Abstract: A process for adhesively bonding at least two substrates includes the application to the at least two substrates of an uncured adhesive formulation. The uncured adhesive formulation includes at least two curable resin components of epoxy novolac resin, bisphenol A-epichlorohydrin epoxy, or 4,4?-Isopropylidenediphenol, oligomeric reaction products with 1-chloro-2,3-epoxypropane in a total amount of at least 60 total weight percent. An epoxy curing agent is also present in the formulation. The uncured adhesive formulation cures at an elevated onset temperature of at least 140° C. to adhesively bonding the at least two substrates. The adhesive formulation is also provided with a cure accelerator. An assembly is provided that includes a first substrate of nylon or carbon fiber filled polymer and a second substrate of nylon or carbon fiber filled polymer. A layer of the cured adhesive formulation is present in simultaneous contact with the first substrate and the second substrate.