Patents by Inventor Parry M. Ipsen

Parry M. Ipsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems for Attaching Wood Products
    Publication number: 20080098668
    Abstract: The present invention is a system of building materials with surface regions destined for joint formation that are treated with an adhesive partially comprised of a mixture of epoxy resin (96.0-99.9 parts) and hardener (4.0-0.1 parts), such that the epoxy resin/hardener mixture constitutes 50-100% of the adhesive. In an alternative embodiment, the adhesive may have epoxy resin (96.0-99.9 parts) such that the epoxy resin constitutes 45-95% of the adhesive. The remainder of the adhesive may be one or more of the following: hardeners, plasticizing agents, diluents, thickeners, fillers, colorants, opacifying agents, preservatives, and surfactants.
    Type: Application
    Filed: October 31, 2006
    Publication date: May 1, 2008
    Applicant: Weyerhaeuser Co.
    Inventors: Jack G. Winterowd, Jerry D. Izan, Naomi High, Douglas R. Loates, Amar N. Neogi, Parry M. Ipsen, Glen Robak