Patents by Inventor Parthiv Daggolu

Parthiv Daggolu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12247314
    Abstract: A method for producing a silicon ingot includes withdrawing a seed crystal from a melt that includes melted silicon in a crucible that is enclosed in a vacuum chamber containing a cusped magnetic field. At least one process parameter is regulated in at least two stages, including a first stage corresponding to formation of the silicon ingot up to an intermediate ingot length, and a second stage corresponding to formation of the silicon ingot from the intermediate ingot length to the total ingot length. During the second stage process parameter regulation may include reducing a crystal rotation rate, reducing a crucible rotation rate, and/or increasing a magnetic field strength relative to the first stage.
    Type: Grant
    Filed: April 4, 2024
    Date of Patent: March 11, 2025
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Gaurab Samanta, Parthiv Daggolu, Sumeet Bhagavat, Soubir Basak, Nan Zhang
  • Publication number: 20240247402
    Abstract: A method for producing a silicon ingot includes withdrawing a seed crystal from a melt that includes melted silicon in a crucible that is enclosed in a vacuum chamber containing a cusped magnetic field. At least one process parameter is regulated in at least two stages, including a first stage corresponding to formation of the silicon ingot up to an intermediate ingot length, and a second stage corresponding to formation of the silicon ingot from the intermediate ingot length to the total ingot length. During the second stage process parameter regulation may include reducing a crystal rotation rate, reducing a crucible rotation rate, and/or increasing a magnetic field strength relative to the first stage.
    Type: Application
    Filed: April 4, 2024
    Publication date: July 25, 2024
    Inventors: Gaurab Samanta, Parthiv Daggolu, Sumeet Bhagavat, Soubir Basak, Nan Zhang
  • Patent number: 12037699
    Abstract: A method for producing a silicon ingot includes withdrawing a seed crystal from a melt that includes melted silicon in a crucible that is enclosed in a vacuum chamber containing a cusped magnetic field. At least one process parameter is regulated in at least two stages, including a first stage corresponding to formation of the silicon ingot up to an intermediate ingot length, and a second stage corresponding to formation of the silicon ingot from the intermediate ingot length to the total ingot length. During the second stage process parameter regulation may include reducing a crystal rotation rate, reducing a crucible rotation rate, and/or increasing a magnetic field strength relative to the first stage.
    Type: Grant
    Filed: April 11, 2023
    Date of Patent: July 16, 2024
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Gaurab Samanta, Parthiv Daggolu, Sumeet Bhagavat, Soubir Basak, Nan Zhang
  • Publication number: 20240229294
    Abstract: An apparatus for forming a crystalline ribbon grown on a surface of a melt includes an inner chamber. A crucible in the inner chamber is configured to hold a melt. A cold initializer in the inner chamber faces an exposed surface of the melt. A process gas feed is in fluid communication with a process gas inlet of the inner chamber. An outer chamber surrounds at least part of the inner chamber and defines an opening for the process gas feed and a sump inlet. A sump gas feed is in fluid communication with the sump inlet. The sump gas feed is configured to deliver a sump gas to the sump region. The sump region also can include heaters and insulation.
    Type: Application
    Filed: May 3, 2022
    Publication date: July 11, 2024
    Inventors: Nathan STODDARD, Parthiv DAGGOLU, Alexander MARTINEZ, Peter KELLERMAN
  • Patent number: 12024789
    Abstract: Methods for forming single crystal silicon ingots with improved resistivity control and, in particular, methods that involve gallium or indium doping are disclosed. In some embodiments, the ingots are characterized by a relatively high resistivity.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: July 2, 2024
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Richard J. Phillips, Parthiv Daggolu, Eric Gitlin, Robert Standley, HyungMin Lee, Nan Zhang, Jae-Woo Ryu, Soubir Basak
  • Patent number: 11885036
    Abstract: A ribbon is formed such that the ribbon floats on a melt using a cold initializer facing an exposed surface of the melt. The ribbon is single crystal silicon. The ribbon is pulled from the silicon melt at a low angle off the melt surface. The ribbon is formed at a same rate as the pulling. The ribbon is separated from the melt at a wall of the crucible where a stable meniscus forms. The ribbon has a thickness between a first surface and an opposite second surface from 50 ?m to 5 mm. The ribbon includes a first region extending a first depth from the first surface. The first region has a reduced oxygen concentration relative to a bulk of the ribbon.
    Type: Grant
    Filed: August 9, 2020
    Date of Patent: January 30, 2024
    Inventors: Jesse S. Appel, Alison Greenlee, Nathan Stoddard, Peter Kellerman, Parthiv Daggolu, Alexander Martinez, Saeed Pirooz, Brandon Williard, Charles Bowen, Brian McMullen, David Morrell, Dawei Sun
  • Publication number: 20230250551
    Abstract: A method for producing a silicon ingot includes withdrawing a seed crystal from a melt that includes melted silicon in a crucible that is enclosed in a vacuum chamber containing a cusped magnetic field. At least one process parameter is regulated in at least two stages, including a first stage corresponding to formation of the silicon ingot up to an intermediate ingot length, and a second stage corresponding to formation of the silicon ingot from the intermediate ingot length to the total ingot length. During the second stage process parameter regulation may include reducing a crystal rotation rate, reducing a crucible rotation rate, and/or increasing a magnetic field strength relative to the first stage.
