Abstract: The present invention relates to a process for depositing a thin film of a metal alloy on a substrate, said film comprising at least four components and said alloy being either: an amorphous alloy containing 50 at % of the elements Ti and Zr, or a high-entropy alloy, the elements of which are chosen from the group consisting of Al, Co, Cr, Cu, Fe, Ni, Si, Mn, Mo, V, Zr and Ti; by simultaneous magnetron sputtering of at least two targets. The present invention also relates to a metal alloy in the form of a thin film comprising at least four components, which can be deposited on a substrate by implementing the process.