Patents by Inventor Parker Allen Robinson

Parker Allen Robinson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Scalable radio receiver architecture providing three-dimensional packaging of multiple receivers
    Patent number: 7865165
    Abstract: Methods of forming scalable systems and scalable systems on an integrated circuit (SoC) are provided. First and second radio frequency (RF) systems are disposed on first and second substrates, respectively. A first processor that is configured to process the first RF system is disposed on a substrate separate from the first substrate and a second processor that is configured to process the second RF system is disposed on a substrate separate from the second substrate. The first processor and the first RF system are stacked one on top of the other to configure a first RFSoC and the second processor and the second RF system are stacked one on top of the other to configure a second RFSoC. The first and second RFSoCs are disposed either in a horizontal plane, laterally spaced from each other, or in vertically stacked planes, one above the other.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: January 4, 2011
    Assignee: ITT Manufacturing Enterprises, Inc.
    Inventors: Parker Allen Robinson, Michael Anthony Wyatt, Perry Kevin Falk, Edward Allen Hall
  • SCALABLE RADIO RECEIVER ARCHITECTURE PROVIDING THREE-DIMENSIONAL PACKAGING OF MULTIPLE RECEIVERS
    Publication number: 20090163161
    Abstract: Methods of forming scalable systems and scalable systems on an integrated circuit (SoC) are provided. First and second radio frequency (RF) systems are disposed on first and second substrates, respectively. A first processor that is configured to process the first RF system is disposed on a substrate separate from the first substrate and a second processor that is configured to process the second RF system is disposed on a substrate separate from the second substrate. The first processor and the first RF system are stacked one on top of the other to configure a first RFSoC and the second processor and the second RF system are stacked one on top of the other to configure a second RFSoC. The first and second RFSoCs are disposed either in a horizontal plane, laterally spaced from each other, or in vertically stacked planes, one above the other.
    Type: Application
    Filed: December 20, 2007
    Publication date: June 25, 2009
    Applicant: ITT MANUFACTURING ENTERPRISES, INC.
    Inventors: Parker Allen Robinson, Michael Anthony Wyatt, Perry Kevin Falk, Edward Allen Hall