    Type: Application
    Filed: April 11, 2023
    Publication date: August 10, 2023
    Inventors: Gaurab Samanta, Parthiv Daggolu, Sumeet Bhagavat, Soubir Basak, Nan Zhang
  • Patent number: 11668020
    Abstract: A method for producing a silicon ingot includes withdrawing a seed crystal from a melt that includes melted silicon in a crucible that is enclosed in a vacuum chamber containing a cusped magnetic field. At least one process parameter is regulated in at least two stages, including a first stage corresponding to formation of the silicon ingot up to an intermediate ingot length, and a second stage corresponding to formation of the silicon ingot from the intermediate ingot length to the total ingot length. During the second stage process parameter regulation may include reducing a crystal rotation rate, reducing a crucible rotation rate, and/or increasing a magnetic field strength relative to the first stage.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: June 6, 2023
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Gaurab Samanta, Parthiv Daggolu, Sumeet Bhagavat, Soubir Basak, Nan Zhang
  • Publication number: 20230096046
    Abstract: An optical sensor is configured to detect a difference in emissivity between the melt and a solid ribbon on the melt, which may be silicon. The optical sensor is positioned on a same side of a crucible as a cold initializer. A difference in emissivity between the melt and the ribbon on the melt is detected using an optical sensor. This difference in emissivity can be used to determine and control a width of the ribbon.
    Type: Application
    Filed: February 19, 2021
    Publication date: March 30, 2023
    Inventors: Peter KELLERMAN, Alison GREENLEE, Parthiv DAGGOLU, Alexander MARTINEZ
  • Publication number: 20230099939
    Abstract: An apparatus for controlling a thickness of a crystalline ribbon grown on a surface of a melt includes a crucible configured to hold a melt; a cold initializer facing an exposed surface of the melt; a segmented cooled thinning controller disposed above the crucible on a side of the crucible with the cold initializer; and a uniform melt-back heater disposed below of the crucible opposite the cooled thinning controller. Heat is applied to the ribbon through the melt using a uniform melt-back heater disposed below the melt. Cooling is applied to the ribbon using a segmented cooled thinning controller facing the crystalline ribbon above the melt.
    Type: Application
    Filed: February 19, 2021
    Publication date: March 30, 2023
    Inventors: Peter KELLERMAN, Alison GREENLEE, Parthiv DAGGOLU, Alexander MARTINEZ, Nathan STODDARD
  • Publication number: 20220349087
    Abstract: Method for producing a silicon ingot in which a horizontal magnetic field is generated are disclosed. A plurality of process parameters are regulated during ingot growth including a wall temperature of the crucible, a transport of silicon monoxide (SiO) from the crucible to the single crystal, and an evaporation rate of SiO from the melt. Regulating the plurality of process parameters may include controlling the position of a maximum gauss plane of the horizontal magnetic field, controlling the strength of the horizontal magnetic field, and controlling the crucible rotation rate.
    Type: Application
    Filed: April 27, 2022
    Publication date: November 3, 2022
    Inventors: JaeWoo Ryu, Parthiv Daggolu, Soubir Basak, Nan Zhang
  • Publication number: 20220325438
    Abstract: A single crystal silicon wafer has a thickness between a first surface and an opposite second surface from 50 ?m to 300 ?m. The wafer includes a first region extending a first depth from the first surface. The first region has a reduced oxygen concentration relative to an adjacent region of the wafer. The wafer has a bulk minority carrier lifetime greater than 100 ?s.
    Type: Application
    Filed: August 9, 2020
    Publication date: October 13, 2022
    Inventors: Jesse S. Appel, Alison Greenlee, Nathan Stoddard, Peter Kellerman, Parthiv Daggolu, Alexander Martinez, Saeed Pirooz
  • Publication number: 20220316087
    Abstract: A ribbon is formed such that the ribbon floats on a melt using a cold initializer facing an exposed surface of the melt. The ribbon is single crystal silicon. The ribbon is pulled from the silicon melt at a low angle off the melt surface. The ribbon is formed at a same rate as the pulling. The ribbon is separated from the melt at a wall of the crucible where a stable meniscus forms. The ribbon has a thickness between a first surface and an opposite second surface from 50 ?m to 5 mm. The ribbon includes a first region extending a first depth from the first surface. The first region has a reduced oxygen concentration relative to a bulk of the ribbon.
    Type: Application
    Filed: August 9, 2020
    Publication date: October 6, 2022
    Inventors: Alison Greenlee, Nathan Stoddard, Jesse S. Appel, Peter Kellerman, Parthiv Daggolu, Alexander Martinez, Saeed Pirooz, Brandon Williard, Charles Bowen, Brian McMullen, David Morrell, Dawei SUN
  • Publication number: 20220145492
    Abstract: Ingot puller apparatus having a heat shield disposed below a side heater and methods for preparing an ingot in such ingot puller apparatus are disclosed. In some embodiments, the side heater is relatively short. The side heater may be fully above a floor of the crucible when the crucible is in its lowest position in the ingot puller.
