Patents by Inventor Pascal C. H. Meier

Pascal C. H. Meier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7371966
    Abstract: A method and apparatus, in some embodiments the apparatus includes a flex cable terminating at a first end and a second end and having a plurality of conductors therein, and a repeater circuit disposed between the first end and the second end and connected to at least one of the plurality of conductors to re-transmit a signal transmitted on the at least one of the plurality of conductors.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: May 13, 2008
    Assignee: Intel Corporation
    Inventors: Pascal C. H. Meier, Muraleedhara Navada, Sanjay Dabral
  • Patent number: 7148428
    Abstract: A system and method are disclosed in which flex cables are affixed to PCBs, for providing high-speed signaling paths between ICs disposed upon the PCBs. The flex cables are fixably attached to the PCBs so as to substantially mimic their structural orientation. Where the configuration includes more than one PCB, the flex cables include multiple portions which are temporarily separable from one another and from the die, using flex-to-flex and flex-to-package connectors, allowing field maintenance of the configuration. By routing the high-speed signals between ICs onto the flex cable, single-layer PCBs can be used for non-critical and power delivery signals, at substantial cost savings. By disposing the flex cables onto the PCB rather than allowing the cables to float freely, the configuration is thermally managed as if the signals were on the PCB and cable routing problems are avoided.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: December 12, 2006
    Assignee: Intel Corporation
    Inventors: Pascal C. H. Meier, Sanjay Dabral