Patents by Inventor Pascal Berar

Pascal Berar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing composition and process
    Patent number: 9676966
    Abstract: To provide a polishing slurry composition which effectively reduces the occurrence of scratches, and a method of polishing which reduces the occurrence of scratches while realizing an economical polishing step. The aforementioned object is attained by using a polishing slurry composition for polishing a semiconductor substrate containing a metal oxide particle, at least one water-soluble organic polymer and water, said slurry composition characterized in that, when a test substrate having a metal film, a shallow trench isolation film or dielectric film is polished by varying a rate of a polishing pad equipped in a polishing apparatus under a constant polishing pressure to achieve a maximum polishing rate.
    Type: Grant
    Filed: November 13, 2003
    Date of Patent: June 13, 2017
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Haruki Nojo, Akitoshi Yoshida, Hirofumi Kashihara, Pascal Berar
  • Chemical mechanical polishing composition and process
    Publication number: 20090197412
    Abstract: To provide a polishing slurry composition which effectively reduces the occurrence of scratches, and a method of polishing which reduces the occurrence of scratches while realizing an economical polishing step. The aforementioned object is attained by using a polishing slurry composition for polishing a semiconductor substrate containing a metal oxide particle, at least one water-soluble organic polymer and water, said slurry composition characterized in that, when a test substrate having a metal film, a shallow trench isolation film or dielectric film is polished by varying a rate of a polishing pad equipped in a polishing apparatus under a constant polishing pressure to achieve a maximum polishing rate.
    Type: Application
    Filed: November 13, 2003
    Publication date: August 6, 2009
    Inventors: Haruki Nojo, Akitoshi Yoshida, Hirofumi Kashihara, Pascal Berar
  • Cerium oxide slurry, and method of manufacturing substrate
    Patent number: 6827752
    Abstract: A problem to be solved is to provide a slurry that is capable of flattening an uneven film on a substrate with good precision, and that has good stability, not separating into two layers, solidifying through flocculated settling or undergoing changes in viscosity. This problem is solved by adding poly ammonium acrylates having different degrees of neutralization to one another as surfactants to a cerium oxide slurry containing cerium oxide particles, and suitably adjusting the total amount of polyacrylates added.
    Type: Grant
    Filed: March 12, 2003
    Date of Patent: December 7, 2004
    Assignee: EKC Technology K.K.
    Inventors: Haruki Nojo, Akitoshi Yoshida, Pascal Berar
  • Cerium oxide slurry, and method of manufacturing substrate
    Publication number: 20030182868
    Abstract: A problem to be solved is to provide a slurry that is capable of flattening an uneven film on a substrate with good precision, and that has good stability, not separating into two layers, solidifying through flocculated settling or undergoing changes in viscosity. This problem is solved by adding poly ammonium acrylates having different degrees of neutralization to one another as surfactants to a cerium oxide slurry containing cerium oxide particles, and suitably adjusting the total amount of polyacrylates added.
    Type: Application
    Filed: March 12, 2003
    Publication date: October 2, 2003
    Inventors: Haruki Nojo, Akitoshi Yoshida, Pascal Berar