    Type: Application
    Filed: November 12, 2020
    Publication date: May 12, 2022
    Inventors: Sumeet S. Bhagavat, Parthiv Daggolu, Benjamin Michael Meyer, JaeWoo Ryu
  • Patent number: 11313049
    Abstract: A crystal pulling system for growing a monocrystalline ingot from a melt of semiconductor or solar-grade material includes a crucible for containing the melt of material, a pulling mechanism configured to pull the ingot from the melt along a pull axis, and a multi-stage heat exchanger defining a central passage for receiving the ingot as the ingot is pulled by the pulling mechanism. The heat exchanger defines a plurality of cooling zones arranged vertically along the pull axis of the crystal pulling system. The plurality of cooling zones includes two enhanced-rate cooling zones and a reduced-rate cooling zone disposed vertically between the two enhanced-rate cooling zones.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: April 26, 2022
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Soubir Basak, Gaurab Samanta, Parthiv Daggolu, Benjamin Michael Meyer, William L. Luter, Jae Woo Ryu, Eric Michael Gitlin
  • Publication number: 20210348298
    Abstract: A method for producing a silicon ingot includes withdrawing a seed crystal from a melt that includes melted silicon in a crucible that is enclosed in a vacuum chamber containing a cusped magnetic field. At least one process parameter is regulated in at least two stages, including a first stage corresponding to formation of the silicon ingot up to an intermediate ingot length, and a second stage corresponding to formation of the silicon ingot from the intermediate ingot length to the total ingot length. During the second stage process parameter regulation may include reducing a crystal rotation rate, reducing a crucible rotation rate, and/or increasing a magnetic field strength relative to the first stage.
    Type: Application
    Filed: July 20, 2021
    Publication date: November 11, 2021
    Inventors: Gaurab Samanta, Parthiv Daggolu, Sumeet Bhagavat, Soubir Basak, Nan Zhang
  • Publication number: 20210340691
    Abstract: A crystal pulling system for growing a monocrystalline ingot from a melt of semiconductor or solar-grade material includes a crucible for containing the melt of material, a pulling mechanism configured to pull the ingot from the melt along a pull axis, and a multi-stage heat exchanger defining a central passage for receiving the ingot as the ingot is pulled by the pulling mechanism. The heat exchanger defines a plurality of cooling zones arranged vertically along the pull axis of the crystal pulling system. The plurality of cooling zones includes two enhanced-rate cooling zones and a reduced-rate cooling zone disposed vertically between the two enhanced-rate cooling zones.
    Type: Application
    Filed: July 16, 2021
    Publication date: November 4, 2021
    Inventors: Soubir Basak, Gaurab Samanta, Parthiv Daggolu, Benjamin Michael Meyer, William L. Luter, Jae Woo Ryu, Eric Michael Gitlin
  • Patent number: 11136691
    Abstract: A method for producing a silicon ingot includes withdrawing a seed crystal from a melt that includes melted silicon in a crucible that is enclosed in a vacuum chamber containing a cusped magnetic field. At least one process parameter is regulated in at least two stages, including a first stage corresponding to formation of the silicon ingot up to an intermediate ingot length, and a second stage corresponding to formation of the silicon ingot from the intermediate ingot length to the total ingot length. During the second stage process parameter regulation may include reducing a crystal rotation rate, reducing a crucible rotation rate, and/or increasing a magnetic field strength relative to the first stage.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: October 5, 2021
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Gaurab Samanta, Parthiv Daggolu, Sumeet Bhagavat, Soubir Basak, Nan Zhang
  • Patent number: 11072870
    Abstract: A crystal pulling system for growing a monocrystalline ingot from a melt of semiconductor or solar-grade material includes a crucible for containing the melt of material, a pulling mechanism configured to pull the ingot from the melt along a pull axis, and a multi-stage heat exchanger defining a central passage for receiving the ingot as the ingot is pulled by the pulling mechanism. The heat exchanger defines a plurality of cooling zones arranged vertically along the pull axis of the crystal pulling system. The plurality of cooling zones includes two enhanced-rate cooling zones and a reduced-rate cooling zone disposed vertically between the two enhanced-rate cooling zones.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: July 27, 2021
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Soubir Basak, Gaurab Samanta, Parthiv Daggolu, Benjamin Michael Meyer, William L. Luter, Jae Woo Ryu, Eric Michael Gitlin
  • Publication number: 20210071315
    Abstract: Methods for forming single crystal silicon ingots with improved resistivity control and, in particular, methods that involve gallium or indium doping are disclosed. In some embodiments, the ingots are characterized by a relatively high resistivity.
    Type: Application
    Filed: October 15, 2020
    Publication date: March 11, 2021
    Inventors: Richard J. Phillips, Parthiv Daggolu, Eric Gitlin, Robert Standley, HyungMin Lee, Nan Zhang, Jae-Woo Ryu, Soubir Basak