Patents by Inventor Parth Panchal

Parth Panchal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip Packaging in Light Detection and Ranging (LIDAR) Sensor System
    Publication number: 20240159874
    Abstract: An integrated chip packaging for a LIDAR sensor mounted to a vehicle includes a laser assembly configured to output a beam, an optical amplifier array chip configured to amplify a beam, and a transceiver chip coupled to the laser assembly and the optical amplifier array chip. The transceiver chip may be configured to emit the beam with reference to a first surface of the transceiver chip through an optical window and receive a reflected beam from a target through the optical window. The integrated chip packaging for the LIDAR sensor defines the configuration of optical components for providing a path for the optical signal to travel in and out of the LIDAR sensor and dissipating the heat generated by the optical components for improved performance.
    Type: Application
    Filed: November 22, 2023
    Publication date: May 16, 2024
    Inventors: Colin Delaney, James Ferrara, Stefan Heinemann, Amir Hosseini, Pruthvi Jujjavarapu, Yongxuan Liang, Parth Panchal, Zhizhong Tang
  • Chip packaging in light detection and ranging (LIDAR) sensor system
    Patent number: 11860308
    Abstract: An integrated chip packaging for a LIDAR sensor mounted to a vehicle includes a laser assembly configured to output a beam, an optical amplifier array chip configured to amplify a beam, and a transceiver chip coupled to the laser assembly and the optical amplifier array chip. The transceiver chip may be configured to emit the beam with reference to a first surface of the transceiver chip through an optical window and receive a reflected beam from a target through the optical window. The integrated chip packaging for the LIDAR sensor defines the configuration of optical components for providing a path for the optical signal to travel in and out of the LIDAR sensor and dissipating the heat generated by the optical components for improved performance.
    Type: Grant
    Filed: November 16, 2022
    Date of Patent: January 2, 2024
    Assignee: Aurora Operations, Inc.
    Inventors: Colin Delaney, James Ferrara, Stefan Heinemann, Amir Hosseini, Pruthvi Jujjavarapu, Yongxuan Liang, Parth Panchal, Zhizhong Tang