Patents by Inventor Pascal Champagne

Pascal Champagne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FORMING A TREATED SWITCHABLE POLYMER AND USE THEREOF IN A FORWARD OSMOSIS SYSTEM
    Publication number: 20210323844
    Abstract: A forward osmosis system is disclosed which use a polymer switchable between a neutral form and an ionized form. The switchable polymer has a higher osmotic pressure at the ionized form than the neutral form, the ratio between the former and the latter is ?2. There is also disclosed a method for treating the polymer such that the ratio is improved. Use of polymers for forward osmosis is also disclosed.
    Type: Application
    Filed: August 23, 2019
    Publication date: October 21, 2021
    Applicants: Queen's University at Kingston, Forward Water Technologies
    Inventors: Philip G. Jessop, Michael Cunningham, Pascale Champagne, Sarah Ellis, Ryan Dykeman, Charles Honeyman, Amy Holland, Tobias Robert, Bhanu Mudraboyina
  • Component package for maintaining safe operating temperature of components
    Patent number: 8604361
    Abstract: A thermally insulated electronic component package and an instrument suitable for process conditions in a high temperature environment are disclosed. The component package includes a thin electronic component, a thermally insulating outer enclosure, and an insert made of a thermally insulating material that is sized and shaped to fit within the outer enclosure. The insert includes an inner cavity sized and shaped to receive the thin electronic component. In the instrument, the outer enclosure can be configured to mount to a substrate.
    Type: Grant
    Filed: January 20, 2010
    Date of Patent: December 10, 2013
    Assignee: KLA-Tencor Corporation
    Inventors: Mei Sun, Pascal Champagne
  • COMPONENT PACKAGE FOR MAINTAINING SAFE OPERATING TEMPERATURE OF COMPONENTS
    Publication number: 20100155098
    Abstract: A thermally insulated electronic component package and an instrument suitable for process conditions in a high temperature environment are disclosed. The component package includes a thin electronic component, a thermally insulating outer enclosure, and an insert made of a thermally insulating material that is sized and shaped to fit within the outer enclosure. The insert includes an inner cavity sized and shaped to receive the thin electronic component. In the instrument, the outer enclosure can be configured to mount to a substrate.
    Type: Application
    Filed: January 20, 2010
    Publication date: June 24, 2010
    Applicant: KLA-Tencor Corporation
    Inventors: Mei Sun, Pascal Champagne