Patents by Inventor Pascal C. Meier

Pascal C. Meier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Technique for blind-mating daughtercard to mainboard
    Patent number: 7402048
    Abstract: An apparatus includes a printed circuit board (PCB) and a first flexible conductive cable (“flex cable”) secured to the PCB. The apparatus also includes a daughter card having an end adjacent to the PCB and a second flex cable secured to the daughter card. The apparatus further includes a connector which provides an electrically conductive connection between the first flex cable and the second flex cable. The connector is positioned to sandwich a portion of the first flex cable between the connector and the PCB.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: July 22, 2008
    Assignee: Intel Corporation
    Inventors: Pascal C. Meier, Michael W. Leddige, Mohiuddin Mazumder, Mark Trobough, Alok Tripathi, Ven R. Holalkere
  • Technique for blind-mating daughtercard to mainboard
    Publication number: 20070238322
    Abstract: An apparatus includes a printed circuit board (PCB) and a first flexible conductive cable (“flex cable”) secured to the PCB. The apparatus also includes a daughtercard having an end adjacent to the PCB and a second flex cable secured to the daughter card. The apparatus further includes a connector which provides an electrically conductive connection between the first flex cable and the second flex cable. The connector is positioned to sandwich a portion of the first flex cable between the connector and the PCB.
    Type: Application
    Filed: March 30, 2006
    Publication date: October 11, 2007
    Inventors: Pascal C. Meier, Michael W. Leddige, Mohiuddin Mazumder, Mark Trobough, Alok Tripathi, Ven R. Holalkere