Patents by Inventor Pascal Champagne

Pascal Champagne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PROCESSES FOR THE ALKALIATION OR RE-ALKALIATION OF AN ELECTRODE ACTIVE MATERIAL
    Publication number: 20220393146
    Abstract: Processes are described for the direct or indirect electrochemical alkaliation of an alkali metal deficient electrochemically active material. The processes include an electrolysis step either during the alkaliation of the alkali metal deficient electrochemically active material on an electrode current collector (direct) or during the regeneration of a reducing agent used for the alkaliation of the electrochemically active material (indirect).
    Type: Application
    Filed: November 13, 2020
    Publication date: December 8, 2022
    Applicant: HYDRO-QUÉBEC
    Inventors: Kamyab AMOUZEGAR, François LAROUCHE, Pascal CHAMPAGNE, Georges HOULACHI, Patrick BOUCHARD, Karim ZAGHIB
  • Component package for maintaining safe operating temperature of components
    Patent number: 8604361
    Abstract: A thermally insulated electronic component package and an instrument suitable for process conditions in a high temperature environment are disclosed. The component package includes a thin electronic component, a thermally insulating outer enclosure, and an insert made of a thermally insulating material that is sized and shaped to fit within the outer enclosure. The insert includes an inner cavity sized and shaped to receive the thin electronic component. In the instrument, the outer enclosure can be configured to mount to a substrate.
    Type: Grant
    Filed: January 20, 2010
    Date of Patent: December 10, 2013
    Assignee: KLA-Tencor Corporation
    Inventors: Mei Sun, Pascal Champagne
  • COMPONENT PACKAGE FOR MAINTAINING SAFE OPERATING TEMPERATURE OF COMPONENTS
    Publication number: 20100155098
    Abstract: A thermally insulated electronic component package and an instrument suitable for process conditions in a high temperature environment are disclosed. The component package includes a thin electronic component, a thermally insulating outer enclosure, and an insert made of a thermally insulating material that is sized and shaped to fit within the outer enclosure. The insert includes an inner cavity sized and shaped to receive the thin electronic component. In the instrument, the outer enclosure can be configured to mount to a substrate.
    Type: Application
    Filed: January 20, 2010
    Publication date: June 24, 2010
    Applicant: KLA-Tencor Corporation
    Inventors: Mei Sun, Pascal Champagne