Abstract: An endoscope device and a cable assembly thereof are provided. The cable assembly includes a first substrate, a second substrate, and a wire. The first substrate includes a first body and a first solder pad disposed on the first body. The second substrate is correspondingly disposed on the first substrate and includes a second body, a second solder pad disposed on the second body and corresponding to the first solder pad, and an accommodating portion corresponding to the second solder pad. The wire includes a soldering portion disposed in the accommodating portion. The first solder pad and the second solder pad are coupled to each other by at least one of a first solder and a second solder, and the soldering portion and the second solder pad are coupled to each other by the first solder.

Abstract: An endoscope device and a cable assembly thereof are provided. The cable assembly includes a first substrate, a second substrate, and a wire. The first substrate includes a first body and a first solder pad disposed on the first body. The second substrate is correspondingly disposed on the first substrate and includes a second body, a second solder pad disposed on the second body and corresponding to the first solder pad, and an accommodating portion corresponding to the second solder pad. The wire includes a soldering portion disposed in the accommodating portion. The first solder pad and the second solder pad are coupled to each other by at least one of a first solder and a second solder, and the soldering portion and the second solder pad are coupled to each other by the first solder.

Abstract: The micro-sensor includes a first circuit substrate and a second circuit substrate. One surface of the first circuit substrate has an image sensing device electrically connected to main printed wires formed by a first wire group and a second wire group. On the other surface of the first circuit substrate has a main connector electrically connected to the second wire group. A plurality of first signal transmission lines connected to the first wire group. The second circuit substrate has a sub-connector that is electrically connected to sub printed wires having an equivalent number as and corresponding to the second wire group. The other end of the sub printed wires is electrically connected to a plurality of second signal transmission lines. Through connecting the connectors respectively disposed in different circuit boards to overcome the difficulty in the manufacturing process of concentrating all devices on a single circuit board.

Abstract: The micro-sensor for a micro image pick-up device includes a flexible circuit board and a circuit substrate. The flexible circuit board has an opening exposing an end of a plurality of metal wires. An image sensing device that electrically connected to a plurality of printed wires disposed on the circuit substrate. The circuit substrate is disposed at the opening of the flexible circuit board. The plurality of printed wires on the circuit substrate corresponds to and contacts the end of the plurality of metal wires exposed out of the flexible circuit board. With the design of the flexible circuit board, the steps of forming a plurality of wiring ducts on the circuit substrate and electrically connecting the printed wires of the circuit substrate by a plurality of connecting lines for transferring signals can be omitted.

Abstract: A digital photographic camera with brightness compensation and a compensation method thereof are applied for the brightness compensation of the digital photographic camera when shooting under different environments so as to maintain a frame rate. The camera includes a light measuring unit, a sensor, a light source generator, a light modulation unit, an operational unit, and a storage unit. The light measuring unit is used for sensing the environment brightness of the camera. The light modulation unit is coupled to the light source generator and used for controlling luminance of the light source generator. The operational unit is coupled to the light measuring unit and the light source generator, and executes a brightness calibration process for calibrating a brightness sensing reference value of the light measuring unit and a brightness compensation process for adjusting the luminance of the light source generator according to the environment brightness of the camera.

Abstract: An image processing method and an image capture apparatus applying the method are disclosed. The image processing method comprises the steps of: capturing an image; detecting whether the image is captured in a low luminance environment; performing at least one image enhanced process for the image when the image is captured in the low luminance environment, so as to obtain a processed image; and outputting the processed image.

Abstract: The micro-sensor includes a first circuit substrate and a second circuit substrate. One surface of the first circuit substrate has an image sensing device electrically connected to main printed wires formed by a first wire group and a second wire group. On the other surface of the first circuit substrate has a main connector electrically connected to the second wire group. A plurality of first signal transmission lines connected to the first wire group. The second circuit substrate has a sub-connector that is electrically connected to sub printed wires having an equivalent number as and corresponding to the second wire group. The other end of the sub printed wires is electrically connected to a plurality of second signal transmission lines. Through connecting the connectors respectively disposed in different circuit boards to overcome the difficulty in the manufacturing process of concentrating all devices on a single circuit board.

Abstract: The micro-sensor for a micro image pick-up device includes a flexible circuit board and a circuit substrate. The flexible circuit board has an opening exposing an end of a plurality of metal wires. An image sensing device that electrically connected to a plurality of printed wires disposed on the circuit substrate. The circuit substrate is disposed at the opening of the flexible circuit board. The plurality of printed wires on the circuit substrate corresponds to and contacts the end of the plurality of metal wires exposed out of the flexible circuit board. With the design of the flexible circuit board, the steps of forming a plurality of wiring ducts on the circuit substrate and electrically connecting the printed wires of the circuit substrate by a plurality of connecting lines for transferring signals can be omitted.