle; and an optical member formed of a light transmissive material such that light emitted from the semiconductor light emitting device passes therethrough, wherein a bottom surface of the screen member is positioned higher than the semiconductor light emitting device, an edge portion of the optical member is in contact with the screen member, a top surface of the optical member is substantially parallel to the flat portion of the base.

Abstract: A semiconductor light emitting package includes a base having a top surface with a flat portion, the base shaped into a substantially circle; a plurality of semiconductor light emitting devices on the base; an electrical circuit layer electrically connected to the plurality of semiconductor light emitting device; a plurality of screen members on the base; and a plurality of optical members formed of a light transmissive material such that light emitted from at least one of the semiconductor light emitting devices passes therethrough, wherein each of the screen members has an opening surrounding at least one of the semiconductor light emitting device, each opening of the screen members is shaped into a substantially circle, a diameter of the base is larger than a diameter of the opening of the screen members, and an edge portion of the optical members is in contact with one of the screen members.

Abstract: A semiconductor light emitting package is discussed, which includes a base having a top surface with a flat portion; a semiconductor light emitting device on the base; an electrical circuit layer electrically connected to the semiconductor light emitting device; a screen member having an opening and disposed on the base around the semiconductor light emitting device, the screen member shaped into a substantially circle; and an optical member formed of a light transmissive material such that light emitted from the semiconductor light emitting device passes therethrough, wherein a bottom surface of the screen member is positioned higher than the semiconductor light emitting device, an edge portion of the optical member is in contact with the screen member, a top surface of the optical member is substantially parallel to the flat portion of the base.

Abstract: A semiconductor light emitting package includes a base having a top surface with a flat portion, the base shaped into a substantially circle; a plurality of semiconductor light emitting devices on the base; an electrical circuit layer electrically connected to the plurality of semiconductor light emitting device; a plurality of screen members on the base; and a plurality of optical members formed of a light transmissive material such that light emitted from at least one of the semiconductor light emitting devices passes therethrough, wherein each of the screen members has an opening surrounding at least one of the semiconductor light emitting device, each opening of the screen members is shaped into a substantially circle, a diameter of the base is larger than a diameter of the opening of the screen members, and an edge portion of the optical members is in contact with one of the screen members.

Abstract: The present invention discloses a light emitting device package, comprising: a metal base; an electrical circuit layer provided at an upper side of the metal base for providing a conductive path; a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base; an insulating layer sandwiched between the meta base and the electrical circuit layer; an electrode layer provided at an upper side of the electrical circuit layer; and a wire for electrically connecting the electrode layer and the light emitting device. Further, there is provided a light emitting device package which is improved in light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.

Abstract: The present invention discloses a light emitting device package, comprising: a metal base; an electrical circuit layer provided at an upper side of the metal base for providing a conductive path; a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base; an insulating layer sandwiched between the meta base and the electrical circuit layer; an electrode layer provided at an upper side of the electrical circuit layer; and a wire for electrically connecting the electrode layer and the light emitting device. Further, there is provided a light emitting device package which is improved in light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.

Abstract: There is provided a packing container. The packing container has two different spaces formed by pressing edges of a carrier sheet, a function sheet and a middle sheet to each other to form a carrier space and a function space in both sides of the middle sheet, and thus two contents may be packed in one packing container, which leads to the simple packaging handling.

Abstract: The present invention discloses a light emitting device package, comprising: a metal base; an electrical circuit layer provided at an upper side of the metal base for providing a conductive path; a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base; an insulating layer sandwiched between the meta base and the electrical circuit layer; an electrode layer provided at an upper side of the electrical circuit layer; and a wire for electrically connecting the electrode layer and the light emitting device. Further, there is provided a light emitting device package which is improved in light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.

Abstract: A universal plug and play quality of service (UPnP QoS) network system and a method of reserving a path and resource thereof are provided. In order to set a path from a source device to a target device and to clearly control reservation of network resources for setting the path, the UPnP QoS network system includes: one or more UPnP QoS execution devices collecting and providing network status information and performing QoS for a service requested by reserving network resources based on path information and resource reservation information; and one or more UPnP QoS management devices acquiring and providing the path information and the resource reservation information to the UPnP QoS execution device by considering a QoS rank for the requested service and the network status information provided by the UPnP QoS execution device.

Abstract: The present invention relates to communicating a message in a mobile communication system. Preferably, the present invention comprises requesting radio resources for transmitting at least one message, receiving a response to the request for radio resources, transmitting a first message for requesting a first layer connection to a first node, and transmitting a second message for requesting a second layer connection with a second node prior to establishing the first layer connection.

Abstract: The present invention relates to catalyst compositions for purifying terephthalic acid from p-carboxybenzaldehyde, based on Group VIII metals, comprising crystallites of catalytically active palladium or of palladium and at least one metal of Group VIII of the Periodic Table of Elements, applied to the surface of a carbon material, wherein a mesoporous graphite-like material with the average mesopore size in the range of from 40 to 400 Å, the proportion of the mesopores in the total pore volume of at least 0.5, and the degree of graphite-similarity of at least 20% is used as the carbon material, in which metal crystallites are distributed in the volume of the carbon material granules in such a manner that the distribution peaks of these crystallites should be at a distance from the outer surface of the granule corresponding to 1-30% of its radius.