Patents by Inventor Partrick Tandy

Partrick Tandy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of selectively adjusting surface tension of soldermask material
    Patent number: 6889430
    Abstract: A method of selectively adjusting surface tension of a soldermask material. Specifically, a method of selectively adjusting the surface tension of a soldermask material to promote adhesion of a molding compound in a ball grid array package while maintaining a low surface tension on the ball attach area to prevent bridging between the solder balls. Solder balls require a low surface tension soldermask to minimize bridging, while the molding compound requires a high surface tension to provide adequate adhesion to the surface of the soldermask. By exposing selected portions of the soldermask to an activation method, such as ultra-violet radiation, the surface tension of the soldermask can be varied such that different areas of the package exhibit different surface tensions.
    Type: Grant
    Filed: December 12, 2001
    Date of Patent: May 10, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Tongbi Jiang, Partrick Tandy
  • Selectively adjusting surface tension of soldermask material
    Patent number: 6388199
    Abstract: A method of selectively adjusting surface tension of a soldermask material. Specifically, a method of selectively adjusting the surface tension of a soldermask material to promote adhesion of a molding compound in a ball grid array package while maintaining a low surface tension on the ball attach area to prevent bridging between the solder balls. Solder balls require a low surface tension soldermask to minimize bridging, while the molding compound requires a high surface tension to provide adequate adhesion to the surface of the soldermask. By exposing selected portions of the soldermask to an activation method, such as ultra-violet radiation, the surface tension of the soldermask can be varied such that different areas of the package exhibit different surface tensions.
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: May 14, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Tongbi Jiang, Partrick Tandy
  • Method of selectively adjusting surface tension of soldermask material
    Publication number: 20020043397
    Abstract: A method of selectively adjusting surface tension of a soldermask material. Specifically, a method of selectively adjusting the surface tension of a soldermask material to promote adhesion of a molding compound in a ball grid array package while maintaining a low surface tension on the ball attach area to prevent bridging between the solder balls. Solder balls require a low surface tension soldermask to minimize bridging, while the molding compound requires a high surface tension to provide adequate adhesion to the surface of the soldermask. By exposing selected portions of the soldermask to an activation method, such as ultra-violet radiation, the surface tension of the soldermask can be varied such that different areas of the package exhibit different surface tensions.
    Type: Application
    Filed: December 12, 2001
    Publication date: April 18, 2002
    Inventors: Tongbi Jiang, Partrick Tandy