Patents by Inventor Parul Edward Humpal

Parul Edward Humpal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for precise molding and alignment of structures on a substrate using a stretchable mold
    Patent number: 6247986
    Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
    Type: Grant
    Filed: December 23, 1998
    Date of Patent: June 19, 2001
    Assignee: 3M Innovative Properties Company
    Inventors: Raymond C. Chiu, Timothy Lee Hoopman, Parul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon